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Contents

README

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NCP1200D60R2G

onsemi · AC-DC Controllers & Regulators · SOIC-8

NCP1200D60R2G from onsemi, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Adj input Adjusts the skip-cycle level; the default skip mode level is 1.4 V (1.1 V to 1.6 V) and pin 1 has a 25 kΩ internal output impedance.
2 FB input Sets the peak current setpoint through an optocoupler connection, with an internal pullup resistor of 8.0 kΩ typical.
3 CS input Senses the primary current and routes it through the leading edge blanking to the internal comparator, with a maximum internal current setpoint of 0.9 V typical (0.8 V to 1.0 V).
4 GND power_in The IC ground pin.
5 Drv output Drives the external MOSFET gate, with 67 ns typical rise time and 28 ns typical fall time at a 1 nF load.
6 VCC power_in Supplies the IC and is connected to an external bulk capacitor of typically 10 µF; the current source turns off at 11.4 V typical and on at 9.8 V typical.
7 NC unconnected No connection; this un-connected pin ensures adequate creepage distance.
8 HV power_in Connected to the high-voltage rail, it injects a constant current into the VCC bulk capacitor, with a minimum operating voltage of 30 V.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOIC-8
Category Power Management ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VCC Increasing Level at Which the Current Source Turns-off VCCOFF 10.3 11.4 12.5 V 4
VCC Decreasing Level at Which the Current Source Turns-on VCCON 8.8 9.8 11 V 4
VCC Decreasing Level at Which the Latchoff Phase Ends VCClatch 6.3 V 4
Internal IC Consumption, No Output Load on Pin 5 ICC1 710 880 A No output load on pin 5; Note 1 (max value at TJ = -25°C) 4
Internal IC Consumption, 1 nF Output Load on Pin 5, FSW = 60 kHz ICC2 1.4 1.6 mA 1 nF output load on pin 5, FSW = 60 kHz; Note 2 (max value at TJ = 25°C) 4
Internal IC Consumption, Latchoff Phase ICC3 350 A 4
High-voltage Current Source, VCC = 10 V IC1 2.8 4 mA VCC = 10 V 4
High-voltage Current Source, VCC = 0 V IC2 4.9 mA VCC = 0 V 4
Output Voltage Rise-time Tr 67 ns CL = 1 nF, 10-90% of output signal 4
Output Voltage Fall-time Tf 28 ns CL = 1 nF, 10-90% of output signal 4
Source Resistance ROH 27 40 61 drive = 0, Vgate = VCCHMAX - 1 V 4
Sink Resistance ROL 5 12 25 drive = 11 V, Vgate = 1 V 4
Input Bias Current @ 1 V Input Level on Pin 3 IIB 0.02 A 1 V input level on pin 3 4
Maximum internal Current Setpoint ILimit 0.8 0.9 1 V 4
Default Internal Current Setpoint for Skip Cycle Operation ILskip 350 mV 4
Propagation Delay from Current Detection to Gate OFF State TDEL 100 160 ns 4
Leading Edge Blanking Duration TLEB 230 ns 4
Oscillation Frequency, 60 kHz Version fOSC 52 61 70 kHz VCC = 11 V, pin 5 loaded by 1 k 4
Built-in Frequency Jittering, FSW = 60 kHz fjitter 450 Hz/V 4
Maximum Duty Cycle Dmax 74 80 87 % 4
Internal Pullup Resistor Rup 8 k VCC = 11 V, pin 5 loaded by 1 k 4
Pin 3 to Current Setpoint Division Ratio Iratio 4 VCC = 11 V, pin 5 loaded by 1 k 4
Default skip mode level Vskip 1.1 1.4 1.6 V 4
Pin 1 internal output impedance Zout 25 k 4
Power Supply Voltage VCC 16 V 3
ESD Capability, HBM Model (All Pins except VCC and HV) 2 kV HBM model, all pins except VCC and HV 3
ESD Capability, Machine Model 200 V Machine model 3
Maximum Voltage on Pin 8 (HV), Pin 6 (VCC) Grounded 450 V Pin 6 (VCC) grounded 3
Maximum Voltage on Pin 8 (HV), Pin 6 (VCC) Decoupled to Ground with 10 F 500 V Pin 6 (VCC) decoupled to ground with 10 F 3
Minimum Operating Voltage on Pin 8 (HV) 30 V 3
Storage Temperature Range Tstg -60 150 °C 3
Maximum Junction Temperature TJmax 150 °C 3
Typical Temperature Shutdown 140 °C 3
Thermal Resistance Junction-to-Air, SOIC version RJA 178 °C/W SOIC version 3
Thermal Resistance Junction-to-Case RJC 57 °C/W 3

CAD (KiCad official)

  • Symbol: NCP1200D60R2G
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: ncp1200d60r2g-etched.step / ncp1200d60r2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncp1200d60r2g.step / ncp1200d60r2g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (16 pp, sha256 d010e77cc625c1a1, retrieved 2026-10-27, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus off (skipped (clean text read)), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF