# ZX0311P

**XCH(旭昌辉)** · IC · DFN1006-2L

ZX0311P from XCH(旭昌辉), in a DFN1006-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Bidirectional TVS diode terminal 1 (marked with pin-1 index), stand-off voltage 3.3V, breakdown 4.5V min at 1mA, ESD rated 8kV contact / 15kV air per IEC 61000-4-2. |
| 2 | 2 | passive | Bidirectional TVS diode terminal 2, the opposite terminal of the single protection diode, with 3.3V working voltage and 18pF max junction capacitance at 0V, 1MHz. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | XCH(旭昌辉) |
| Package | DFN1006-2L |
| Category |  |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| ESD contact discharge rating (IEC 61000-4-2) | ESD |  |  | 8 | kV | Contact discharge, IEC 61000-4-2 row | 1 |
| ESD air discharge rating (IEC 61000-4-2) | ESD |  |  | 15 | kV | Air discharge, IEC 61000-4-2 row | 1 |
| Operating Temperature | TJ | -55 |  | 125 | ℃ |  | 1 |
| Storage Temperature | TSTG | -55 |  | 150 | ℃ |  | 1 |
| Lead Soldering Temperature | TL |  |  | 260 | ℃ | 10 sec | 1 |
| Reverse Breakdown Voltage | VBR | 4.5 |  |  | V | IT = 1mA | 2 |
| Reverse Working Voltage | VRWM |  |  | 3.3 | V |  | 2 |
| Reverse Leakage Current | IR |  |  | 1 | μA | VRWM = 3.3V | 2 |
| Clamping Voltage | VC |  |  | 9.5 | V | IPP = 1A, tp = 8/20μs | 2 |
| Clamping Voltage | VC |  |  | 14.8 | V | IPP = 5A, tp = 8/20μs | 2 |
| Junction Capacitance | CJ |  | 18 |  | pF | VR = 0V, f = 1MHz | 2 |

## CAD (KiCad official)

- Symbol: `ZX0311P`
- Footprint: `Diode_SMD:D_SOD-882`
- 3D model: DFN1006-2L (KiCad packages3D, STEP)
- 3D model files: `zx0311p-etched.step` / `zx0311p-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `zx0311p.step` / `zx0311p.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [XCH(旭昌辉) datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603363121918722049) (4 pp, sha256 `2d982a23a1b01b2f`, retrieved 2026-10-23, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/zx0311p-datasheet.pdf)