65% MX Keyboard (soldered)

@@ -1,6 +1,6 @@ # AI Flow run: claude-opus-5-5 on board-0 -**Running**: step `thermal`, 216.7 min of AI time since the prompt (268.5 min on the wall clock). This page updates at every step change.+**Running**: step `pours`, 217.0 min of AI time since the prompt (268.8 min on the wall clock). This page updates at every step change.  Prompt at 2026-11-09T00:22:00Z (UTC). Flow: board. Every number here is from the run's append-only ledger (run.jsonl). AI time is the time the AI was working on a prompt: from the human's prompt to the AI's done, with any gap over 15 min where no command ran (unobserved, not proven idle) cut out. @@ -10,8 +10,8 @@ One row per human prompt: the AI's time on it, unobserved gaps excluded by the h  | Session | Prompt at | Done at | AI time min | Unobserved gap min | What | |---|---|---|---|---|---|-| 1 | 2026-11-09T00:22:00Z | (open) | 216.7 | 52 | the first prompt |-| **all** | | | **216.7** | | |+| 1 | 2026-11-09T00:22:00Z | (open) | 217.0 | 52 | the first prompt |+| **all** | | | **217.0** | | |  ## Per step @@ -22,9 +22,9 @@ AI time only, the idle cut out. | intake | 7.0 | 6.8 | 0.1 | 5 | 0 | 0 | 5.8 min | | placement | 34.4 | 12.7 | 21.7 | 69 | 5 | 3 | 4.2 min | | routing | 99.3 | 7.8 | 91.5 | 43 | 8 | 0 | 3.7 min |-| pours | 4.5 | 0.7 | 3.9 | 10 | 2 | 0 | 0.4 min |+| pours | 4.6 | 0.7 | 3.9 | 11 | 3 | 1 | 0.4 min | | current | 13.4 | 1.1 | 12.3 | 11 | 3 | 1 | 0.5 min |-| thermal | 2.4 | 1.1 | 1.3 | 5 | 3 | 0 | 0.9 min |+| thermal | 2.6 | 1.3 | 1.3 | 6 | 3 | 0 | 0.9 min | | capture | 0.0 | 0.0 | 0.0 | 1 | 0 | 0 | 0.0 min | | components | 1.0 | 0.1 | 0.9 | 3 | 1 | 0 | 0.1 min | | design | 8.6 | 8.6 | 0.0 | 3 | 0 | 0 | 8.6 min |@@ -40,7 +40,7 @@ AI time only, the idle cut out. | sourcing | 4.5 | 4.5 | 0.0 | 7 | 0 | 0 | 4.5 min | | test-plan | 1.3 | 1.3 | 0.0 | 3 | 0 | 0 | 1.3 min | | thermal-vias | 0.1 | 0.0 | 0.1 | 3 | 1 | 0 | 0.0 min |-| **total** | **216.7** | **80.7** | **135.9** | | | | |+| **total** | **217.0** | **80.9** | **136.1** | | | | |  ## Returns to earlier steps @@ -49,6 +49,7 @@ AI time only, the idle cut out. - 2026-11-09T03:31:31Z back to **schematic** (visit 1): STM32 matrix pins re-assigned by side so each column/row leaves the chip toward its keys; the first map forced COL0-2 across the chip and COL11-14 out the board-edge side, leaving pins unroutable - 2026-11-09T04:01:34Z back to **placement** (visit 5): Fields: decoupling caps C3/C5 3.5-5 mm from their STM32 supply pins; power traces came out 0.2 mm because widths were only in the AI Flow spec, not KiCad netclasses - 2026-11-09T04:45:19Z back to **current** (visit 3): +- 2026-11-09T04:50:42Z back to **pours** (visit 3): Fields ground offset 15 mV under U1: add GND stitching vias between the pours  ## Decisions along the way @@ -75,6 +76,7 @@ AI time only, the idle cut out. - 2026-11-09T04:45:01Z clip-start:thermal-2 - 2026-11-09T04:45:24Z clip-start:current-3 - 2026-11-09T04:50:27Z clip-start:thermal-3+- 2026-11-09T04:50:46Z clip-start:pours-3  ## Where the board stands @@ -487,12 +489,34 @@ What this step does: IPC-2221 on every loaded net, pour and via capacity, the sa  What this step does: copper and vias at every hot tab against the rise budget; then the AI's own temperature rise drawing and a walkthrough of the pours it judged -**Clip: thermal, visit 3, still recording (started 2026-11-09T04:50:27Z); it appears here when the step ends.**+**Clip: thermal, visit 3, the PCB editor from 2026-11-09T04:50:27Z to 2026-11-09T04:50:43Z. Motion only: 0.3 min of real time, 1 s of it had something moving; the clock in the corner is the real elapsed time.**++<video width="100%" controls><source src="/blob/app/65-keyboard/docs/runs/65-keyboard-claude-opus-5-5-20261109-0022/thermal-3.mp4" type="video/mp4"></video>++**Contact sheet: nine frames spread through the thermal, visit 3 clip, what the camera saw.**++![nine frames of thermal, visit 3](/blob/app/65-keyboard/docs/runs/65-keyboard-claude-opus-5-5-20261109-0022/thermal-3-sheet.png)  **Screenshot: the board when thermal, visit 3 began.**  ![the board when thermal, visit 3 began](/blob/app/65-keyboard/docs/runs/65-keyboard-claude-opus-5-5-20261109-0022/shot-thermal-3-start.png) +**Screenshot: the board when thermal, visit 3 ended.**++![the board when thermal, visit 3 ended](/blob/app/65-keyboard/docs/runs/65-keyboard-claude-opus-5-5-20261109-0022/shot-thermal-3-end.png)++### pours, visit 3 (rework)++What this step does: pour every net the spec names, keepouts along Kelvin taps, thermal and stitching vias, land, measure the copper kept++Why the AI came back here: Fields ground offset 15 mV under U1: add GND stitching vias between the pours++**Clip: pours, visit 3 (rework), still recording (started 2026-11-09T04:50:46Z); it appears here when the step ends.**++**Screenshot: the board when pours, visit 3 (rework) began.**++![the board when pours, visit 3 (rework) began](/blob/app/65-keyboard/docs/runs/65-keyboard-claude-opus-5-5-20261109-0022/shot-pours-3-start.png)+ ## Plan usage, the second cost line  Percent of each plan limit used, as the provider reports it, at the start of the run and at its end.