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SN75176BM

Public Made by Adom

by adom

HGSEMI RS-485 / RS-422 ICs, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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SN75176BM

HGSEMI · RS-485 / RS-422 ICs · SOP-8

SN75176BM from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: when /RE is low, RO is high if A - B ≥ -50mV and low if A - B ≤ -200mV.
2 /RE input Receiver output enable: driving /RE low enables RO, and RO is high impedance when /RE is high; driving /RE high and DE low puts the device into low-power shutdown mode.
3 DE input Driver output enable: driving DE high enables the driver outputs, which are high impedance when DE is low; driving /RE high and DE low puts the device into low-power shutdown mode.
4 DI input Driver input: with DE high, a low on DI forces the noninverting output low and the inverting output high.
5 GND power_in Ground reference for the device.
6 A bidirectional Noninverting receiver input and noninverting driver output; the receiver input resistance is specified for -7V ≤ VCM ≤ 12V.
7 B bidirectional Inverting receiver input and inverting driver output; the receiver input resistance is specified for -7V ≤ VCM ≤ 12V.
8 VCC power_in Positive supply; the absolute maximum supply voltage is +7V.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Interface
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VCC 7 V 3
Control Input Voltage (/RE, DE) -0.3 V 3
Driver Input Voltage (DI) -0.3 V 3
Driver Output Voltage (A,B) -13 13 V 3
Receiver Input Voltage (A,B) -13 13 V 3
Receiver Output Voltage (RO) -0.3 V 3
Operating Temperature (SN75176B) TOPR 0 70 ℃ 3
Storage Temperature TSTG -65 150 ℃ 3
Lead Temperature (Soldering, 10 seconds) 260 ℃ Soldering, 10 seconds 3
Differential Driver Output VOD2 1.8 V 4
Change in Magnitude of Differential Output Voltage ΔVOD 0.2 V 4
Driver Common-Mode Output Voltage VOC 1 3 V 4
Change in Magnitude of Common-Mode Voltage ΔVOC 0.2 V 4
Input High Voltage VIH 2 V DE, DI, /RE 4
Input Low Voltage VIL 0.8 V DE, DI, /RE 4
Driver Input Current (A and B) IIN1 150 µA VIN=12V DE=0V, Vcc=0V/5.25V 4
Driver Input Current (A and B) IIN1 -150 µA VIN=-7V 4
Driver Short-Circuit Output Current IOSD -100 100 mA A and B Short-Circuit 4
Receiver Differential Threshold Voltage VTH -200 -125 -50 mV -7V≤VCM≤12V 4
Receiver Output Low Voltage VOL 0.4 V IO=4mA, VID=-200mV 4
Three-State Output Current at Receiver IOZR -1 1 µA 0.4V≤Vo≤2.4V 4
Receiver Input Resistance RIN 96 KΩ -7V≤VCM≤12V 4
Receiver Output Short-Circuit Current IOSR -7 100 mA 0V≤VRO≤VCC 4
Supply Current (DE=VCC) ICC 450 900 µA DE=VCC No Load /RE=DI=VCC/GND 4
Supply Current (DE=GND) ICC 450 600 µA DE=GND 4
Supply Current in Shutdown Mode ISHDN 10 µA DE=GND, /RE=VCC, DI=VCC/GND 4
Driver Input to Output tDPLH 30 60 ns Figure 3 and 5, RDIFF=54Ω, CL1=CL2=100pF 5
Driver Output Skew tDSKEW 20 ns 5
Driver Rise or Fall Time tDR, tDF 30 ns 5
Maximum Data Rate FMAX 10 Mbps 5
Driver Enable to Output High tDZH 70 ns Figure 4 and 6, CL=100pF S2 closed 5
Driver Disable Time from High tDHZ 70 ns 5
Driver Enable to Output Low tDZL 70 ns Figure 4 and 6, CL=100pF S1 closed 5
Driver Disable Time from Low tDLZ 70 ns 5
Receiver Input to Output tRPLH, tRPHL 90 250 ns Figure 7 and 9, /VID/ ≥ 2.0V, rise and fall time of VID≦15ns 5
Receiver Enable to Output Low tRZL 30 70 ns Figure 2 and 8, CRL=15pF S1 closed 5
Receiver Disable Time from Low tRLZ 30 70 ns 5
Receiver Enable to Output High tRZH 30 70 ns Figure 2 and 8, CRL=15pF S2 closed 5
Receiver Disable Time from High tRHZ 30 70 ns 5
Time to Shutdown tSHDN 200 600 ns 5
Receiver Differential Skew tRSKD 30 ns 5
Receiver Input Hysteresis ΔVTH 40 mV 4
DI Input Hysteresis VHYS 100 mV 4

CAD (KiCad official)

  • Symbol: SN75176BM
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: sn75176bm-etched.step / sn75176bm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sn75176bm.step / sn75176bm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (11 pp, sha256 7d4bdeed8f8cd636, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF