Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

BZT52-C3V6-QX

Nexperia · Zener Diodes · SOD-123

BZT52-C3V6-QX from Nexperia, in a SOD-123. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode; the marking bar on the package indicates the cathode.
2 A passive Anode of the Zener diode.

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-123
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Working voltage (Sel C, 3V6 nominal) VZ 3.4 3.8 V IZ = 5 mA; Sel C 4
Working voltage tolerance (Sel C) -5 5 % Printed as approximately ±5 % for the C series 1
Maximum differential resistance rdif 500 Ω IZ = 1 mA 4
Maximum differential resistance rdif 95 Ω IZ = 5 mA 4
Reverse current IR 5 µA VR = 1 V; Tj = 25 °C 4
Temperature coefficient SZ -3.5 0 mV/K IZ = 5 mA 4
Non-repetitive peak reverse current IZSM 6 A tp = 100 µs; Tamb = 25 °C 4
Forward voltage VF 0.9 V IF = 10 mA; pulse test tp ≤ 300 µs; δ ≤ 0.02 4
Forward current IF 250 mA 3
Non-repetitive peak reverse power dissipation PZSM 40 W tp = 100 µs; square wave; Tj = 25 °C prior to surge 3
Total power dissipation Ptot 350 mW Tamb ≤ 25 °C; FR4 PCB, standard footprint 3
Total power dissipation Ptot 590 mW Tamb ≤ 25 °C; FR4 PCB, cathode pad 1 cm² 3
Junction temperature Tj 150 °C 3
Ambient temperature Tamb -55 150 °C 3
Storage temperature Tstg -65 150 °C 3
Thermal resistance junction to ambient Rth(j-a) 350 K/W In free air; FR4 PCB, standard footprint 3
Thermal resistance junction to ambient Rth(j-a) 210 K/W FR4 PCB, cathode pad 1 cm² 3
Thermal resistance junction to solder point Rth(j-sp) 55 K/W Soldering point of cathode tab 3

CAD (KiCad official)

  • Symbol: BZT52-C3V6-QX
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123 (KiCad packages3D, STEP)
  • 3D model files: bzt52-c3v6-qx-etched.step / bzt52-c3v6-qx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzt52-c3v6-qx.step / bzt52-c3v6-qx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (12 pp, sha256 3b4b96d8d0378fe9, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF