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BQ76952 — Parsed Datasheet

Source: Texas Instruments BQ76952 Datasheet (SLUSE13B)
Manufacturer: Texas Instruments
Document: SLUSE13B — Revised November 2021
Part Number: BQ76952
Package: PFB (48-pin TQFP), 7 mm × 7 mm

Description

The BQ76952 is a highly integrated battery monitor and protection IC for 3-series to 16-series Li-ion, Li-polymer, and LiFePO4 battery packs. It combines high-accuracy cell and pack measurements, coulomb counting, configurable protection logic, autonomous or host-controlled cell balancing, and high-side FET gate-drive support in a 48-pin TQFP package.

Alongside measurement and protection functions, the device integrates a charge pump for CHG and DSG NFET control, precharge and predischarge drivers, a secondary fuse driver, dual programmable LDOs for external circuitry, and host communications over I2C, SPI, or HDQ. The BQ76952 family also includes factory-configured variants that change the default communications mode and REG1 startup behavior.

Device Comparison Table

Part Number Default Interface CRC Enabled REG1 Default
BQ76952 I2C No Disabled
BQ7695201 SPI Yes Disabled
BQ7695202 I2C Yes Enabled, 3.3 V
BQ7695203 SPI Yes Enabled, 5 V
BQ7695204 SPI Yes Enabled, 3.3 V

Key Specifications

Parameter Value
Supported battery stack 3 to 16 series Li-ion, Li-polymer, or LiFePO4 cells
BAT supply voltage 4.7 V to 80 V
Cell voltage accuracy ±5 mV typ at 25°C; ±10 mV max from 0°C to 60°C; ±15 mV max from -40°C to 85°C
Current-sense range ±200 mV across the shunt resistor
Coulomb counter offset < 1 µV typ (feature summary)
Communications I2C up to 400 kHz, SPI, HDQ one-wire
Programmable LDOs REG1 and REG2 selectable to 1.8 V, 2.5 V, 3.0 V, 3.3 V, or 5.0 V
Low-power modes 286 µA normal, 24 µA to 41 µA sleep, 9.2 µA to 10.7 µA deep sleep, 1 µA typ shutdown
Temperature sensing Internal temperature sensor plus support for up to nine external thermistors
Package PFB 48-pin TQFP, 7 mm × 7 mm

Features

  • Battery monitoring capability for 3-series to 16-series cells
  • Extensive protection coverage for voltage, temperature, current, fuse, and internal diagnostics
  • Two independent ADC paths for synchronized voltage and current sampling
  • Autonomous or host-controlled cell balancing
  • Integrated charge pump for high-side NFET protection control
  • Integrated precharge, predischarge, and secondary chemical fuse drive support
  • High-voltage tolerance up to 85 V on battery-stack related pins
  • Random cell attach sequence tolerance for production environments
  • Customer-programmable OTP memory for manufacturing-time configuration
  • Dual programmable LDOs for external host and support circuitry

