component
SWF2N70D
Public Made by Adomby adom
Samwin MOSFETs, TO-220F. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownSWF2N70D
Samwin · MOSFETs · TO-220F
SWF2N70D from Samwin, in a TO-220F. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Gate | input | Gate terminal of the N-channel enhancement MOSFET, with gate-to-source voltage rated at ±30 V. |
| 2 | Drain | passive | Drain terminal, rated for 700 V drain-to-source voltage and 2 A continuous drain current at TC=25°C. |
| 3 | Source | passive | Source terminal, which forms the integral reverse p-n junction body diode with the drain, rated 2 A continuous source current. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Samwin |
| Package | TO-220F |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain to source breakdown voltage | BVDSS | 700 | V | VGS=0V, ID=250uA | 2 | ||
| Drain to source leakage current | IDSS | 1 | uA | VDS=700V, VGS=0V | 2 | ||
| Drain to source leakage current | IDSS | 50 | uA | VDS=560V, TC=125oC | 2 | ||
| Gate to source leakage current, forward | IGSS | 100 | nA | VGS=30V, VDS=0V | 2 | ||
| Gate to source leakage current, reverse | IGSS | -100 | nA | VGS=-30V, VDS=0V | 2 | ||
| Gate threshold voltage | VGS(TH) | 2.5 | 4.5 | V | VDS=VGS, ID=250uA | 2 | |
| Drain to source on state resistance | RDS(ON) | 5 | 6.2 | Ω | VGS=10V, ID=1A | 2 | |
| Forward transconductance | Gfs | 1.9 | S | VDS=30V, ID=1A | 2 | ||
| Input capacitance | Ciss | 360 | pF | VGS=0V, VDS=25V, f=1MHz | 2 | ||
| Output capacitance | Coss | 42 | pF | VGS=0V, VDS=25V, f=1MHz | 2 | ||
| Reverse transfer capacitance | Crss | 13 | pF | VGS=0V, VDS=25V, f=1MHz | 2 | ||
| Turn on delay time | td(on) | 7 | ns | VDS=350V, ID=2A, RG=25Ω, VGS=10V (note 4,5) | 2 | ||
| Rising time | tr | 22 | ns | VDS=350V, ID=2A, RG=25Ω, VGS=10V (note 4,5) | 2 | ||
| Turn off delay time | td(off) | 26 | ns | VDS=350V, ID=2A, RG=25Ω, VGS=10V (note 4,5) | 2 | ||
| Fall time | tf | 24 | ns | VDS=350V, ID=2A, RG=25Ω, VGS=10V (note 4,5) | 2 | ||
| Total gate charge | Qg | 11 | nC | VDS=560V, VGS=10V, ID=2A (note 4,5) | 2 | ||
| Gate-source charge | Qgs | 2 | nC | VDS=560V, VGS=10V, ID=2A (note 4,5) | 2 | ||
| Gate-drain charge | Qgd | 5.5 | nC | VDS=560V, VGS=10V, ID=2A (note 4,5) | 2 | ||
| Gate resistance | Rg | 3.5 | Ω | VDS=0V, Scan F mode | 2 | ||
| Continuous source current | IS | 2 | A | Integral reverse p-n junction diode in the MOSFET | 2 | ||
| Pulsed source current | ISM | 8 | A | 2 | |||
| Diode forward voltage drop | VSD | 1.4 | V | IS=2A, VGS=0V | 2 | ||
| Reverse recovery time | trr | 260 | ns | IS=2A, VGS=0V, dIF/dt=100A/us | 2 | ||
| Reverse recovery charge | Qrr | 1.3 | uC | IS=2A, VGS=0V, dIF/dt=100A/us | 2 | ||
| Drain to source voltage | VDSS | 700 | V | 1 | |||
| Continuous drain current (@TC=25oC) | ID | 2 | A | @TC=25oC; drain current limited by junction temperature | 1 | ||
| Continuous drain current (@TC=100oC) | ID | 1.2 | A | @TC=100oC; drain current limited by junction temperature | 1 | ||
| Drain current pulsed | IDM | 8 | A | note 1 | 1 | ||
| Gate to source voltage | VGS | -30 | 30 | V | 1 | ||
| Single pulsed avalanche energy | EAS | 50 | mJ | note 2 | 1 | ||
| Repetitive avalanche energy | EAR | 5 | mJ | note 1 | 1 | ||
| Peak diode recovery dv/dt | dv/dt | 5 | V/ns | note 3 | 1 | ||
| Total power dissipation (TO-220F) | PD | 18.1 | W | @TC=25oC | 1 | ||
| Derating factor above 25oC (TO-220F) | PD | 0.14 | W/oC | above 25oC | 1 | ||
| Operating junction and storage temperature | TSTG, TJ | -55 | 150 | oC | 1 | ||
| Maximum lead temperature for soldering | TL | 300 | oC | 1/8 from case for 5 seconds | 1 | ||
| Thermal resistance, junction to case (TO-220F) | Rthjc | 6.9 | oC/W | 1 | |||
| Thermal resistance, junction to ambient (TO-220F) | Rthja | 53 | oC/W | 1 |
CAD (KiCad official)
- Symbol:
SWF2N70D - Footprint:
Package_TO_SOT_THT:TO-220F-3_Vertical - 3D model: TO-220F (KiCad packages3D, STEP)
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Samwin datasheet (7 pp, sha256
e4f020f512cf3275, retrieved 2026-10-27, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).