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Contents

README

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ZXMN2F30FHQTA

Diodes Incorporated · MOSFETs · SOT-23-3

ZXMN2F30FHQTA from Diodes Incorporated, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; the top-view diagram shows G at the bottom-left lead, with VGSS rated ±12 V and VGS(TH) 0.6 V min to 1.5 V max at ID = 250µA.
2 S passive Source; the top-view diagram shows S at the bottom-right lead, and the body diode continuous forward current is 1.6 A max.
3 D passive Drain; the top-view diagram shows D on the single top lead, with VDSS of 20 V and continuous ID of 4.9 A at TA = +25°C.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-23-3
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 20 V VGS = 0V, ID = 250µA 2
Zero Gate Voltage Drain Current (TJ = +25C) IDSS 1 µA VDS = 20V, VGS = 0V 2
Gate-Source Leakage IGSS -100 100 nA VGS = ±12V, VDS = 0V 2
Gate Threshold Voltage VGS(TH) 0.6 0.9 1.5 V VDS = VGS, ID = 250µA 2
Static Drain-Source On-Resistance (VGS = 4.5V) RDS(ON) 45 mΩ VGS = 4.5V, ID = 2.5A 2
Static Drain-Source On-Resistance (VGS = 2.5V) RDS(ON) 65 mΩ VGS = 2.5V, ID = 2.0A 2
Diode Forward Voltage VSD 0.75 1.2 V VGS = 0V, IS = 1.25A 2
Drain-Source Voltage VDSS 20 V 2
Gate-Source Voltage VGSS -12 12 V 2
Continuous Drain Current at TA = +25°C ID 4.9 A VGS = 4.5V, steady state, TA = +25°C 2
Continuous Drain Current at TA = +70°C ID 4 A VGS = 4.5V, steady state, TA = +70°C 2
Maximum Continuous Body Diode Forward Current IS 1.6 A Note 6 2
Pulsed Drain Current IDM 22.6 A 10µs pulse, duty cycle = 1% 2
Total Power Dissipation (mounted on minimum recommended pad layout) PD 0.96 W Note 5: FR-4 PCB, minimum recommended pad layout 2
Thermal Resistance, Junction to Ambient (minimum pad layout) RθJA 131 °C/W Note 5, steady state 2
Total Power Dissipation (1in x 1in FR-4 PCB) PD 1.4 W Note 6: 1in x 1in FR-4 PCB, high coverage 2oz copper, single sided 2
Thermal Resistance, Junction to Ambient (1in x 1in FR-4 PCB) RθJA 89 °C/W Note 6, steady state 2
Operating and Storage Temperature Range TJ, TSTG -55 150 °C 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper tin  Terminals: Finish Matte Tin Annealed over Copper Leadframe. 1

CAD (KiCad official)

  • Symbol: ZXMN2F30FHQTA
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3 (KiCad packages3D, STEP)
  • 3D model files: zxmn2f30fhqta-etched.step / zxmn2f30fhqta-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); zxmn2f30fhqta.step / zxmn2f30fhqta.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (6 pp, sha256 e1a993fb51431ad0, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF