CC1100RTKR from Texas Instruments, in a QFN-20-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	SCLK	input	Serial configuration interface clock input.
2	SO (GDO1)	output	Serial configuration interface data output; optional general output pin when CSn is high.
3	GDO2	output	Digital output pin for general use, selectable for test signals, FIFO status, clear channel indicator, clock output down-divided from XOSC, or serial output RX data.
4	DVDD	power_in	1.8 - 3.6 V digital power supply for digital I/Os and for the digital core voltage regulator.
5	DCOUPL	power_out	1.6 - 2.0 V digital power supply output for decoupling; intended for CC1100 only and cannot be used to supply other devices.
6	GDO0 (ATEST)	bidirectional	Digital I/O for general use (test, FIFO status, clear channel indicator, clock output, serial RX/TX data) and analog test I/O for prototype and production testing.
7	CSn	input	Serial configuration interface chip select input.
8	XOSC_Q1	bidirectional	Crystal oscillator pin 1, or external clock input.
9	AVDD	power_in	1.8 - 3.6 V analog power supply connection.
10	XOSC_Q2	bidirectional	Crystal oscillator pin 2.
11	AVDD	power_in	1.8 - 3.6 V analog power supply connection.
12	RF_P	bidirectional	Positive RF input signal to the LNA in receive mode and positive RF output signal from the PA in transmit mode.
13	RF_N	bidirectional	Negative RF input signal to the LNA in receive mode and negative RF output signal from the PA in transmit mode.
14	AVDD	power_in	1.8 - 3.6 V analog power supply connection.
15	AVDD	power_in	1.8 - 3.6 V analog power supply connection.
16	GND	power_in	Analog ground connection.
17	RBIAS	bidirectional	External bias resistor for reference current.
18	DGUARD	power_in	Power supply connection for digital noise isolation.
19	GND	power_in	Ground connection for digital noise isolation.
20	SI	input	Serial configuration interface data input.
21	EP	passive	Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter	Value
Manufacturer	Texas Instruments
Package	QFN-20-EP(4x4)
Category	Radio Frequency Chip/Antenna
Pins	21

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Supply voltage		-0.3		3.9	V	All supply pins must have the same voltage	7
Voltage on any digital pin		-0.3		3.9	V	VDD+0.3 max 3.9	7
Voltage on the pins RF_P, RF_N, and DCOUPL		-0.3		2	V		7
Voltage ramp-up rate				120	kV/µs		7
Input RF level				10	dBm		7
Storage temperature range		-50		150	°C		7
Solder reflow temperature				260	°C	According to IPC/JEDEC J-STD-020C	7
ESD				500	V	According to JEDEC STD 22, method A114, Human Body Model	7
Operating temperature		-40		85	°C		7
Operating supply voltage		1.8		3.6	V	All supply pins must have the same voltage	7
Frequency range 300-348 MHz		300		348	MHz		7
Frequency range 400-464 MHz		400		464	MHz		7
Frequency range 800-928 MHz		800		928	MHz		7
Current consumption, SLEEP state			400		nA	Voltage regulator to digital part off, register values retained (SLEEP state). All GDO pins programmed to 0x2F (HW to 0)	8
Current consumption, XOFF state			160		µA	Voltage regulator to digital part on, all other modules in power down (XOFF state)	8
Current consumption, IDLE state			1.6		mA	Only voltage regulator to digital part and crystal oscillator running (IDLE state)	8
Current consumption, FSTXON state			8.2		mA	Only the frequency synthesizer is running (FSTXON state)	8
Current consumption, RX 250 kBaud at sensitivity limit			15.9		mA	Receive mode, 250 kBaud, reduced current, input at sensitivity limit	8
Current consumption, TX +10 dBm output power			27		mA	Transmit mode, +10 dBm output power	8
Current consumption, TX 0 dBm output power			14.8		mA	Transmit mode, 0 dBm output power	8
Current consumption, TX -6 dBm output power			12.3		mA	Transmit mode, -6 dBm output power	8
Output power, highest setting			10		dBm	Delivered to a 50Ω single-ended load via CC1100EM reference design RF matching network	13
Output power, lowest setting			-30		dBm	Delivered to a 50Ω single-ended load via CC1100EM reference design RF matching network	13
Crystal frequency		26	26	27	MHz		14
Crystal tolerance		-40		40	ppm	Total tolerance including a) initial tolerance, b) crystal loading, c) aging, and d) temperature dependence	14
Crystal ESR	ESR			100	Ω		14
Crystal oscillator start-up time			150		µs	Measured on the CC1100EM reference designs using crystal AT-41CD2 from NDK	14
Calibrated RC oscillator frequency		34.7	34.7	36	kHz	Calibrated RC Oscillator frequency is XTAL frequency divided by 750	15
Frequency accuracy after calibration		-1		1	%		15
RC oscillator temperature coefficient			0.5		%/°C	Frequency drift when temperature changes after calibration	15
RC oscillator supply voltage coefficient			3		%/V	Frequency drift when supply voltage changes after calibration	15
RC oscillator initial calibration time			2		ms	When the RC Oscillator is enabled, calibration is continuously done in the background as long as the crystal oscillator is running	15
PLL turn-on / hop time		85.1	88.4	88.4	µs	Time from leaving the IDLE state until arriving in the RX, FSTXON or TX state, when not performing calibration. Crystal oscillator running.	15
PLL calibration time		694	721	721	µs	Calibration can be initiated manually or automatically before entering or after leaving RX/TX	15
Analog temperature sensor temperature coefficient			2.45		mV/°C	Fitted from -20 °C to +80 °C	16
Logic 0 input voltage		0		0.7	V		16
Logic 0 output voltage				0.5	V	For up to 4 mA output current	16
Logic 0 input current				-50	nA	Input equals 0V	16
Logic 1 input current				50	nA	Input equals VDD	16
Power-up ramp-up time			5		ms	From 0V until reaching 1.8V	16
Power off time			1		ms	Minimum time between power-on and power-off	16

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
housing	Abs		Human Body Model Table 1: Absolute Maximum Ratings	7

CAD (KiCad official)

Symbol: CC1100RTKR
Footprint: Package_DFN_QFN:QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm
3D model: QFN-20-EP(4x4) (KiCad packages3D, STEP)
3D model files: cc1100rtkr-etched.step / cc1100rtkr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cc1100rtkr.step / cc1100rtkr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Texas Instruments datasheet (101 pp, sha256 2117b40c8c2d5713, retrieved 2026-11-02, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

CC1100RTKR

Verified CC1100RTKR

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

README