4.7 µF Capacitor 0805 - Samsung CL21A475KAQNNNG

Samsung Electro-Mechanics CL21A475KAQNNNG: 0805 MLCC, 4.7 µF ±10% X5R, 25 V. An Adom Basic Part: Adom keeps it on reels for its pick-and-place line, so boards built with it draw on Adom stock.

Key specs

Notes for designers

CL21A475KAQNNNG is a 4.7 µF ±10% X5R ceramic in 0805, rated 25 V (p.1), enough capacitance for regulator input/output duty while keeping a tight 10% tolerance that the 22 µF and 47 µF members of this family give up. X5R holds capacitance within ±15% from −55 to +85 °C. (p.2)

Dissipation factor is 0.1 max at 1 kHz / 1.0 Vrms, insulation resistance is 10,000 MΩ or 100 MΩ·µF whichever is smaller, and the dielectric is proofed at 250% of rated voltage. Note how capacitance is measured: after a 150 °C bake and a 24-hour rest. (p.2) That protocol exists because Class II ceramic ages, capacitance drifts down with the log of time after the last thermal reset, so a fresh-off-the-reflow board reads higher than the same board a year later. (p.12)

The other Class II tax is DC bias: effective capacitance falls as working voltage rises, and the product manual requires checking the bias curve rather than assuming 4.7 µF at your rail. (p.14) The X5R window also closes at +85 °C. (p.2) Reflow is rated 260±5 °C peak for 30 s, and it ships on embossed tape on a 7-inch reel. (p.2, p.1)

3D model provenance

The STEP is Samsung Electro-Mechanics' own model (CL21A105KAQ1INE.STEP, published through SnapEDA as "Created with Samsung"). Samsung builds its MLCC models at the top of the thickness tolerance, so this one is 1.41 mm tall against the 1.25 +/- 0.15 mm thickness Samsung lists for this part. Samsung exports it lying on its side (Y up); it is stood upright (Z up, seated on the board) without changing its shape or colours. Samsung's file is kept byte for byte in provenance/, beside the previous model.

Footprint

Redrawn from the datasheet land pattern (the previous pads were off by up to 0.326 mm).

Source: Land pattern from Samsung MLCC Product Manual, section 5-4 Land dimension (Reflow Footprint), p.32 (5-4 Land dimension, Reflow Footprint).

Chip outline

The part's 3D outline in the standard pose (pad 1 toward the viewer), drawn from the STEP by Adom's OpenCascade service; the part number sits where the laser-etched mark is on the 3D model and reads the same way.

Symbol options

The default symbol, CL21A475KAQNNNG.kicad_sym (the one in the Symbol & Footprint panel), is the plain standard symbol. CL21A475KAQNNNG-outline.kicad_sym is the same symbol with the part's 3D chip outline drawn beside it, its part number placed and reading as on the 3D model.

Ordering

Downloads

Provenance

Packaging-code source note

The attached legacy PDF is named for CL21A475KAQNNNG, but its first page actually identifies CL21A475KAQNNNE. Treat it as a related packaging-variant reference, not an exact-G order-code sheet. Samsung's current CL21A475KAQNNN# family page, checked2026-10-11, explicitly lists both E and G and confirms the same nominal dimensions,4.7µF,±10%,X5R and25V ratings. Its packaging table groups5/E/G as embossed7-inch reels with quantity options. Preserve the ordered G suffix and verify reel quantity separately; do not infer that E and G are interchangeable purchasing codes.

• Datasheet: SPECIFICATION (Reference sheet), per-MPN Samsung MLCC spec sheets (pages 4-36 of the full docs are the generic 'MLCC Product Manual' annex), revised No version/revision number printed in any of the 8 docs. Only in-body date: 'Product specifications included in the specifications are effective as of March 1, 2013.' (page 2 of all 8 docs)., Samsung Electro-Mechanics. md5 e1361b12ea4f9711d783c926ba139e58
• Footprint: Land pattern from Samsung MLCC Product Manual, section 5-4 Land dimension (Reflow Footprint), p.32 (5-4 Land dimension, Reflow Footprint). Pads redrawn on 2026-10-03.
• 3D model and symbol: unchanged by the footprint pass; the etched STEP adds a flat virtual part-number mark (an identification aid, not the maker's marking).

More

• Datasheet pages: the 36 datasheet pages as images.
• Assembly animation: the part dropping onto its pads, and Adom's pick-and-place picking it from tape.