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Contents

README

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nSMD110-16V

TECHFUSE · Resettable Fuses · 1206

nSMD110-16V from TECHFUSE, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Unpolarized PPTC terminal pad (tin-plated nickel-copper); device is rated 16 V max, 1.10 A hold, 2.20 A trip, 100 A max fault current.
2 2 passive Unpolarized PPTC terminal pad (tin-plated nickel-copper), interchangeable with the other terminal; device is rated 16 V max, 1.10 A hold, 2.20 A trip, 100 A max fault current.

Key specifications

Parameter Value
Manufacturer TECHFUSE
Package 1206
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum operating voltage (Vmax) Vmax 16 Vdc Maximum operating voltage device can withstand without damage at rated current (Imax) 2
Maximum fault current (Imax) Imax 100 A At rated voltage (Vmax) 2
Trip current (Itrip) Itrip 2.2 A 25°C still air; minimum current at which device always trips 2
Hold current (Ihold) Ihold 1.1 A 25°C still air; maximum current device will not trip 2
Minimum device resistance prior to tripping (Rimin) Rimin 0.05 Ω 25°C, prior to tripping 2
Maximum device resistance one hour post reflow (R1max) R1max 0.25 Ω Measured one hour post reflow 2
Passive aging resistance change -5 5 % Passive aging +85°C, 1000 hrs; ±5% typical as printed 2
Humidity aging resistance change -5 5 % Humidity aging +85°C, 85% R.H., 168 hours; ±5% typical as printed 2
Thermal shock resistance change -33 33 % Thermal shock +85°C to -40°C, 20 times; ±33% typical as printed 2
Ambient operating temperature -40 85 °C Ambient operating conditions 2
Maximum surface temperature in tripped state 125 °C Device in the tripped state 2
Power dissipation in tripped state (Pd) Pd 0.6 W 25°C still air, rated voltage; power dissipation when device is in the tripped state 2
Typical time to trip 0.3 Sec Typical Time-To-Trip at 25°C 2
Storage temperature (maximum) 40 °C Storage conditions 4
Storage relative humidity (maximum) 70 % R.H. Storage conditions 4

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper tin α = Trademark H = Part identification Termination Pad Characteristics Terminal pad materials: Tin-plated Nickel-Copper Terminal pad solderability: Meets EIA specification RS186-9E and ANSI/J-STD-002 C 3

CAD (KiCad official)

  • Symbol: nSMD110-16V
  • Footprint: Fuse:Fuse_1206_3216Metric
  • 3D model: 1206 (KiCad packages3D, STEP)
  • 3D model files: nsmd110-16v-etched.step / nsmd110-16v-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); nsmd110-16v.step / nsmd110-16v.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TECHFUSE datasheet (4 pp, sha256 429eb8dadefcf708, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF