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PIC16LF19156T-I

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Microchip Tech Microcontrollers (MCU/MPU/SOC), SSOP-28-208mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

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PIC16LF19156T-I

Microchip Tech · Microcontrollers (MCU/MPU/SOC) · SSOP-28-208mil

PIC16LF19156T-I from Microchip Tech, in a SSOP-28-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RE3/MCLR/VPP input RE3 general purpose input / MCLR master clear input with internal weak pull-up, also the VPP programming voltage pin.
2 RA0 bidirectional RA0 general purpose I/O shared with C1IN0-/C2IN0-, ANA0, CLCIN0, IOCA0 and LCD SEG0.
3 RA1 bidirectional RA1 general purpose I/O shared with C1IN1-/C2IN1-, ANA1, CLCIN1, IOCA1 and LCD SEG1.
4 RA2 bidirectional RA2 general purpose I/O shared with C1IN0+/C2IN0+, ANA2, DAC1OUT1, IOCA2 and LCD SEG2.
5 RA3 bidirectional RA3 general purpose I/O shared with C1IN1+, ANA3, VREF+ (ADC and DAC1), IOCA3 and LCD SEG3.
6 RA4 bidirectional RA4 general purpose I/O shared with ANA4, T0CKI, IOCA4, LCD SEG4 and COM3 (diagram labels it COM0).
7 RA5/VBAT bidirectional RA5 general purpose input/output shared with SS, IOCA5 and the RTCC back-up battery input VBAT.
8 VSS power_in Ground reference.
9 RA7/SEG7 bidirectional RA7 general purpose I/O shared with ANA7, LCD SEG7 and the external clock driver input CLKIN.
10 RA6/SEG6 bidirectional RA6 general purpose I/O shared with ANA6, IOCA6, LCD SEG6 and FOSC/4 digital output CLKOUT.
11 RC0 bidirectional RC0 general purpose I/O shared with T1CKI, SMTWIN1, IOCC0 and the 32.768 kHz secondary oscillator crystal output SOSCO.
12 RC1 bidirectional RC1 general purpose I/O shared with T4IN, SMTSIG1, CCP2, IOCC1 and the 32.768 kHz secondary oscillator crystal input SOSCI.
13 RC2 bidirectional RC2 general purpose I/O shared with CCP1, IOCC2, ANC2, LCD SEG18 and COM2.
14 RC3 bidirectional RC3 general purpose I/O shared with T2IN, MSSP SCL/SCK, ANC3 and LCD SEG19.
15 RC4 bidirectional RC4 general purpose I/O shared with MSSP SDA/SDI, IOCC4, ANC4 and LCD SEG20.
16 VLCD3 input LCD analog bias voltage input VLCD3.
17 RC6 bidirectional RC6 general purpose I/O shared with EUSART1 CK1/TX1, ANC6, LCD SEG22, COM5 and VLCD2.
18 RC7 bidirectional RC7 general purpose I/O shared with EUSART1 DT1/RX1, ANC7, LCD SEG23, COM4 and VLCD1.
19 VSS power_in Ground reference.
20 VDD power_in Positive supply voltage input; 1.8V to 3.6V for the PIC16LF19155/56.
21 RB0 bidirectional RB0 general purpose I/O shared with CWG1IN, C2IN1+, IOCB0, ANB0, LCD SEG8 and the zero-cross detect input ZCD.
22 RB1 bidirectional RB1 general purpose I/O with 100 mA high-current drive option, shared with C1IN3-/C2IN3-, MSSP SCL/SCK, ANB1 and LCD SEG9.
23 RB2 bidirectional RB2 general purpose I/O shared with MSSP SDA/SDI, ANB2, LCD SEG10, COM7 and charge pump capacitor pin CFLY1.
24 RB3 bidirectional RB3 general purpose I/O shared with C1IN2-/C2IN2-, ANB3, LCD SEG11, COM6 and charge pump capacitor pin CFLY2.
25 RB4 bidirectional RB4 general purpose I/O shared with ADCACT auto-conversion trigger input, IOCB4, ANB4 and LCD COM0.
26 RB5 bidirectional RB5 general purpose I/O shared with T1G, IOCB5, ANB5, LCD SEG13 and COM1.
27 RB6/ICSPCLK bidirectional RB6 general purpose I/O shared with EUSART2 CK2/TX2, CLCIN2, ANB6, LCD SEG14 and the ICSP clock input ICSPCLK.
28 RB7/ICSPDAT bidirectional RB7 general purpose I/O shared with EUSART2 DK2/RX2, CLCIN3, ANB7, LCD SEG15, DAC1OUT2 and the ICSP data pin ICSPDAT.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SSOP-28-208mil
Category Embedded Processors & Controllers
Pins 28

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Ambient temperature under bias TA -40 125 °C 667
Storage temperature TSTG -65 150 °C 667
Voltage on VDD pin with respect to VSS (PIC16(L)F) VDD -0.3 4 V PIC16(L)F19155/56/75/76/85/86 667
Voltage on MCLR pin with respect to VSS -0.3 9 V 667
Voltage on all other pins with respect to VSS -0.3 V max printed as VDD + 0.3V 667
Maximum current on VSS pin 350 mA -40°C to +85°C 667
Maximum current on VSS pin 120 mA 85°C to +125°C 667
Maximum current on VDD pin for 28-pin devices VDD 250 mA -40°C to +85°C 667
Maximum current on VDD pin for 28-pin devices VDD 85 mA 85°C to +125°C 667
Maximum current on any standard I/O pin 50 mA 667
Clamp current IK 20 mA VPIN < 0 or VPIN > VDD 667
Total power dissipation 800 mW 667
Operating supply voltage VDDMIN VDD 1.8 V FOSC ≤ 16 MHz (PIC16(L)F) 668
Operating supply voltage VDDMIN VDD 2.5 V FOSC ≤ 32 MHz (PIC16(L)F) 668
Operating supply voltage VDDMAX VDD 3.6 V PIC16(L)F19155/56/75/76/85/86 668
Operating ambient temperature range, industrial TA -40 85 °C Industrial temperature 668
RAM data retention voltage VDR 1.5 V Device in Sleep mode 670
VDD rise rate to ensure internal Power-on Reset signal SVDD 0.05 V/ms BOR or LPBOR disabled 670
Supply current IDD, HFINTOSC 16 MHz IDDHFO16 1.78 2.9 mA HFINTOSC = 16 MHz; VDD 3.0V 672
Supply current IDD, HFINTOSC 32 MHz (PLL) IDDHFOPLL 3.41 5.5 mA HFINTOSC = 32 MHz; VDD 3.0V 672
Idle mode supply current IDDIDLE 1.14 2.8 mA Idle mode, HFINTOSC = 16 MHz; VDD 3.0V 672
Doze mode supply current IDDDOZE 1.23 2.4 mA Doze mode, HFINTOSC = 16 MHz, Doze Ratio = 16; VDD 3.0V 672
VBAT current with SOSC + RTCC IBAT 1.05 4.8 µA VDD 2.5V 672
Power-down current IPD base IPD 0.35 2 µA VDD 3.0V; VREGPM = 1; max at +85°C 673
Power-down current, low-frequency internal oscillator/WDT IPD_WDT 1.1 3.3 µA VDD 3.0V; max at +85°C 673
Power-down current, secondary oscillator (SOSC) IPD_SOSC 0.6 3.2 µA VDD 3.0V; max at +85°C 673
Power-down current, FVR IPD_FVR 37 57 µA VDD 3.0V; max at +85°C 673
Power-down current, Brown-out Reset (BOR) IPD_BOR 10 16 µA VDD 3.0V; max at +85°C 673
Power-down current, Low-Power BOR (LPBOR) IPD_LPBOR 0.3 3 µA VDD 3.0V; max at +85°C 673
Power-down current, ADC active IPD_ADCA 395 547 µA VDD 3.0V; ADC converting, FRC clock; max at +85°C 673
Power-down current, ADC active with charge pump IPD_ADCA_CHGPUMP 495 602 µA VDD 3.0V; max at +85°C 673
Power-down current, Comparator C1 IPD_CMP 30 45 µA VDD 3.0V; max at +85°C 673
Power-down current, LP Comparator C2 IPD_CMP_LP 1.3 2.64 µA VDD 3.0V; max at +85°C; excludes supporting clock 673
Power-down current, 3V pump output IPD_LCD_PUMP_3V 2.8 6.5 µA VDD 2.5V; max at +85°C 673
Input Low Voltage, SMBus levels VIL 0.8 V D304; 2.7V to 5.5V 674
Input High Voltage, SMBus levels VIH 2.1 V D324; 2.7V to 5.5V 674
Input leakage current, I/O ports IIL -125 5 125 nA VSS ≤ VPIN ≤ VDD, pin at high-impedance, 85°C 674
Input leakage current, MCLR IIL -200 50 200 nA VSS ≤ VPIN ≤ VDD, pin at high-impedance, 85°C 674
Weak pull-up current IPUR 25 120 200 µA VDD = 3.0V, VPIN = VSS 674
Output low voltage, standard I/O VOL 0.6 V IOL = 6 mA, VDD = 3.3V 674
Pin capacitance, all I/O pins CIO 5 50 pF All I/O pins 674
Voltage on MCLR/VPP to enter programming mode VIHH 8 9 V Note 2, Note 3 675
Supply current during programming IDDPGM 10 mA 675
Self-timed row erase or self-timed write time TP_REW 2 2.5 ms 675
Maximum junction temperature TJMAX 150 C 676
System clock frequency FOSC FOSC 32 MHz Notes 2, 3 678
PLL input frequency range FPLLIN 4 8 MHz 680
PLL output frequency range FPLLOUT 16 32 MHz Note 1 (must meet FOSC requirement D002) 680
MCLR pulse width low to ensure Reset TMCLR 2 µs 683
I/O high-impedance from Reset detection TIOZ 2 µs 683
ADC integral error EIL -2 0.1 2 LSb VDD = 3.0V, TA = 25°C; ADCREF+ = 3.0V 683
ADC differential error EDL -1 0.2 1 LSb VDD = 3.0V, TA = 25°C; ADCREF+ = 3.0V 683
ADC reference voltage VADREF 1.8 V max printed as VDD 683
1x gain FVR (1.024V) accuracy VFVR1 -4 4 % VDD 2.5V (inequality lost in extraction), -40°C to 85°C 687
2x gain FVR (2.048V) accuracy VFVR2 -4 4 % VDD 2.5V (inequality lost in extraction), -40°C to 85°C 687
EUSART synchronous clock high to data-out valid TCKH2DTV 100 ns 1.8V ≤ VDD ≤ 5.5V 691
Secondary oscillator input frequency range FT1 32.4 32.768 33.1 kHz Oscillator enabled by T1OSCEN 688
Maximum junction-to-ambient thermal resistance, 28-pin SSOP θJA 90 C/W 28-pin SSOP package; -40°C ≤ TA ≤ +125°C 676
Junction-to-case thermal resistance, 28-pin SSOP θJC 24 C/W 28-pin SSOP package 676

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PPS body RxyPPS 368

CAD (KiCad official)

  • Symbol: PIC16LF19156T-I
  • Footprint: Package_SO:SSOP-28_5.3x10.2mm_P0.65mm
  • 3D model: SSOP-28-208mil (KiCad packages3D, STEP)
  • 3D model files: pic16lf19156t-i-etched.step / pic16lf19156t-i-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pic16lf19156t-i.step / pic16lf19156t-i.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (754 pp, sha256 4c376d67b2d02e01, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF