KSZ9031RNX (Gigabit Ethernet PHY, RGMII)

{
  "part": "KSZ9031RNX",
  "package": "QFN-48 7x7mm",
  "generator": "footprint-widgets/tools/make-variants.py (adom-footprint 1.0.22 heatsink / solderballs rules)",
  "variants": [
    {
      "suffix": "",
      "device": "baseline",
      "kicad_mod": "ksz9031rnx-qfn48-7x7.kicad_mod",
      "footprintName": "ksz9031rnx-qfn48-7x7",
      "changed": "nothing; the page footprint as-is (49 SMD pads)"
    },
    {
      "suffix": "-HV",
      "device": "heatsink vias",
      "kicad_mod": "ksz9031rnx-qfn48-7x7-HV.kicad_mod",
      "footprintName": "ksz9031rnx-qfn48-7x7-HV",
      "viaPadNumber": "49",
      "changed": "+16 thru_hole pads under pad 49 (1.2 mm pitch, 0.3 mm drill, 0.6 mm OD, 0.45 mm inset), on copper + mask layers only (*.Cu *.Mask)"
    },
    {
      "suffix": "-SB",
      "device": "solder balls",
      "kicad_mod": "ksz9031rnx-qfn48-7x7-SB.kicad_mod",
      "footprintName": "ksz9031rnx-qfn48-7x7-SB",
      "changed": "+220 filled fp_circle O0.30 mm on KiCad layer User.9 (Adom.SolderBalls), one per 300um jet-paste ball, 0.25 mm pitch; copper untouched"
    },
    {
      "suffix": "-RR",
      "device": "rounded pads",
      "kicad_mod": "ksz9031rnx-qfn48-7x7-RR.kicad_mod",
      "footprintName": "ksz9031rnx-qfn48-7x7-RR",
      "changed": "every SMD pad shape -> KiCad roundrect: signal pads roundrect_rratio 0.25 (the KiCad/IPC default), EP 0.1; positions and sizes unchanged"
    },
    {
      "suffix": "-HV-SB-RR",
      "device": "heatsink vias + solder balls + rounded pads",
      "kicad_mod": "ksz9031rnx-qfn48-7x7-HV-SB-RR.kicad_mod",
      "footprintName": "ksz9031rnx-qfn48-7x7-HV-SB-RR",
      "changed": "= -RR pads + the 16 heatsink vias as thru_hole pads on 49 + the 220-ball Adom.SolderBalls layer (balls kept 0.55 mm off every via centre)"
    }
  ]
}