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OCuLink Riser for the Supermicro AIOM Slot

Public Unreviewed

by John Lauer

Passive OCP NIC 3.0 SFF card that breaks a Supermicro AIOM slot's PCIe x16 into four OCuLink 4i ports (4 x4, Gen4): 6-layer, 85 ohm, length-matched, DRC-clean KiCad project with Gerbers, BOM and CPL.

pcbkicadoculinksff-8611ocp-nic-3.0aiomsupermicropcie-gen4riseropen-hardware
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oculink-aiom-riser / fab / gerbers / ocp-oculink-riser-job.gbrjob
HistoryDownload
John Lauer The finished riser: KiCad project, Gerbers/BOM/CPL, design record, renders and analysis 09d929e 7d ago
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{
  "Header": {
    "GenerationSoftware": {
      "Vendor": "KiCad",
      "Application": "Pcbnew",
      "Version": "10.0.5"
    },
    "CreationDate": "2026-10-13T02:41:20-05:00"
  },
  "GeneralSpecs": {
    "ProjectId": {
      "Name": "ocp-oculink-riser",
      "GUID": "6f63702d-6f63-4756-9c69-6e6b2d726973",
      "Revision": "rev?"
    },
    "Size": {
      "X": 76.05,
      "Y": 115.05
    },
    "LayerNumber": 6,
    "BoardThickness": 1.6,
    "Finish": "None"
  },
  "DesignRules": [
    {
      "Layers": "Outer",
      "PadToPad": 0.12,
      "PadToTrack": 0.12,
      "TrackToTrack": 0.12,
      "MinLineWidth": 0.15,
      "TrackToRegion": 0.35,
      "RegionToRegion": 0.35
    },
    {
      "Layers": "Inner",
      "PadToPad": 0.12,
      "PadToTrack": 0.12,
      "TrackToTrack": 0.12,
      "MinLineWidth": 0.121,
      "TrackToRegion": 0.25,
      "RegionToRegion": 0.25
    }
  ],
  "FilesAttributes": [
    {
      "Path": "ocp-oculink-riser-F_Cu.gtl",
      "FileFunction": "Copper,L1,Top",
      "FilePolarity": "Positive"
    },
    {
      "Path": "ocp-oculink-riser-In1_Cu.g1",
      "FileFunction": "Copper,L2,Inr",
      "FilePolarity": "Positive"
    },
    {
      "Path": "ocp-oculink-riser-In2_Cu.g2",
      "FileFunction": "Copper,L3,Inr",
      "FilePolarity": "Positive"
    },
    {
      "Path": "ocp-oculink-riser-In3_Cu.g3",
      "FileFunction": "Copper,L4,Inr",
      "FilePolarity": "Positive"
    },
    {
      "Path": "ocp-oculink-riser-In4_Cu.g4",
      "FileFunction": "Copper,L5,Inr",
      "FilePolarity": "Positive"
    },
    {
      "Path": "ocp-oculink-riser-B_Cu.gbl",
      "FileFunction": "Copper,L6,Bot",
      "FilePolarity": "Positive"
    },
    {
      "Path": "ocp-oculink-riser-F_Paste.gtp",
      "FileFunction": "SolderPaste,Top",
      "FilePolarity": "Positive"
    },
    {
      "Path": "ocp-oculink-riser-B_Paste.gbp",
      "FileFunction": "SolderPaste,Bot",
      "FilePolarity": "Positive"
    },
    {
      "Path": "ocp-oculink-riser-F_Silkscreen.gto",
      "FileFunction": "Legend,Top",
      "FilePolarity": "Positive"
    },
    {
      "Path": "ocp-oculink-riser-B_Silkscreen.gbo",
      "FileFunction": "Legend,Bot",
      "FilePolarity": "Positive"
    },
    {
      "Path": "ocp-oculink-riser-F_Mask.gts",
      "FileFunction": "SolderMask,Top",
      "FilePolarity": "Negative"
    },
    {
      "Path": "ocp-oculink-riser-B_Mask.gbs",
      "FileFunction": "SolderMask,Bot",
      "FilePolarity": "Negative"
    },
    {
      "Path": "ocp-oculink-riser-Edge_Cuts.gm1",
      "FileFunction": "Profile",
      "FilePolarity": "Positive"
    }
  ],
  "MaterialStackup": [
    {
      "Type": "Legend",
      "Name": "Top Silk Screen"
    },
    {
      "Type": "SolderPaste",
      "Name": "Top Solder Paste"
    },
    {
      "Type": "SolderMask",
      "Thickness": 0.01,
      "Name": "Top Solder Mask"
    },
    {
      "Type": "Copper",
      "Thickness": 0.035,
      "Name": "F.Cu"
    },
    {
      "Type": "Dielectric",
      "Thickness": 0.274,
      "Material": "FR4",
      "Name": "F.Cu/In1.Cu",
      "Notes": "Type: dielectric layer 1 (from F.Cu to In1.Cu)"
    },
    {
      "Type": "Copper",
      "Thickness": 0.035,
      "Name": "In1.Cu"
    },
    {
      "Type": "Dielectric",
      "Thickness": 0.274,
      "Material": "FR4",
      "Name": "In1.Cu/In2.Cu",
      "Notes": "Type: dielectric layer 2 (from In1.Cu to In2.Cu)"
    },
    {
      "Type": "Copper",
      "Thickness": 0.035,
      "Name": "In2.Cu"
    },
    {
      "Type": "Dielectric",
      "Thickness": 0.274,
      "Material": "FR4",
      "Name": "In2.Cu/In3.Cu",
      "Notes": "Type: dielectric layer 3 (from In2.Cu to In3.Cu)"
    },
    {
      "Type": "Copper",
      "Thickness": 0.035,
      "Name": "In3.Cu"
    },
    {
      "Type": "Dielectric",
      "Thickness": 0.274,
      "Material": "FR4",
      "Name": "In3.Cu/In4.Cu",
      "Notes": "Type: dielectric layer 4 (from In3.Cu to In4.Cu)"
    },
    {
      "Type": "Copper",
      "Thickness": 0.035,
      "Name": "In4.Cu"
    },
    {
      "Type": "Dielectric",
      "Thickness": 0.274,
      "Material": "FR4",
      "Name": "In4.Cu/B.Cu",
      "Notes": "Type: dielectric layer 5 (from In4.Cu to B.Cu)"
    },
    {
      "Type": "Copper",
      "Thickness": 0.035,
      "Name": "B.Cu"
    },
    {
      "Type": "SolderMask",
      "Thickness": 0.01,
      "Name": "Bottom Solder Mask"
    },
    {
      "Type": "SolderPaste",
      "Name": "Bottom Solder Paste"
    },
    {
      "Type": "Legend",
      "Name": "Bottom Silk Screen"
    }
  ]
}