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Contents

README

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H7650-30PR

Shanghai Siproin Microelectronics · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-89-3

H7650-30PR from Shanghai Siproin Microelectronics, in a SOT-89-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VSS power_in Ground pin of the regulator (VSS), reference for the input and output voltages.
2 VIN power_in Supply input; absolute maximum supply voltage is -0.3V to 9V, recommended input capacitor CIN=1uF.
3 VOUT power_out Regulated output (3.0V for the -30 option, ±2% accuracy) delivering 750mA typ. at Vin-Vout=1V, with recommended COUT of 1uF tantalum or 6.8uF ceramic.

Key specifications

Parameter Value
Manufacturer Shanghai Siproin Microelectronics
Package SOT-89-3
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output voltage accuracy (tolerance) -2 2 % 1
Supply Voltage -0.3 9 V 2
Operating Temperature -40 85 ℃ 2
Storage Temperature -40 125 ℃ 2
Line Regulation ΔVOUT/(ΔVIN·VOUT) 0.05 0.2 %/V 1.6V≤Vin≤8V, Iout=100mA 3
Load Regulation ΔVOUT/ΔIOUT 12 30 mV Vin=Vout+1V, 1.0mA≤Iout≤100mA 3
Low dropout (Vout 2.0 < Vout ≤ 3.0 band, applies to 3.0V) VDROP 0.05 0.08 V 2.0 < Vout ≤ 3.0, Iout=80 mA 3
Output voltage temperature coefficient △Vout/(Ta·Vout) -100 100 Ppm/℃ Iout=30mA, 0℃≤Ta≤70℃ 3
Input Voltage Vin 10 V 3
Supply Current Iss1 25 35 uA 3
Output Current IOUT 750 mA Vin-Vout=1V 3
PSRR PSRR 70 dB F=1KHz, Vin=Vout+1V 3
Thermal shutdown detection temperature TSD 160 ℃ Junction temperature 3
Thermal shutdown release temperature TSR 140 ℃ Junction temperature 3

CAD (KiCad official)

  • Symbol: H7650-30PR
  • Footprint: Package_TO_SOT_SMD:SOT-89-3
  • 3D model: SOT-89-3 (KiCad packages3D, STEP)
  • 3D model files: h7650-30pr-etched.step / h7650-30pr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); h7650-30pr.step / h7650-30pr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Siproin Microelectronics datasheet (7 pp, sha256 2363f11ce49fd71c, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF