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ZSC31014EIG1-T
Public Made by Adomby adom
RENESAS Interface - Specialized, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownZSC31014EIG1-T
RENESAS · Interface - Specialized · SOIC-8
ZSC31014EIG1-T from RENESAS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VSS | power_in | Ground supply; must be connected to GND. |
| 2 | BSINK | passive | Switched ground for bridge sink, an optional power-saving feature; must be left unconnected if not used. |
| 3 | VBP | input | Positive input for the differential signal (bridge positive). |
| 4 | VBN | input | Negative input for the differential signal (bridge negative). |
| 5 | SCL/SCLK | input | I2C clock in I2C mode, serial clock in SPI mode. |
| 6 | SDA/MISO | bidirectional | I2C data in I2C mode, Master-In-Slave-Out in SPI mode. |
| 7 | INT/SS | bidirectional | Interrupt (conversion complete) output in I2C mode, Slave Select input in SPI mode; must be left unconnected if not used. |
| 8 | VDD | power_in | Supply voltage of 2.7-5.5V; must be connected to Vsupply. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | RENESAS |
| Package | SOIC-8 |
| Category | Interface ICs |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Analog Supply Voltage | VDD | -0.3 | 6 | V | 6 | ||
| Storage Temperature Range (≥10 hours) | TSTOR | -50 | 150 | °C | ≥10 hours | 6 | |
| Storage Temperature Range (<10 hours) | TSTOR<10h | -50 | 170 | °C | <10 hours | 6 | |
| Analog Supply Voltage to Gnd | VDD | 2.7 | 5.5 | V | 6 | ||
| Ambient Temperature Range | TAMB | -40 | 125 | °C | 6 | ||
| CM Voltage Range | VIN | 1 | V | Max is VDD -1.2 V | 6 | ||
| External Capacitance between VDD and Gnd | CVDD | 100 | 220 | 470 | nF | 6 | |
| Pull-up on SDA and SCL | RPU | 1 | kΩ | 6 | |||
| Bridge Resistance | RBR | 0.2 | 100 | kΩ | 6 | ||
| Update Mode Supply Current, minimum update rate | IDD | 70 | 120 | μA | At minimum update rate (1MHz clock) | 7 | |
| Update Mode Supply Current, maximum update rate | IDD | 2000 | 2500 | μA | At maximum update rate (4MHz clock) | 7 | |
| Sleep Mode Supply Current | Isndby | 0.5 | 5 | μA | -40°C to +85°C | 7 | |
| Power-On-Reset Level | POR | 1.8 | 2.5 | V | 7 | ||
| Leakage Current Pins VBP,VBN | IIN_LEAK | -20 | 20 | nA | Sensor connection and short checks must be disabled | 7 | |
| Data Retention | tWRI_EEP | 10 | Years | At 100°C | 7 | ||
| Resolution | rADC | 14 | Bits | 7 | |||
| Temperature Resolution | 11 | Bits | 7 | ||||
| Integral Nonlinearity (INL) | INLADC | -4 | 4 | LSB | Based on ideal slope | 7 | |
| Differential Nonlinearity (DNL) | DNLADC | -1 | 1 | LSB | 7 | ||
| Input Low Level | VIN_low | 0 | 0.2 | VDD | SDA/MISO and SCL/SCLK | 7 | |
| Input High Level | VIN_high | 0.8 | 1 | VDD | SDA/MISO and SCL/SCLK | 7 | |
| Input leakage to VSS | Iil | -1 | 1 | µa | SDA/MISO, SCL/SCLK, and INT/SS with output disabled | 7 | |
| Input leakage to VDD | Iih | -1 | 1 | µa | SDA/MISO and INT/SS with output disabled | 7 | |
| Input leakage to VDD, weak pull-up | Iih_PU | -5 | -1.2 | µa | SCL/SCLK with weak pull-up | 7 | |
| Output Sourcing Current SDA/MISO | IOH_SDA/MISO | -4.8 | -3.1 | -1.9 | mA | SDA/MISO @VOH = VDD -0.2v | 7 |
| Output Sourcing Current INT/SS | IOH_INT/SS | -1.9 | -1.2 | -0.63 | mA | INT/SS @VOH= VDD -0.2v | 7 |
| Temperature sensor bridge sensitivity | 0.28 | 0.38 | 0.5 | mV/V/K | 18 | ||
| Temperature sensor bridge resistance | 15 | 20 | 25 | kΩ | 18 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | silver | 1.61 December 6, 2012 Update for contact information for Zentrum Mikroelektronik Dresden AG Korea Office and phone numbers for USA office. | 57 |
CAD (KiCad official)
- Symbol:
ZSC31014EIG1-T - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
zsc31014eig1-t-etched.step/zsc31014eig1-t-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);zsc31014eig1-t.step/zsc31014eig1-t.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: RENESAS datasheet (59 pp, sha256
d4f0d68e4b9fe33a, retrieved 2026-10-31, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).