(footprint CAPC2012X95N (layer F.Cu) (tedit 6A43F5B1)
  (descr "")
  (attr smd)
  (fp_text reference REF** (at -0.41 -1.27 0) (layer F.SilkS)
    (effects (font (size 0.393700787402 0.393700787402) (thickness 0.15)))
  )
  (fp_text value CAPC2012X95N (at 1.34 1.27 0) (layer F.Fab)
    (effects (font (size 0.393700787402 0.393700787402) (thickness 0.15)))
  )
  (pad 1 smd roundrect (roundrect_rratio 0.125) (at -0.888 0.0) (size 1.05 1.38) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 2 smd roundrect (roundrect_rratio 0.125) (at 0.888 0.0) (size 1.05 1.38) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (fp_line (start 1.0 0.63) (end -1.0 0.63) (layer F.Fab) (width 0.127))
  (fp_line (start 1.0 -0.63) (end -1.0 -0.63) (layer F.Fab) (width 0.127))
  (fp_line (start 1.0 0.63) (end 1.0 -0.63) (layer F.Fab) (width 0.127))
  (fp_line (start -1.0 0.63) (end -1.0 -0.63) (layer F.Fab) (width 0.127))
  (fp_line (start -1.663 0.94) (end 1.663 0.94) (layer F.CrtYd) (width 0.05))
  (fp_line (start -1.663 -0.94) (end 1.663 -0.94) (layer F.CrtYd) (width 0.05))
  (fp_line (start -1.663 0.94) (end -1.663 -0.94) (layer F.CrtYd) (width 0.05))
  (fp_line (start 1.663 0.94) (end 1.663 -0.94) (layer F.CrtYd) (width 0.05))
)