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PIC16LF18324-I

Public Made by Adom

by adom

Microchip Tech Microcontroller Units (MCUs/MPUs/SOCs), SOIC-14. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

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PIC16LF18324-I

Microchip Tech · Microcontroller Units (MCUs/MPUs/SOCs) · SOIC-14

PIC16LF18324-I from Microchip Tech, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD power_in Positive supply; 1.8V to 3.6V for the PIC16LF18324, and a 0.1 µF decoupling capacitor is required between VDD and VSS.
2 RA5 bidirectional General purpose I/O (RA5) shared with ANA5, T1CKI, SOSCIN/SOSCI, CLCIN3, CLKIN and OSC1.
3 RA4 bidirectional General purpose I/O (RA4) shared with ANA4, T1G, SOSCO, CLKOUT (FOSC/4) and OSC2.
4 RA3/MCLR/VPP input Input-only RA3 that also serves as Master Clear with internal weak pull-up and as the programming voltage (VPP) input.
5 RC5 bidirectional General purpose I/O (RC5) shared with ANC5, MDCIN2, T3CKI, CCP1 and RX.
6 RC4 bidirectional General purpose I/O (RC4) shared with ANC4, T3G and CLCIN1.
7 RC3 bidirectional General purpose I/O (RC3) shared with ANC3, C1IN3-, C2IN3-, MDMIN, T5G, CCP2, SS1 and CLCIN0.
8 RC2 bidirectional General purpose I/O (RC2) shared with ANC2, C1IN2-, C2IN2- and MDCIN1.
9 RC1 bidirectional General purpose I/O (RC1) shared with ANC1, C1IN1-, C2IN1-, CCP4, SDI1/SDA1 (I2C) and CLCIN2.
10 RC0 bidirectional General purpose I/O (RC0) shared with ANC0, C2IN0+, T5CKI, SCK1 and SCL1 (I2C).
11 RA2 bidirectional General purpose I/O (RA2) shared with ANA2, VREF-, DAC1REF-, T0CKI, CCP3, CWG1IN, CWG2IN and INT.
12 RA1/ICSPCLK bidirectional General purpose I/O (RA1) shared with ANA1, VREF+, C1IN0-, C2IN0-, DAC1REF+, ICDCLK and ICSPCLK (ICSP clock).
13 RA0/ICSPDAT bidirectional General purpose I/O (RA0) shared with ANA0, C1IN0+, DAC1OUT, ICDDAT and ICSPDAT (ICSP data).
14 VSS power_in Ground reference.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOIC-14
Category Single Chip Microcomputer/Microcontroller
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VDD pin voltage (PIC16LF) VDD -0.3 4 V with respect to VSS 408
MCLR pin voltage -0.3 9 V with respect to VSS 408
Voltage on all other pins -0.3 V -0.3V to (VDD + 0.3V); upper limit printed as VDD + 0.3V 408
Storage temperature -65 150 °C 408
Ambient temperature under bias -40 125 °C 408
Maximum current on VSS pin 250 mA -40°C ≤ TA ≤ +85°C 408
Maximum current on VSS pin 85 mA +85°C ≤ TA ≤ +125°C 408
Maximum current on VDD pin 250 mA -40°C ≤ TA ≤ +85°C 408
Maximum current on VDD pin 85 mA +85°C ≤ TA ≤ +125°C 408
Maximum current on any I/O pin 50 mA 408
Clamp current IK 20 mA VPIN < 0 or VPIN > VDD 408
Total power dissipation 800 mW 408
Operating supply voltage VDD 1.8 3.6 V FOSC ≤ 16 MHz 411
Operating supply voltage VDD 2.5 3.6 V FOSC > 16 MHz 411
Operating ambient temperature (Industrial) TA -40 85 °C Industrial 409
RAM data retention voltage VDR 1.5 V Device in Sleep mode 411
Power-on Reset release voltage VPOR 1.6 V BOR and LPBOR disabled 411
Power-on Reset rearm voltage VPORR 0.8 V BOR and LPBOR disabled 411
VDD rise rate for internal POR SVDD 0.05 V/ms BOR and LPBOR disabled 411
Supply current XT 4 MHz IDDXT4 309 400 uA XT = 4 MHz, 3.0V 413
Supply current HFINTOSC 16 MHz IDDHFO16 1.2 1.6 mA HFINTOSC = 16 MHz, 3.0V 413
Supply current HFINTOSC 32 MHz IDDHFOPLL 2.3 3.1 mA HFINTOSC = 32 MHz, 3.0V 413
Supply current HS+PLL 32 MHz IDDHSPLL32 2.2 2.9 mA HS+PLL = 32 MHz, 3.0V 413
Supply current IDLE mode IDDIDLE 774 1100 uA IDLE Mode, HFINTOSC = 16 MHz, 3.0V 413
Power-down current base (max +85°C) IPD 0.03 2 µA 3.0V, VREGPM = 1, Max at +85°C 414
Power-down current base (max +125°C) IPD 0.03 5.2 µA 3.0V, VREGPM = 1, Max at +125°C 414
Watchdog/LFINTOSC power-down current IPD_WDT 0.4 2.9 µA 3.0V, Max at +85°C 414
Secondary oscillator power-down current IPD_SOSC 1.3 2.8 µA 3.0V, Max at +85°C 414
Brown-out Reset power-down current IPD_BOR 10.6 16 µA 3.0V, Max at +85°C 414
Input low voltage, TTL buffer VIL 0.15 xVDD 1.8V ≤ VDD ≤ 4.5V 415
Input low voltage, Schmitt Trigger VIL 0.2 xVDD 2.0V ≤ VDD ≤ 5.5V 415
Input low voltage, I2C levels VIL 0.3 xVDD 415
Input low voltage, SMBus levels VIL 0.8 V 2.7V ≤ VDD ≤ 5.5V 415
Input low voltage, MCLR VIL 0.2 xVDD 415
Input high voltage, Schmitt Trigger VIH 0.8 xVDD 2.0V ≤ VDD ≤ 5.5V 415
Input high voltage, I2C levels VIH 0.7 xVDD 415
Input high voltage, SMBus levels VIH 2.1 V 2.7V ≤ VDD ≤ 5.5V 415
Input high voltage, MCLR VIH 0.7 xVDD 415
Input leakage current, I/O ports IIL -125 125 nA VSS ≤ VPIN ≤ VDD, Pin at high-impedance, 85°C 415
Input leakage current, I/O ports IIL -1000 1000 nA VSS ≤ VPIN ≤ VDD, Pin at high-impedance, 125°C 415
Input leakage current, MCLR IIL -200 200 nA VSS ≤ VPIN ≤ VDD, Pin at high-impedance, 85°C 415
Weak pull-up current IPUR 25 120 200 µA VDD = 3.0V, VPIN = VSS 415
Output low voltage, I/O ports VOL 0.6 V IOL = 10.0 mA, VDD = 3.0V 415
I/O pin capacitance CIO 5 50 pF All I/O pins 415
Brown-out Reset voltage VBOR 2.55 2.7 2.85 V BORV = 0 424
Brown-out Reset voltage VBOR 1.8 1.9 2.1 V BORV = 1 (PIC16LF18324/18344) 424
Brown-out Reset hysteresis VBORHYS 0 25 75 mV 424
Low-Power BOR voltage VLPBOR 1.8 2.1 2.5 V PIC16LF18324/18344 424
Watchdog Timer time-out period TWDT 10 16 27 ms 16 ms Nominal Reset Time 424
Power-up Timer period TPWRT 40 65 140 ms 424
System clock frequency FOSC 32 MHz 419
ADC integral error EIL -1 1 LSb ADCREF+ = 3.0V, ADCREF- = 0V 425
ADC offset error EOFF -2 0.5 2 LSb ADCREF+ = 3.0V, ADCREF- = 0V 425
ADC gain error EGN -2 0.2 2 LSb ADCREF+ = 3.0V, ADCREF- = 0V 425
Comparator input offset voltage VIOFF -50 50 mV VICM = VDD/2 428
FVR 1x gain accuracy VFVR1 -4 4 % VDD ≥ 2.5V, -40°C to 85°C 428
Thermal resistance junction to ambient, 14-pin SOIC θJA 95.3 °C/W 14-pin SOIC package 417
Thermal resistance junction to case, 14-pin SOIC θJC 31 °C/W 14-pin SOIC package 417
Maximum junction temperature TJMAX 150 °C 417
Power dissipation PD 0.8 W PD = PINTERNAL + PI/O 417

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PPS BODY RxyPPS 276

CAD (KiCad official)

  • Symbol: PIC16LF18324-I
  • Footprint: Package_SO:SOIC-14_3.9x8.7mm_P1.27mm
  • 3D model: SOIC-14 (KiCad packages3D, STEP)
  • 3D model files: pic16lf18324-i-etched.step / pic16lf18324-i-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pic16lf18324-i.step / pic16lf18324-i.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (489 pp, sha256 ef07a4c4e86158f1, retrieved 2026-10-27, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF