component
IPD35N10S3L26
Public Made by Adomby adom
Infineon Technologies MOSFETs, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownIPD35N10S3L26
Infineon Technologies · MOSFETs · TO-252
IPD35N10S3L26 from Infineon Technologies, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-source voltage limited to ±20 V, with a gate threshold voltage of 1.2 V min to 2.4 V max at ID=39 µA. |
| 2 | D | passive | Drain, connected to the exposed tab; VDS up to 100 V with continuous drain current of 35 A at TC=25 °C. |
| 3 | S | passive | Source; carries the 35 A continuous and 140 A pulsed drain current, and the body diode is rated 35 A continuous. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Infineon Technologies |
| Package | TO-252 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-source breakdown voltage | V(Br)DSS | 100 | V | VGS=0V, ID=1mA | 2 | ||
| Gate threshold voltage | VGS(th) | 1.2 | 1.7 | 2.4 | V | VDS=VGS, ID=39µA | 2 |
| Zero gate voltage drain current | IDSS | 0.01 | 0.1 | µA | VDS=80V, VGS=0V, Tj=25°C | 2 | |
| Zero gate voltage drain current | IDSS | 1 | 10 | µA | VDS=80V, VGS=0V, Tj=125°C | 2 | |
| Gate-source leakage current | IGSS | 100 | nA | VGS=20V, VDS=0V | 2 | ||
| Drain-source on-state resistance | RDS(on) | 24.5 | 31.9 | mW | VGS=4.5V, ID=35A | 2 | |
| Drain-source on-state resistance | RDS(on) | 20 | 24 | mW | VGS=10 V, ID=35 A | 2 | |
| Input capacitance | Ciss | 2070 | 2700 | pF | VGS=0V, VDS=25V, f=1MHz | 3 | |
| Output capacitance | Coss | 460 | 600 | pF | VGS=0V, VDS=25V, f=1MHz | 3 | |
| Reverse transfer capacitance | Crss | 50 | 75 | pF | VGS=0V, VDS=25V, f=1MHz | 3 | |
| Gate to source charge | Qgs | 8 | 10 | nC | VDD=80V, ID=35A, VGS=0 to 10V | 3 | |
| Gate to drain charge | Qgd | 5 | 8 | nC | VDD=80V, ID=35A, VGS=0 to 10V | 3 | |
| Gate charge total | Qg | 30 | 39 | nC | VDD=80V, ID=35A, VGS=0 to 10V | 3 | |
| Diode continuous forward current | IS | 35 | A | TC=25°C | 3 | ||
| Diode pulse current | IS,pulse | 140 | A | TC=25°C | 3 | ||
| Diode forward voltage | VSD | 0.6 | 1 | 1.2 | V | VGS=0V, IF=35A, Tj=25°C | 3 |
| Thermal resistance, junction - case | RthJC | 2.1 | K/W | 2 | |||
| Thermal resistance, junction - ambient, minimal footprint | RthJA | 62 | K/W | SMD version, device on PCB, minimal footprint | 2 | ||
| Thermal resistance, junction - ambient, 6 cm2 cooling area | RthJA | 40 | K/W | SMD version, device on PCB, 6 cm2 cooling area | 2 | ||
| Continuous drain current | ID | 35 | A | TC=25°C, VGS=10V | 1 | ||
| Continuous drain current | ID | 25 | A | TC=100°C, VGS=10V | 1 | ||
| Pulsed drain current | ID,pulse | 140 | A | TC=25°C | 1 | ||
| Avalanche energy, single pulse | EAS | 175 | mJ | ID=17A | 1 | ||
| Avalanche current, single pulse | IAS | 35 | A | 1 | |||
| Gate source voltage | VGS | -20 | 20 | V | ±20 V; -5V to -20V for max. 168 non-consecutive hours | 1 | |
| Power dissipation | Ptot | 71 | W | TC=25°C | 1 | ||
| Operating and storage temperature | Tj, Tstg | -55 | 175 | °C | 1 | ||
| Turn-on delay time | td(on) | 6 | ns | VDD=20V, VGS=10V, ID=35A, RG=3.5W | 3 | ||
| Rise time | tr | 4 | ns | VDD=20V, VGS=10V, ID=35A, RG=3.5W | 3 | ||
| Turn-off delay time | td(off) | 18 | ns | VDD=20V, VGS=10V, ID=35A, RG=3.5W | 3 | ||
| Fall time | tf | 3 | ns | VDD=20V, VGS=10V, ID=35A, RG=3.5W | 3 | ||
| Gate plateau voltage | Vplateau | 3.7 | V | 3 | |||
| Reverse recovery time | trr | 79 | ns | VR=50V, IF=IS, diF/dt=100A/µs | 3 | ||
| Reverse recovery charge | Qrr | 150 | nC | VR=50V, IF=IS, diF/dt=100A/µs | 3 |
CAD (KiCad official)
- Symbol:
IPD35N10S3L26 - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files:
ipd35n10s3l26-etched.step/ipd35n10s3l26-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ipd35n10s3l26.step/ipd35n10s3l26.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Infineon Technologies datasheet (9 pp, sha256
be48dd7b04a5c5da, retrieved 2026-10-31, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).