LW A6SG-V2BA-FK0PN0

@@ -0,0 +1,123 @@+# LW A6SG-V2BA-FK0PN0++**ams OSRAM** · Standard LEDs - SMD, White SIDELED® · SIDELED®++A white, side-emitting SIDELED® from ams OSRAM: light leaves through the domed+lens on one *vertical* face, parallel to the board, rather than upward. ThinGaN+chip, diffused silicone resin, 120° Lambertian, binned to Cx = Cy = 0.33 and+900–2240 mcd at 20 mA. Ordering code Q65113A1198.++Pinout, land pattern and body dimensions are read off the manufacturer+datasheet; the symbol, footprint and 3D model are generated from those numbers.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | K | passive | Cathode. The datasheet's dimensional drawing (p.14) labels this lead 'Cathode' and puts the cathode marking on this side of the package; the chamfered body corner in the 3D model and the silkscreen triangle both mark it. Return the LED current here. |+| 2 | A | passive | Anode. Drive at IF = 20 mA typical, 5 mA min to 50 mA max (p.3). VF is 2.90 V min / 3.00 V typ / 3.50 V max at 20 mA (p.4), so size the series resistor from VF max, not typ. Never connect to a fixed supply without current limiting. |++Pin 1 is the cathode. The package carries a cathode marking on that side+(datasheet p.14); the footprint repeats it as a filled silkscreen triangle and+the 3D model as a chamfered body corner.++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | ams OSRAM |+| Package | SIDELED®, 2-lead gull-wing, side-emitting |+| Category | LED |+| Pins | 2 |+| Colour | White, Cx = 0.33 / Cy = 0.33 (CIE 1931) |+| Luminous intensity | 900 … 2240 mcd at IF = 20 mA |+| Forward voltage | 3.00 V typ, 3.50 V max at IF = 20 mA |+| Forward current | 20 mA typ, 50 mA max (5 mA min) |+| Viewing angle | 120° (2φ at 50 % IV) |+| Body size | 4.00 × 3.63 × 3.97 mm (0.80 mm standoff) |++## Electrical and optical++| Parameter | Symbol | Min | Typ | Max | Unit | Conditions |+|---|---|---|---|---|---|---|+| Forward voltage | VF | 2.90 | 3.00 | 3.50 | V | IF = 20 mA (p.4) |+| Forward current | IF | 5 | 20 | 50 | mA | TS = 25 °C (p.3) |+| Surge current | IFS | — | — | 300 | mA | t ≤ 10 µs, D = 0.005 (p.3) |+| Reverse voltage | VR | — | — | 5 | V | TS = 25 °C (p.3) |+| Reverse current | IR | — | 0.01 | 10 | µA | VR = 5 V (p.4) |+| Luminous intensity | IV | 900 | — | 2240 | mcd | IF = 20 mA, bins V2…BA (p.2, p.5) |+| Chromaticity | Cx / Cy | — | 0.33 / 0.33 | — | — | CIE 1931, bin group FK0PN0 (p.4) |+| Thermal resistance | RthJS | — | — | 220 | K/W | junction to solder point, real (p.4) |+| Thermal resistance | RthJA | — | — | 380 | K/W | junction to ambient, real (p.4) |+| Junction temperature | Tj | — | — | 125 | °C | p.3 |+| Operating temperature | Top | -40 | — | 110 | °C | p.3 |++Brightness bins for this ordering code: V2 (900–1120 mcd), AA (1120–1400),+AB (1400–1800), BA (1800–2240), all at IF = 20 mA (p.5). Chromaticity bin+group FK0…PN0 (p.6–8). MSL 2 per JEDEC J-STD-020E, reflow peak 245 °C+(p.16). ESD 2 kV HBM Class 2. Corrosion robustness class 1B. Approximate+weight 67.0 mg.++## Land pattern++From the datasheet's *Recommended Solder Pad* drawing (p.15):++| | Value |+|---|---|+| Pads | 2 × SMD roundrect, 1.20 × 3.00 mm |+| Outer span | 3.70 mm (pads centred at x = ±1.25 mm) |+| Copper area | > 16 mm² per pad recommended for heat dissipation |+| Courtyard | 4.50 × 4.13 mm |++Lead spacing on the part is 2.54 mm (p.14) while the recommended land is drawn+on a 2.50 mm pitch — the 0.04 mm difference sits well inside the 1.2 mm pad for+a 1.0 mm lead, and the footprint follows the manufacturer's land drawing.++The datasheet asks for a nitrogen reflow atmosphere for best joint quality, and+the package is **not** suitable for ultrasonic cleaning (p.15).++## CAD++- **Symbol** `LW_A6SG-V2BA-FK0PN0` — standard 2-pin LED, pin 1 K / pin 2 A.+- **Footprint** `LED_SIDELED_LW-A6SG` — emission direction is **−Y**, marked with an arrow+  and the Ø2.4 mm lens window on F.Fab.+- **3D** `lw-a6sg-v2ba-fk0pn0.step` (+ GLB) — 4.00 × 3.63 × 4.77 mm envelope including the+  0.80 mm lead standoff, origin on the land pattern, part sitting on Z = 0.+- **EAGLE** `lw-a6sg-v2ba-fk0pn0.lbr` — same package, symbol and device set.++## Provenance++Everything here is traceable to the manufacturer datasheet rather than a+distributor listing:++- **Datasheet:** [ams OSRAM, *LW A6SG binning FK0PN0*, v1.1, 2020-06-01](docs/lw-a6sg-v2ba-fk0pn0-datasheet.pdf)+  (25 pp, sha256 `93722427bd3f7bbb`, retrieved 2026-08-27)+- **Pins and electricals:** read from pp. 2–6 and 14–16; every row above cites+  its page.+- **Land pattern:** p.15 *Recommended Solder Pad*, used as drawn.+- **Body outline:** p.14 *Dimensional Drawing* — 4 ±0.2 × 3.63 ±0.2 mm plan,+  3.97 +0.23/−0.17 mm tall, 2.85 mm body depth, 0.80 mm standoff, Ø2.4 mm lens,+  2.54 mm lead spacing, 1 ±0.1 mm lead width.++Two things the datasheet does not dimension, chosen and recorded here rather+than invented silently:++1. **Body-to-land offset.** The solder-pad drawing gives no body-relative+   origin, so the 3.63 mm body envelope is centred on the land pattern.+2. **Lead-frame thickness (0.20 mm) and foot length**, and the size of the+   cathode chamfer (0.50 mm), are representative — they affect the 3D model's+   appearance only, never the land pattern or the pinout.++## Sourcing++| Distributor | Part number | Note |+|---|---|---|+| Mouser | 720-LWA6SGA1366 | LW A6SG-V2BA-FK0PN0 |+| Mouser | 720-LWA6SGA1198 | LW A6SG-V2BA-FK0PN0-0-20-R33 (taped) |+| DigiKey | 475-LWA6SG-V2BA-FK0PN0-0-20-R33TR-ND | taped variant, in stock |++The bare `LW A6SG-V2BA-FK0PN0` ordering code is marked **obsolete / not recommended for new+designs**; the `-0-20-R33` tape-and-reel variant is the one still stocked. Check+availability before committing a design.++[Datasheet PDF](docs/lw-a6sg-v2ba-fk0pn0-datasheet.pdf)