Pin Configuration

Pin Name Type Description
1 VC15 Input Sense input for cell 15; also balancing path for cell 15 and return path for cell 16
2 VC14 Input Sense input for cell 14; also balancing path for cell 14 and return path for cell 15
3 VC13 Input Sense input for cell 13; also balancing path for cell 13 and return path for cell 14
4 VC12 Input Sense input for cell 12; also balancing path for cell 12 and return path for cell 13
5 VC11 Input Sense input for cell 11; also balancing path for cell 11 and return path for cell 12
6 VC10 Input Sense input for cell 10; also balancing path for cell 10 and return path for cell 11
7 VC9 Input Sense input for cell 9; also balancing path for cell 9 and return path for cell 10
8 VC8 Input Sense input for cell 8; also balancing path for cell 8 and return path for cell 9
9 VC7 Input Sense input for cell 7; also balancing path for cell 7 and return path for cell 8
10 VC6 Input Sense input for cell 6; also balancing path for cell 6 and return path for cell 7
11 VC5 Input Sense input for cell 5; also balancing path for cell 5 and return path for cell 6
12 VC4 Input Sense input for cell 4; also balancing path for cell 4 and return path for cell 5
13 VC3 Input Sense input for cell 3; also balancing path for cell 3 and return path for cell 4
14 VC2 Input Sense input for cell 2; also balancing path for cell 2 and return path for cell 3
15 VC1 Input Sense input for cell 1; also balancing path for cell 1 and return path for cell 2
16 VC0 Input Sense input for the negative terminal of cell 1; return path for cell-1 balancing current
17 VSS Power Device ground
18 SRP Input Top-side current-sense input for coulomb counting and current protections
19 NC None Not connected internally
20 SRN Input Bottom-side current-sense input for coulomb counting and current protections
21 TS1 I/O Thermistor input or general-purpose ADC input
22 TS2 I/O Thermistor input, shutdown wake input, or general-purpose ADC input
23 TS3 I/O Thermistor input or general-purpose ADC input
24 REG18 Power Internal 1.8 V LDO output/reference rail
25 ALERT I/O ALERT output, HDQ I/O, thermistor/ADC input, or digital output depending on configuration
26 SCL I/O I2C SCL or SPI SCLK
27 SDA I/O I2C SDA or SPI MISO
28 HDQ I/O HDQ I/O, SPI MOSI, thermistor/ADC input, or digital output
29 CFETOFF I/O Charge-FET-off input, SPI CS, thermistor/ADC input, or digital output
30 DFETOFF I/O Discharge-FET-off/BOTHOFF input, thermistor/ADC input, or digital output
31 DCHG I/O Digital charge-status output, thermistor/ADC input, or digital output
32 DDSG I/O Digital discharge-status output, thermistor/ADC input, or digital output
33 RST_SHUT Input Reset and shutdown control input
34 REG2 Power Programmable LDO output; selectable to 1.8 V, 2.5 V, 3.0 V, 3.3 V, or 5.0 V
35 REG1 Power Programmable LDO output; selectable to 1.8 V, 2.5 V, 3.0 V, 3.3 V, or 5.0 V
36 REGIN Input Input rail feeding REG1 and REG2
37 BREG Output Base-drive/control output for the external preregulator transistor
38 FUSE I/O Fuse sense and fuse-drive pin
39 PDSG Output Predischarge PFET control output
40 PCHG Output Precharge PFET control output
41 LD I/O Load-detect input and wake-related multifunction pin
42 PACK Input Pack-voltage sense input
43 DSG Output Main NMOS discharge-FET drive
44 NC None Not connected internally
45 CHG Output Main NMOS charge-FET drive
46 CP1 I/O Charge-pump capacitor connection
47 BAT Power Primary device supply input
48 VC16 Input Sense input for cell 16, balancing path for cell 16, and top-of-stack measurement point

Absolute Maximum Ratings

Parameter Min Max Unit
BAT supply voltage VSS - 0.3 VSS + 85 V
PACK, LD input voltage VSS - 0.3 VSS + 85 V
PCHG, PDSG input voltage max(VBAT - 10, VLD - 10) VSS + 85 V
FUSE input voltage VSS - 0.3 min(VSS + 20, VBAT + 0.3) V
REG1, REG2, RST_SHUT, ALERT, SCL, SDA, HDQ, CFETOFF, DFETOFF, DCHG, DDSG VSS - 0.3 VSS + 6 V
SRP, SRN VSS - 0.3 VREG18 + 0.3 V

Recommended Operating Conditions

Parameter Min Typ Max Unit
BAT supply voltage 4.7 80 V
OTP programming supply voltage 10 12 V
PACK, LD input range 0 80 V
Current-sense differential range (SRP - SRN) -0.2 0.2 V
External cell input resistance 20 100 Ω
External cell input capacitance 0.1 0.22 1 µF
Operating temperature -40 85 °C

Electrical Characteristics

Parameter Conditions Min Typ Max Unit
Cell voltage measurement accuracy 2 V < VCELL < 5 V, TA = 25°C -5 5 mV
Cell voltage measurement accuracy 2 V < VCELL < 5 V, TA = 0°C to 60°C -10 10 mV
Cell voltage measurement accuracy -0.2 V < VCELL < 5.5 V, TA = -40°C to 85°C -15 15 mV
Stack voltage measurement accuracy 0 V < VC16 - VSS < 80 V -0.5 0.5 V
PACK pin voltage measurement accuracy 0 V < VPACK < 80 V -0.5 0.5 V
LD pin voltage measurement accuracy 0 V < VLD < 80 V -0.5 0.5 V
Coulomb counter input range VSRP - VSRN -0.2 0.2 V
Coulomb counter effective input resistance 2
Current-wake threshold error Threshold setting between ±0.5 mV and ±5 mV -200 200 µV
ADC input range, cell differential mode Internal VREF1 -0.2 5.5 V

Power Consumption

Mode Conditions Typ Max Unit
Normal Regular measurements and protections active 286 µA
Sleep 1 Periodic protections and monitoring, DSG on in 11 V overdrive mode 41 µA
Sleep 2 Periodic protections and monitoring, DSG in source-follower mode 24 µA
Deep sleep 1 No monitoring or protections, LFO on 10.7 µA
Deep sleep 2 No monitoring or protections, LFO off 9.2 µA
Shutdown TS2 wake circuit active, no monitoring or communications 1 3.1 µA

Power Domains

Rail / Block Configuration Range / Nominal Notes
REG18 Internal LDO 1.6 V to 2.0 V, 1.8 V typ Reference rail for low-voltage functions and thermistor/ADC domains
REG1 Programmable LDO 1.8 V, 2.5 V, 3.0 V, 3.3 V, or 5.0 V nominal; up to 45 mA load Can power an external MCU or support circuitry
REG2 Programmable LDO 1.8 V, 2.5 V, 3.0 V, 3.3 V, or 5.0 V nominal; up to 45 mA load Independent second LDO for auxiliary rails
REG0 / BREG / REGIN path Preregulator Internal BREG-controlled preregulator or external 5.5 V REGIN supply Feeds REG1 and REG2
Charge pump / CP1 Gate-drive boost Supports CHG and DSG high-side NFET drive Startup and load behavior depend on CP1 capacitance

Thermal Information

Package RθJA RθJC(top) RθJB ΨJT ΨJB Unit
PFB (48-pin TQFP) 66.0 19.6 29.3 0.8 29.1 °C/W

Communication Interface

Interface Notes Pin Mapping
I2C Supports 100 kHz and 400 kHz operation; base BQ76952 defaults to I2C without CRC SDA, SCL
SPI Responder-only interface with optional CRC; uses CPOL = 0 and CPHA = 0 SDA = MISO, SCL = SCLK, HDQ = MOSI, CFETOFF = CS
HDQ Single-wire asynchronous responder interface with open-drain signaling HDQ or ALERT, depending on configuration

Serial Transaction Coverage

  • I2C timing requirements are provided for 100 kHz and 400 kHz operation, including repeated-start and non-repeated-start read sequences.
  • SPI timing is documented with and without CRC, including responder timing, bus-reset behavior, and MISO drive considerations.
  • HDQ is documented as a responder-only single-wire protocol with explicit break, command, and response timing.

Measurement Subsystem

Function Summary
Cell voltage ADC Measures up to 16 differential cell voltages in a 3s to 16s stack; recommended input range is -0.2 V to 5.5 V per cell channel
Measurement loop Scans all 16 cells, then auxiliary nodes such as VC16, PACK, LD, internal references, and enabled thermistor / ADCIN inputs
Loop timing Each voltage slot takes about 3 ms, or 1.5 ms with fast ADC enabled; a full loop is typically 18 to 21 slots
Current measurement Dedicated coulomb-counter ADC measures shunt voltage continuously over a ±200 mV range
CC1 / CC2 / CC3 filters CC1 provides lower-rate integrated-current data, CC2 provides fast current data, and CC3 averages a programmable number of CC2 samples
Synchronized measurements Current samples can be paired with cell voltage measurements for impedance analysis and diagnostics
ADCIN inputs TS1, TS2, TS3, ALERT, HDQ, CFETOFF, DFETOFF, DCHG, and DDSG can be repurposed as auxiliary ADC inputs when not used for digital functions

Protection Architecture

Protection group Coverage
Primary protections Cell undervoltage / overvoltage, overcurrent in charge, multiple overcurrent-in-discharge tiers, short circuit in discharge, charge/discharge temperature protections, internal and FET overtemperature, watchdog, and precharge timeout
Secondary protections Permanent-fail checks for safety cell voltage, safety current, safety temperature, imbalance, OTP / ROM / reference / oscillator faults, commanded PF, and other critical diagnostics
FET control Supports autonomous, partially autonomous, or host-managed CHG / DSG FET control
Fuse behavior Permanent fail can flag only, latch off FETs, or assert the FUSE output to permanently disable the pack
Driver topology Integrated charge pump drives high-side NFET charge and discharge FETs; also supports precharge and predischarge PFET control

Device Functional Modes

Mode Behavior
NORMAL Full measurements, protections, communications, and active pack-management behavior
SLEEP Reduced-power monitoring with periodic measurements and configurable wake behavior
DEEPSLEEP Lower-power standby with monitoring/protection largely disabled, preserving configuration/state as applicable
SHUTDOWN Minimum-current mode with TS2 / LD based wake mechanisms and communications off
CONFIG_UPDATE Register/configuration update mode used during setup and manufacturing configuration

Cell Balancing

  • Supports passive cell balancing using integrated bypass switches or external bypass FETs.
  • Can operate in autonomous voltage-based balancing mode or under explicit host control.
  • Autonomous balancing is limited to non-adjacent active cells; host-controlled balancing can drive adjacent cells.
  • Balancing is temporarily paused around affected ADC measurements to protect voltage accuracy.
  • Configuration can limit the maximum number of simultaneously balanced cells to control device heating.

Typical Implementation

The reference application in the datasheet shows the BQ76952 in a 16-series battery pack with an external secondary protector, host MCU, and communications transceiver. The example design uses CHG and DSG high-side FETs in series, plus dedicated precharge and predischarge PFET paths, and routes the REG1 / REG2 rails to support external logic.

Key implementation notes called out by TI include:

  • Keep the BAT pin alive during short-circuit events using a diode-plus-capacitor hold-up network.
  • Size the CP1 capacitor based on gate charge and acceptable charge-pump startup time.
  • Use symmetric SRP / SRN Kelvin routing with 100-ohm series resistors and a 0.1-uF differential filter capacitor.
  • Use Battery Management Studio during development to build and validate a golden image before programming OTP.

Packages

Package Pins Body Size Notes
PFB (TQFP) 48 7 mm × 7 mm Orderable base device includes BQ76952PFBR and BQ76952PFBR.A

Applications

  • Battery backup units
  • E-bike, e-scooter, and other light electric vehicle battery packs
  • Cordless power tools and garden tools
  • Non-military drones
  • Industrial battery packs, especially 10S and above
  • Host-managed or standalone battery-management systems using high-side FET protection

Example Design Requirements

Design Parameter Example Value
Minimum system operating voltage 40 V
Cell minimum operating voltage 2.5 V
Series cell count 16
Sense resistor 1 mΩ
Number of thermistors 3
Charge voltage 68 V
Maximum charge current 8 A
Peak discharge current 20 A
OV threshold / delay 4.30 V / 500 ms
UV threshold / delay 2.5 V / 20 ms
SCD threshold / delay 80 mV / 50 µs
OCC threshold / delay 8 mV / 160 ms
OTD / OTC thresholds 60°C / 45°C
UTD / UTC thresholds -20°C / 0°C
REG1 usage 3.3 V output for external host

Detailed Design Notes

  • TI's example sizing flow chooses the shunt value by balancing normal current range, short-circuit thresholds, heat dissipation, and margin; the worked example lands on a 1 mΩ, 50 ppm, 1 W shunt.
  • Charge-pump overdrive is selected based on FET VGS tolerance and the RDS(on) target; 11 V drive gives lower RDS(on), while 5.5 V can reduce gate-leakage-related current draw.
  • The external preregulator transistor on BREG/REGIN must withstand the full pack charging voltage and support the expected REG1 load current.
  • The datasheet's example design assumes OTP programming of the final protection and operating configuration during production.

Layout Guidelines

  • Use true Kelvin sensing at the shunt resistor, and choose a low-drift shunt (TI calls out 50 ppm or better).
  • Place the SRP / SRN filter network close to the IC, not at the shunt.
  • Decouple REG18 with its required capacitor as close to the pin as possible.
  • Keep cell-input RC networks consistent and connect every unused VC pin either to an adjacent VC node or to a valid measurement/interconnect network.
  • Consider additional ESD hardening on the I2C pins with external protection and series resistance.

Unused Pin Guidance

Pins Recommendation
VC0-VC16 Every cell pin must be tied to an adjacent VC node, a real cell through RC filtering, or an interconnect measurement network
SRP, SRN Tie to VSS if unused
NC pins Leave floating or tie to a neighboring node / VSS
TS1, TS3, ALERT, HDQ, CFETOFF, DFETOFF, DCHG, DDSG May be left floating or tied to VSS if unused
TS2 Leave floating if shutdown wake is needed; otherwise may be left floating or tied to VSS
RST_SHUT Tie to VSS if unused
REG1, REG2 May be left floating or tied to VSS if unused
REGIN Tie to VSS if unused
BREG Tie to VSS if REGIN is also unused, otherwise tie to REGIN
FUSE May be left floating or tied to VSS if unused
PDSG, PCHG, DSG, CHG Leave floating if unused
LD If DSG is unused, may be tied through a resistor to PACK+ or tied to VSS
CP1 Tie to BAT if unused; note the extra charge-pump current if enabled

Diagram Coverage

The source datasheet contains 57 captioned figures across 26 figure-bearing pages. The wiki gallery for this page now includes every one of those 26 pages as screenshots, plus the hero image and supporting cropped reference images.

Extracted Figure Pages

Datasheet Page Coverage Uploaded Asset
25 I2C and SPI interface timing diagrams bq76952-p25.png
26 HDQ communications timing diagram bq76952-p26.png
27 Cell voltage accuracy characteristic plots bq76952-p27.png
28 Current, reference, temperature, and LFO characteristic plots bq76952-p28.png
29 HFO, overcurrent, balancing, and REG1 characteristic plots bq76952-p29.png
30 REG2, thermistor, coulomb counter, and REG18 characteristic plots bq76952-p30.png
31 REG18, REGIN, and low-power current characteristic plots bq76952-p31.png
36 Cell-input interconnect and unused-pin examples bq76952-p36.png
39 External thermistor biasing example bq76952-p39.png
50 FUSE pin operation bq76952-p50.png
51 Device functional modes bq76952-p51.png
55 I2C write and repeated-start read transactions bq76952-p55.png
56 I2C read without repeated start and SPI mode timing bq76952-p56.png
58 SPI transaction with CRC bq76952-p58.png
59 Additional SPI CRC transaction timing bq76952-p59.png
60 SPI transaction without CRC bq76952-p60.png
61 Additional SPI non-CRC transaction timing bq76952-p61.png
62 SPI transaction timing without CRC final example bq76952-p62.png
66 16-series typical implementation schematic page bq76952-p66.png
67 Full 16-series monitor and additional circuitry schematics bq76952-p67.png
70 Thermistor temperature error plot and random cell connection guidance bq76952-p70.png
72 Startup sequence timing bq76952-p72.png
73 Moderate-speed DSG FET turn-off behavior bq76952-p73.png
74 Slow and fast DSG FET turn-off cases bq76952-p74.png
77 Two-layer board layout top layer page bq76952-p77.png
78 Two-layer board layout bottom layer bq76952-p78.png

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