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Contents

README

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LT8302IS8E#WTRPBF

Analog Devices · DC-DC Converters · SOIC-8-EP

LT8302IS8E#WTRPBF from Analog Devices, in a SOIC-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 EN/UVLO input Enable and undervoltage lockout input: pulling it below 0.3V shuts the device down, its accurate 1.214V threshold can program a VIN UVLO via a resistor divider with a 2.5µA hysteresis current, and it must be tied directly to VIN if unused.
2 INTVCC power_out Internal 3V linear regulator output that powers the control circuitry and gate driver, must not be overdriven by an external supply, and needs a minimum 1µF ceramic bypass to GND.
3 VIN power_in Input supply pin for 3V to 42V operation that powers the internal circuitry and serves as the reference for the RFB feedback circuit, and it should be locally bypassed to GND.
4 GND power_in Ground pin, which should be connected to the ground plane together with the exposed pad.
5 SW output Drain of the internal 65V, 3.6A DMOS power switch, rated to 65V for transients, so the flyback spike must be derated below 65V and the trace area kept small to reduce EMI and voltage spikes.
6 RFB input Input for the external feedback resistor connected to the transformer primary, with the RFB-to-RREF ratio setting the output voltage, a maximum input current of 200µA, and a voltage limit of VIN − 0.5V to VIN.
7 RREF input Ground-referred reference resistor pin, where the resistor should nominally be 10kΩ and may range from 9.09kΩ to 11.0kΩ for divider ratio selection.
8 TC output Outputs a PTAT voltage of 3.35mV/K (1V at 25°C) that can estimate junction temperature, and a resistor from this pin to RREF compensates the output diode temperature coefficient.
9 GND power_in The exposed pad is GND and must be soldered directly to the PCB ground plane for both electrical and thermal contact.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package SOIC-8-EP
Category Power Management ICs
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VIN Voltage Range VIN 3 42 V Over full operating temperature range (l) 3
VIN Quiescent Current, Shutdown IQ 0.5 2 µA VEN/UVLO = 0.2V 3
VIN Quiescent Current, Sleep Mode (Switch Off) IQ 53 106 µA VEN/UVLO = 1.1V 3
VIN Quiescent Current, Active Mode (Switch On) IQ 380 µA VEN/UVLO = 1.1V 3
EN/UVLO Shutdown Threshold For Lowest Off IQ 0.2 0.75 V Lowest off IQ; over full operating temperature range (l) 3
EN/UVLO Enable Threshold Falling (E, I, H, MP Grades) 1.178 1.214 1.25 V Falling (E, I, H, MP Grades); over full operating temperature range (l) 3
EN/UVLO Hysteresis Current IHYS -0.1 0 0.1 µA VEN/UVLO = 0.3V 3
EN/UVLO Hysteresis Current IHYS 2.3 2.5 2.7 µA VEN/UVLO = 1.1V 3
INTVCC Regulation Voltage VINTVCC 2.85 3 3.1 V IINTVCC = 0mA to 10mA 3
INTVCC Current Limit IINTVCC 10 13 20 mA VINTVCC = 2.8V 3
INTVCC UVLO Threshold Falling 2.39 2.47 2.55 V Falling 3
(RFB, VIN) Voltage -50 50 mV IRFB = 75µA to 125µA 3
RREF Regulation Voltage 0.98 1 1.02 V Over full operating temperature range (l) 3
RREF Regulation Voltage Line Regulation -0.01 0 0.01 %/V 3V ≤ VIN ≤ 42V 3
TC Pin Current (LT8302) ITC 12 15 18 µA VTC = 1.2V (LT8302) 3
Minimum Switching Frequency fMIN 11.3 12 12.7 kHz 3
Maximum Switch-Off Time Backup Timer tOFF(MAX) 170 µs Backup timer 3
Maximum Switch Current Limit ISW(MAX) 3.6 4.5 5.4 A 3
Minimum Switch Current Limit ISW(MIN) 0.7 0.87 1.04 A 3
Switch Leakage Current ILKG 0.1 0.5 µA VSW = 65V 3
SW Pin Voltage (transient rating) 65 V SW pin; rated to 65V for transients 2
VIN Pin Voltage 42 V VIN 2
INTVCC, RREF, TC Pin Voltage 4 V INTVCC, RREF, TC 2
Current Into RFB 200 µA Current into RFB 2
Operating Junction Temperature Range (LT8302I) TJ -40 125 °C LT8302I, LT8302I-3 2
Storage Temperature Range TSTG -65 150 °C 2
Junction-to-Ambient Thermal Resistance θJA 33 °C/W S8E package, 8-lead plastic SO; exposed pad (pin 9) must be soldered to PCB 2

CAD (KiCad official)

  • Symbol: LT8302IS8E#WTRPBF
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
  • 3D model: SOIC-8-EP (KiCad packages3D, STEP)
  • 3D model files: lt8302is8e-wtrpbf-etched.step / lt8302is8e-wtrpbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lt8302is8e-wtrpbf.step / lt8302is8e-wtrpbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (26 pp, sha256 08515683bcc0fb0a, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF