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Contents

README

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ZX0504B

XCH(旭昌辉) · IC · SOT-23-5

ZX0504B from XCH(旭昌辉), in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 I/O1 passive Protected I/O line (any I/O to ground: VRWM 5.0 V, clamping 10.8 V at IPP = 1 A and 15 V at IPP = 8 A, tp = 8/20 μs).
2 GND power_in Common ground/reference node of the TVS diode array, to which all I/O clamping voltages are referenced.
3 I/O2 passive Protected I/O line (any I/O to ground: VRWM 5.0 V, clamping 10.8 V at IPP = 1 A and 15 V at IPP = 8 A, tp = 8/20 μs).
4 I/O3 passive Protected I/O line (any I/O to ground: VRWM 5.0 V, clamping 10.8 V at IPP = 1 A and 15 V at IPP = 8 A, tp = 8/20 μs).
5 I/O4 passive Protected I/O line (any I/O to ground: VRWM 5.0 V, clamping 10.8 V at IPP = 1 A and 15 V at IPP = 8 A, tp = 8/20 μs).

Key specifications

Parameter Value
Manufacturer XCH(旭昌辉)
Package SOT-23-5
Category
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Working Voltage VRWM 5 V Any I/O to Ground 2
Reverse Breakdown Voltage VBR 6 V IT = 1mA, Any I/O to Ground 2
Reverse Leakage Current IR 1 μA VRWM = 5V, Any I/O to Ground 2
Clamping Voltage VC 10.8 V IPP = 1A, tp =8/20μs, any I/O pin to Ground 2
Clamping Voltage VC 15 V IPP = 8A, tp =8/20μs, any I/O pin to Ground 2
Junction Capacitance CJ 30 60 pF VR = 0V, f = 1MHz, between I/O pins 2
Junction Capacitance CJ 50 100 pF VR = 0V, f = 1MHz, any I/O pin to Ground 2
Peak Pulse Power (tp = 8/20μs) PPK 150 Watts tp = 8/20μs 1
Lead Soldering Temperature TL 260 ℃ 10 sec. 1
Operating Temperature TJ -55 125 ℃ 1
Storage Temperature TSTG -55 150 ℃ 1

CAD (KiCad official)

  • Symbol: ZX0504B
  • Footprint: Package_TO_SOT_SMD:SOT-23-5
  • 3D model: SOT-23-5 (KiCad packages3D, STEP)
  • 3D model files: zx0504b-etched.step / zx0504b-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); zx0504b.step / zx0504b.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XCH(旭昌辉) datasheet (5 pp, sha256 8a4b7719b93b1308, retrieved 2026-11-07, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF