component
2SJ168-VB
Public Made by Adomby adom
VBsemi Elec MOSFETs, SOT-23(TO-236). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
Open in new tab ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Symbol & Footprint
Schematic Symbol
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
PCB Footprint
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
Datasheet
Open in new tab ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
README
markdown2SJ168-VB
VBsemi Elec · MOSFETs · SOT-23(TO-236)
2SJ168-VB from VBsemi Elec, in a SOT-23(TO-236). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate of the P-channel MOSFET; gate-source voltage is rated ±20 V (VGS) and gate threshold is -1 V to -3 V. |
| 2 | S | passive | Source of the P-channel MOSFET; body diode forward voltage VSD is -1.4 V max at IS = -100 mA, VGS = 0 V. |
| 3 | D | passive | Drain of the P-channel MOSFET; drain-source voltage is -60 V with continuous drain current of -500 mA at TA = 25 °C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | SOT-23(TO-236) |
| Category | Transistors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | -60 | V | 1 | |||
| Gate-Source Voltage | VGS | -20 | 20 | V | 1 | ||
| Continuous Drain Current TA = 25 °C | ID | -500 | mA | TA = 25 °C | 1 | ||
| Continuous Drain Current TA = 100 °C | ID | -350 | mA | TA = 100 °C | 1 | ||
| Pulsed Drain Current | IDM | -1500 | mA | 1 | |||
| Power Dissipation TA = 25 °C | PD | 460 | mW | TA = 25 °C | 1 | ||
| Power Dissipation TA = 100 °C | PD | 240 | mW | TA = 100 °C | 1 | ||
| Maximum Junction-to-Ambient | RthJA | 350 | °C/W | 1 | |||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | 150 | °C | 1 | ||
| Drain-Source Breakdown Voltage | VDS | -60 | V | VGS = 0 V, ID = - 10 µA | 2 | ||
| Gate-Threshold Voltage | VGS(th) | -1 | -3 | V | VDS = VGS, ID = - 250 µA | 2 | |
| Gate-Body Leakage | IGSS | -10 | 10 | µA | VDS = 0 V, VGS = ± 20 V | 2 | |
| Gate-Body Leakage | IGSS | -200 | 200 | nA | VDS = 0 V, VGS = ± 10 V | 2 | |
| Gate-Body Leakage TJ = 85 °C | IGSS | -500 | 500 | nA | VDS = 0 V, VGS = ± 10 V, TJ = 85 °C | 2 | |
| Gate-Body Leakage | IGSS | -100 | 100 | nA | VDS = 0 V, VGS = ± 5 V | 2 | |
| Zero Gate Voltage Drain Current | IDSS | -25 | nA | VDS = - 60 V, VGS = 0 V | 2 | ||
| Zero Gate Voltage Drain Current TJ = 85 °C | IDSS | -250 | nA | VDS = - 60 V, VGS = 0 V, TJ = 85 °C | 2 | ||
| On-State Drain Current | ID(on) | -50 | mA | VGS = - 10 V, VDS = - 4.5 V | 2 | ||
| On-State Drain Current | ID(on) | -600 | mA | VGS = - 10 V, VDS = - 10 V | 2 | ||
| Drain-Source On-Resistance | RDS(on) | 4 | Ω | VGS = - 4.5 V, ID = - 25 mA | 2 | ||
| Drain-Source On-Resistance | RDS(on) | 3 | Ω | VGS = - 10 V, ID = - 100 mA | 2 | ||
| Drain-Source On-Resistance TJ = 125 °C | RDS(on) | 9 | Ω | VGS = - 10 V, ID = - 100 mA, TJ = 125 °C | 2 | ||
| Diode Forward Voltage | VSD | -1.4 | V | IS = - 100 mA, VGS = 0 V | 2 | ||
| Forward Transconductance | gfs | 80 | mS | VDS = - 10 V, ID = - 100 mA | 2 | ||
| Total Gate Charge | Qg | 2 | nC | VDS = - 30 V, VGS = - 15 V, ID - 100 mA | 2 | ||
| Gate-Source Charge | Qgs | 1.2 | nC | VDS = - 30 V, VGS = - 15 V, ID - 100 mA | 2 | ||
| Gate-Drain Charge | Qgd | 0.8 | nC | VDS = - 30 V, VGS = - 15 V, ID - 100 mA | 2 | ||
| Input Capacitance | Ciss | 23 | pF | VDS = - 25 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Output Capacitance | Coss | 10 | pF | VDS = - 25 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Reverse Transfer Capacitance | Crss | 5 | pF | VDS = - 25 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Turn-On Time | td(on) | 20 | ns | VDD = - 25 V, RL = 150, ID - 200 mA, VGEN = - 10 V, Rg = 10 | 2 | ||
| Turn-Off Time | td(off) | 35 | ns | VDD = - 25 V, RL = 150, ID - 200 mA, VGEN = - 10 V, Rg = 10 | 2 |
CAD (KiCad official)
- Symbol:
2SJ168-VB - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23(TO-236) (KiCad packages3D, STEP)
- 3D model files:
2sj168-vb-etched.step/2sj168-vb-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);2sj168-vb.step/2sj168-vb.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: VBsemi Elec datasheet (7 pp, sha256
c18e2ecc39d0722f, retrieved 2026-10-30, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).