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ZXGD3009DYTA

Public Made by Adom

by adom

Diodes Incorporated Gate Drive ICs, SOT-363. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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ZXGD3009DYTA

Diodes Incorporated · Gate Drive ICs · SOT-363

ZXGD3009DYTA from Diodes Incorporated, in a SOT-363. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in Positive supply voltage (high) of the gate driver, rated 40V maximum with respect to VEE.
2 IN input Driver input, rated 40V maximum with respect to VEE and 1A peak pulsed input current; about 10mA of input drives about 500mA at the output.
3 VEE power_in Negative supply voltage (low) of the gate driver, the reference for VCC and VIN.
4 SOURCE output Source current output for MOSFET turn-on, with up to 1A peak source current; typically connected to SINK.
5 NC unconnected Not internally connected.
6 SINK output Sink current output for MOSFET turn-off, with up to 1A peak sink current; typically connected to SOURCE.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-363
Category Power Management ICs
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage, with Respect to VEE VCC 40 V 2
Input Voltage, with Respect to VEE VIN 40 V 2
Output Difference Voltage (Source, Sink) V(source-sink) -7 7 V 2
Peak Pulsed Output Current (Source and Sink) IOM -2 2 A 2
Peak Pulsed Input Current IIM -1 1 A 2
Power Dissipation PD 320 mW Notes 5 & 7 2
Power Dissipation PD 277 mW Notes 6 & 7 2
Thermal Resistance, Junction to Ambient RθJA 391 °C/W Notes 5 & 7 2
Thermal Resistance, Junction to Ambient RθJA 450 °C/W Notes 6 & 7 2
Thermal Resistance, Junction to Lead RθJL 350 °C/W Note 8 2
Operating and Storage Temperature Range TJ, TSTG -55 150 °C 2
Electrostatic Discharge, Human Body Model ESD HBM 4000 V JEDEC Class 3A 2
Electrostatic Discharge, Machine Model ESD MM 400 V JEDEC Class C 2
Supply Breakdown Voltage BVCC 40 V IQ = 100µA, VIN = VCC 3
Quiescent Supply Current IQ 20 nA VCC = 32V, VIN = VCC 3

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Finish - Matte Tin Plated Leads. Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: ZXGD3009DYTA
  • Footprint: Package_TO_SOT_SMD:SOT-363_SC-70-6
  • 3D model: SOT-363 (KiCad packages3D, STEP)
  • 3D model files: zxgd3009dyta-etched.step / zxgd3009dyta-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); zxgd3009dyta.step / zxgd3009dyta.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (8 pp, sha256 c02d3f2571d2516e, retrieved 2026-11-06, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF