component

QFN-20

Unreviewed

by Kyle Bergstedt

20-pin quad flat no-lead — compact leadless IC package with exposed pad

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QFN-20

The QFN-20 is a 20-pin leadless package with an exposed thermal pad. At 4 x 4mm with 0.5mm pitch, it provides excellent thermal performance and a small footprint — roughly half the area of an equivalent TSSOP. The exposed pad connects directly to a PCB copper pour for heat dissipation. Popular for sensor ICs, small MCUs, and RF transceivers.