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Contents

README

markdown

SZBZX84C8V2ET3G

onsemi · Zener Diodes · SOT-23

SZBZX84C8V2ET3G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 ANODE passive Anode of the Zener diode; the cathode is identified by the polarity band on the package.
2 NO CONNECTION unconnected No connection on this pin (datasheet pinout: 2-No Connection).
3 CATHODE passive Cathode of the Zener diode, marked by the polarity band on the package.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener voltage (VZ1 at IZT1) VZ1 7.7 8.2 8.7 V @ IZT1 = 5 mA (Note 4) 3
Zener voltage (VZ2 at IZT2) VZ2 7.6 8.7 V @ IZT2 = 1 mA (Note 4) 3
Zener voltage (VZ3 at IZT3) VZ3 7.7 8.8 V @ IZT3 = 20 mA (Note 4) 3
Maximum Zener impedance (ZZT1) ZZT1 15 Ω @ IZT1 = 5 mA 3
Maximum Zener impedance (ZZT2) ZZT2 80 Ω @ IZT2 = 1 mA 3
Maximum Zener impedance (ZZT3) ZZT3 6 Ω @ IZT3 = 20 mA 3
Maximum reverse leakage current IR 0.7 µA @ VR = 5.0 V 3
Maximum temperature coefficient of VZ VZ 3.2 6.2 mV/K @ IZT1 = 5 mA 3
Maximum capacitance C 135 pF @ VR = 0, f = 1 MHz 3
Forward voltage VF 0.9 V @ IF = 10 mA 2
Peak power dissipation Ppk 225 W @ 20 µs (Note 1), @ TL ≤ 25°C 1
Total power dissipation on FR-5 board PD 250 mW @ TA = 25°C (Note 2) 1
Total power dissipation on alumina substrate PD 300 mW @ TA = 25°C (Note 3) 1
Thermal resistance, junction-to-ambient, FR-5 board RJA 500 °C/W FR-5 board (Note 2) 1
Thermal resistance, junction-to-ambient, alumina substrate RJA 417 °C/W Alumina substrate (Note 3) 1
Junction and storage temperature range TJ, Tstg -65 150 °C 1

CAD (KiCad official)

  • Symbol: SZBZX84C8V2ET3G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: szbzx84c8v2et3g-etched.step / szbzx84c8v2et3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); szbzx84c8v2et3g.step / szbzx84c8v2et3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (8 pp, sha256 16b420bad7adbadb, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF