TO-263 (D2PAK)

The TO-263 (D2PAK) is the larger sibling of the DPAK, providing even better thermal performance for high-power surface-mount applications. With a 15.2 x 10.2mm footprint and massive thermal tab, it handles up to 3W on standard PCBs and much more with thermal vias and internal copper planes. Used for high-current MOSFETs (IRFR024N), power linear regulators (LM338), and high-side switches. The D2PAK eliminates the need for heatsinks and through-hole mounting while matching TO-220 power levels in a fully SMD assembly process.