component
ZGAD65D14C
Public Made by Adomby adom
Zynalog Analog To Digital Converters (ADCs), QFN-64(9x9). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
main
ZGAD65D14C
Zynalog · Analog To Digital Converters (ADCs) · QFN-64(9x9)
ZGAD65D14C from Zynalog, in a QFN-64(9x9). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD | power_in | 1.8V analog supply, bypass to ground with 0.1µF ceramic capacitor (pins 1, 2, 64 may share one capacitor). |
| 2 | VDD | power_in | 1.8V analog supply, bypass to ground with 0.1µF ceramic capacitor (pins 1, 2, 64 may share one capacitor). |
| 3 | GND | power_in | Power ground; the exposed pad on the back must be soldered to PCB ground. |
| 4 | VinA+ | input | Channel A differential analog input, positive. |
| 5 | VinA- | input | Channel A differential analog input, negative. |
| 6 | GND | power_in | Power ground; the exposed pad on the back must be soldered to PCB ground. |
| 7 | SENSE | input | Reference select: tie to VDD for internal reference with ±1V input range, or apply an external 1.2V to 1.3V reference for an input range of ±0.8*VSENSE. |
| 8 | VREF | power_in | Reference voltage output, nominally 1.25V, bypass to ground with 2.2µF ceramic capacitor. |
| 9 | GND | power_in | Power ground; the exposed pad on the back must be soldered to PCB ground. |
| 10 | VCM | output | Common-mode bias output, nominally 0.435*VDD, used to set the analog input common mode, bypass to ground with 0.1µF ceramic capacitor. |
| 11 | GND | power_in | Power ground; the exposed pad on the back must be soldered to PCB ground. |
| 12 | VinB- | input | Channel B differential analog input, negative. |
| 13 | VinB+ | input | Channel B differential analog input, positive. |
| 14 | GND | power_in | Power ground; the exposed pad on the back must be soldered to PCB ground. |
| 15 | VDD | power_in | 1.8V analog supply, bypass to ground with 0.1µF ceramic capacitor (pins 15, 16, 17 may share one capacitor). |
| 16 | VDD | power_in | 1.8V analog supply, bypass to ground with 0.1µF ceramic capacitor (pins 15, 16, 17 may share one capacitor). |
| 17 | VDD | power_in | 1.8V analog supply, bypass to ground with 0.1µF ceramic capacitor (pins 15, 16, 17 may share one capacitor). |
| 18 | GND | power_in | Power ground; the exposed pad on the back must be soldered to PCB ground. |
| 19 | CLK+ | input | Clock input; conversion starts on the rising edge. |
| 20 | CLK- | input | Clock input; conversion starts on the falling edge. |
| 21 | GND | power_in | Power ground; the exposed pad on the back must be soldered to PCB ground. |
| 22 | OFB | output | Overflow/underflow digital CMOS output; high when overflow or underflow occurs (OF is low). |
| 23 | OF | output | Overflow/underflow digital CMOS output; low when overflow or underflow occurs (OFB is high). |
| 24 | DB0 | output | Channel B CMOS digital output bit 0 (D13 is the MSB). |
| 25 | DB1 | output | Channel B CMOS digital output bit 1 (D13 is the MSB). |
| 26 | DB2 | output | Channel B CMOS digital output bit 2 (D13 is the MSB). |
| 27 | DB3 | output | Channel B CMOS digital output bit 3 (D13 is the MSB). |
| 28 | DB4 | output | Channel B CMOS digital output bit 4 (D13 is the MSB). |
| 29 | DB5 | output | Channel B CMOS digital output bit 5 (D13 is the MSB). |
| 30 | DB6 | output | Channel B CMOS digital output bit 6 (D13 is the MSB). |
| 31 | DB7 | output | Channel B CMOS digital output bit 7 (D13 is the MSB). |
| 32 | DVDD | power_in | 1.8V supply for the digital output drivers, bypass to ground with its own 0.1µF ceramic capacitor. |
| 33 | DGND | power_in | Ground for the digital output drivers. |
| 34 | DB8 | output | Channel B CMOS digital output bit 8 (D13 is the MSB). |
| 35 | DB9 | output | Channel B CMOS digital output bit 9 (D13 is the MSB). |
| 36 | DB10 | output | Channel B CMOS digital output bit 10 (D13 is the MSB). |
| 37 | DB11 | output | Channel B CMOS digital output bit 11 (D13 is the MSB). |
| 38 | DB12 | output | Channel B CMOS digital output bit 12 (D13 is the MSB). |
| 39 | DB13 | output | Channel B CMOS digital output bit 13, the MSB. |
| 40 | CLKOUTB | output | CMOS data output clock, inverted relative to CLKOUT. |
| 41 | CLKOUT | output | CMOS data output clock. |
| 42 | DA0 | output | Channel A CMOS digital output bit 0 (D13 is the MSB). |
| 43 | DA1 | output | Channel A CMOS digital output bit 1 (D13 is the MSB). |
| 44 | DA2 | output | Channel A CMOS digital output bit 2 (D13 is the MSB). |
| 45 | DA3 | output | Channel A CMOS digital output bit 3 (D13 is the MSB). |
| 46 | DA4 | output | Channel A CMOS digital output bit 4 (D13 is the MSB). |
| 47 | DA5 | output | Channel A CMOS digital output bit 5 (D13 is the MSB). |
| 48 | DGND | power_in | Ground for the digital output drivers. |
| 49 | DVDD | power_in | 1.8V supply for the digital output drivers, bypass to ground with its own 0.1µF ceramic capacitor. |
| 50 | DA6 | output | Channel A CMOS digital output bit 6 (D13 is the MSB). |
| 51 | DA7 | output | Channel A CMOS digital output bit 7 (D13 is the MSB). |
| 52 | DA8 | output | Channel A CMOS digital output bit 8 (D13 is the MSB). |
| 53 | DA9 | output | Channel A CMOS digital output bit 9 (D13 is the MSB). |
| 54 | DA10 | output | Channel A CMOS digital output bit 10 (D13 is the MSB). |
| 55 | DA11 | output | Channel A CMOS digital output bit 11 (D13 is the MSB). |
| 56 | DA12 | output | Channel A CMOS digital output bit 12 (D13 is the MSB). |
| 57 | DA13 | output | Channel A CMOS digital output bit 13, the MSB. |
| 58 | GND | power_in | Power ground; the exposed pad on the back must be soldered to PCB ground. |
| 59 | SPI_MISO | output | SPI MISO in serial mode (MODE=0); open-drain output needing a 2K pull-up to the 1.8V to 3.3V SPI supply for readback, no function in parallel mode. |
| 60 | SPI_MOSI | input | SPI MOSI port in serial interface mode (MODE=0). |
| 61 | SPI_SCLK | input | SPI SCLK in serial mode (MODE=0); in parallel mode (MODE=VDD) low is normal operation and high (1.8V to 3.3V) enters sleep mode. |
| 62 | SPI_CS | input | SPI CS in serial mode (MODE=0); in parallel mode (MODE=VDD) low turns the clock duty cycle stabilizer off and high (1.8V to 3.3V) turns it on. |
| 63 | MODE | input | Serial/parallel mode select: GND enables SPI mode, VDD enables parallel GPIO mode; connect directly to GND or VDD, not to a logic signal. |
| 64 | VDD | power_in | 1.8V analog supply, bypass to ground with 0.1µF ceramic capacitor (pins 1, 2, 64 may share one capacitor). |
| 65 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Zynalog |
| Package | QFN-64(9x9) |
| Category | ADC/DAC/Data Conversion |
| Pins | 65 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Analog supply voltage | VDD | 1.7 | 1.8 | 1.9 | V | 4 | |
| Digital supply voltage | DVDD | 1.7 | 1.8 | 1.9 | V | 4 | |
| Analog supply current | I_VDD | 162 | 165 | mA | 4 | ||
| Digital supply current | I_DVDD | 12 | mA | 4 | |||
| Power at max sample rate | Power | 315 | mW | 4 | |||
| Low power mode | P_lowpower | 136 | mW | 4 | |||
| Sleep mode | P_sleep | 0.65 | mW | 4 | |||
| Integral nonlinearity | INL | -2 | 1 | 2 | LSB | 4 | |
| Differential nonlinearity | DNL | -0.6 | 0.35 | 0.6 | LSB | 4 | |
| Offset error | Offset Error | -13 | 5 | 13 | mV | 4 | |
| Gain error | Gain Error | -4 | 1 | 2.2 | %FS | 4 | |
| Signal-to-noise ratio | SNR | 71 | dB | 4 | |||
| Spurious-free dynamic range | SFDR | 92 | dB | 4 | |||
| Clock input to data acquisition delay | tAP | 0.2 | ns | VDD=1.8V, DVDD=1.8V, fS=65MHz | 9 | ||
| Clock high time | tH | 7.6 | 8 | ns | VDD=1.8V, DVDD=1.8V, fS=65MHz | 9 | |
| Clock low time | tL | 7.6 | 8 | ns | VDD=1.8V, DVDD=1.8V, fS=65MHz | 9 | |
| Clock input to clock output delay | tC | 1.3 | 1.6 | 2 | ns | VDD=1.8V, DVDD=1.8V, fS=65MHz | 9 |
| Clock input to data output delay | tD | 1.7 | 2 | 2.3 | ns | VDD=1.8V, DVDD=1.8V, fS=65MHz | 9 |
| Clock output to data output skew | tSKEW | 0.3 | 0.4 | 0.55 | ns | tC - tD; VDD=1.8V, DVDD=1.8V, fS=65MHz | 9 |
| CS low to CLK setup time | tS | 5 | ns | SPI_MISO pull-up 2KΩ | 14 | ||
| Data setup time | tDS | 5 | ns | SPI_MISO pull-up 2KΩ | 14 | ||
| Data hold time | tDH | 5 | ns | SPI_MISO pull-up 2KΩ | 14 | ||
| CLK to data output delay | tDO | 125 | ns | SPI_MISO pull-up 2KΩ | 14 | ||
| Clock period (write) | tSCK | 40 | ns | SPI_MISO pull-up 2KΩ | 14 | ||
| Clock period (readback) | tSCK | 250 | ns | SPI_MISO pull-up 2KΩ | 14 | ||
| CLK to CS high hold time | tH | 5 | ns | SPI_MISO pull-up 2KΩ | 14 | ||
| Supply voltage | VDD,DVDD | -0.3 | 2 | V | 6 | ||
| Analog input voltage | Analog Vin | -0.3 | V | -0.3 to VDD+0.2 | 6 | ||
| CLK, SENSE input voltage | CLK,SENSE | -0.3 | V | -0.3 to VDD+0.2 | 6 | ||
| SPI/GPIO digital voltage | SPI | 3.9 | V | VDD to 3.9 | 6 | ||
| CMOS data output voltage | Data Output | -0.3 | V | -0.3 to DVDD+0.2 | 6 | ||
| Working temperature | WORKING TEMP | -40 | 85 | °C | 6 | ||
| Storage temperature | STORAGE TEMP | -65 | 150 | °C | 6 |
CAD (KiCad official)
- Symbol:
ZGAD65D14C - Footprint:
Package_DFN_QFN:QFN-64-1EP_9x9mm_P0.5mm_EP6x6mm - 3D model: QFN-64(9x9) (KiCad packages3D, STEP)
- 3D model files:
zgad65d14c-etched.step/zgad65d14c-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);zgad65d14c.step/zgad65d14c.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Zynalog datasheet (18 pp, sha256
6ea7fa4f9e9c9972, retrieved 2026-10-31, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# ZGAD65D14C
**Zynalog** · Analog To Digital Converters (ADCs) · QFN-64(9x9)
ZGAD65D14C from Zynalog, in a QFN-64(9x9). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD | power_in | 1.8V analog supply, bypass to ground with 0.1µF ceramic capacitor (pins 1, 2, 64 may share one capacitor). |
| 2 | VDD | power_in | 1.8V analog supply, bypass to ground with 0.1µF ceramic capacitor (pins 1, 2, 64 may share one capacitor). |
| 3 | GND | power_in | Power ground; the exposed pad on the back must be soldered to PCB ground. |
| 4 | VinA+ | input | Channel A differential analog input, positive. |
| 5 | VinA- | input | Channel A differential analog input, negative. |
| 6 | GND | power_in | Power ground; the exposed pad on the back must be soldered to PCB ground. |
| 7 | SENSE | input | Reference select: tie to VDD for internal reference with ±1V input range, or apply an external 1.2V to 1.3V reference for an input range of ±0.8*VSENSE. |
| 8 | VREF | power_in | Reference voltage output, nominally 1.25V, bypass to ground with 2.2µF ceramic capacitor. |
| 9 | GND | power_in | Power ground; the exposed pad on the back must be soldered to PCB ground. |
| 10 | VCM | output | Common-mode bias output, nominally 0.435*VDD, used to set the analog input common mode, bypass to ground with 0.1µF ceramic capacitor. |
| 11 | GND | power_in | Power ground; the exposed pad on the back must be soldered to PCB ground. |
| 12 | VinB- | input | Channel B differential analog input, negative. |
| 13 | VinB+ | input | Channel B differential analog input, positive. |
| 14 | GND | power_in | Power ground; the exposed pad on the back must be soldered to PCB ground. |
| 15 | VDD | power_in | 1.8V analog supply, bypass to ground with 0.1µF ceramic capacitor (pins 15, 16, 17 may share one capacitor). |
| 16 | VDD | power_in | 1.8V analog supply, bypass to ground with 0.1µF ceramic capacitor (pins 15, 16, 17 may share one capacitor). |
| 17 | VDD | power_in | 1.8V analog supply, bypass to ground with 0.1µF ceramic capacitor (pins 15, 16, 17 may share one capacitor). |
| 18 | GND | power_in | Power ground; the exposed pad on the back must be soldered to PCB ground. |
| 19 | CLK+ | input | Clock input; conversion starts on the rising edge. |
| 20 | CLK- | input | Clock input; conversion starts on the falling edge. |
| 21 | GND | power_in | Power ground; the exposed pad on the back must be soldered to PCB ground. |
| 22 | OFB | output | Overflow/underflow digital CMOS output; high when overflow or underflow occurs (OF is low). |
| 23 | OF | output | Overflow/underflow digital CMOS output; low when overflow or underflow occurs (OFB is high). |
| 24 | DB0 | output | Channel B CMOS digital output bit 0 (D13 is the MSB). |
| 25 | DB1 | output | Channel B CMOS digital output bit 1 (D13 is the MSB). |
| 26 | DB2 | output | Channel B CMOS digital output bit 2 (D13 is the MSB). |
| 27 | DB3 | output | Channel B CMOS digital output bit 3 (D13 is the MSB). |
| 28 | DB4 | output | Channel B CMOS digital output bit 4 (D13 is the MSB). |
| 29 | DB5 | output | Channel B CMOS digital output bit 5 (D13 is the MSB). |
| 30 | DB6 | output | Channel B CMOS digital output bit 6 (D13 is the MSB). |
| 31 | DB7 | output | Channel B CMOS digital output bit 7 (D13 is the MSB). |
| 32 | DVDD | power_in | 1.8V supply for the digital output drivers, bypass to ground with its own 0.1µF ceramic capacitor. |
| 33 | DGND | power_in | Ground for the digital output drivers. |
| 34 | DB8 | output | Channel B CMOS digital output bit 8 (D13 is the MSB). |
| 35 | DB9 | output | Channel B CMOS digital output bit 9 (D13 is the MSB). |
| 36 | DB10 | output | Channel B CMOS digital output bit 10 (D13 is the MSB). |
| 37 | DB11 | output | Channel B CMOS digital output bit 11 (D13 is the MSB). |
| 38 | DB12 | output | Channel B CMOS digital output bit 12 (D13 is the MSB). |
| 39 | DB13 | output | Channel B CMOS digital output bit 13, the MSB. |
| 40 | CLKOUTB | output | CMOS data output clock, inverted relative to CLKOUT. |
| 41 | CLKOUT | output | CMOS data output clock. |
| 42 | DA0 | output | Channel A CMOS digital output bit 0 (D13 is the MSB). |
| 43 | DA1 | output | Channel A CMOS digital output bit 1 (D13 is the MSB). |
| 44 | DA2 | output | Channel A CMOS digital output bit 2 (D13 is the MSB). |
| 45 | DA3 | output | Channel A CMOS digital output bit 3 (D13 is the MSB). |
| 46 | DA4 | output | Channel A CMOS digital output bit 4 (D13 is the MSB). |
| 47 | DA5 | output | Channel A CMOS digital output bit 5 (D13 is the MSB). |
| 48 | DGND | power_in | Ground for the digital output drivers. |
| 49 | DVDD | power_in | 1.8V supply for the digital output drivers, bypass to ground with its own 0.1µF ceramic capacitor. |
| 50 | DA6 | output | Channel A CMOS digital output bit 6 (D13 is the MSB). |
| 51 | DA7 | output | Channel A CMOS digital output bit 7 (D13 is the MSB). |
| 52 | DA8 | output | Channel A CMOS digital output bit 8 (D13 is the MSB). |
| 53 | DA9 | output | Channel A CMOS digital output bit 9 (D13 is the MSB). |
| 54 | DA10 | output | Channel A CMOS digital output bit 10 (D13 is the MSB). |
| 55 | DA11 | output | Channel A CMOS digital output bit 11 (D13 is the MSB). |
| 56 | DA12 | output | Channel A CMOS digital output bit 12 (D13 is the MSB). |
| 57 | DA13 | output | Channel A CMOS digital output bit 13, the MSB. |
| 58 | GND | power_in | Power ground; the exposed pad on the back must be soldered to PCB ground. |
| 59 | SPI_MISO | output | SPI MISO in serial mode (MODE=0); open-drain output needing a 2K pull-up to the 1.8V to 3.3V SPI supply for readback, no function in parallel mode. |
| 60 | SPI_MOSI | input | SPI MOSI port in serial interface mode (MODE=0). |
| 61 | SPI_SCLK | input | SPI SCLK in serial mode (MODE=0); in parallel mode (MODE=VDD) low is normal operation and high (1.8V to 3.3V) enters sleep mode. |
| 62 | SPI_CS | input | SPI CS in serial mode (MODE=0); in parallel mode (MODE=VDD) low turns the clock duty cycle stabilizer off and high (1.8V to 3.3V) turns it on. |
| 63 | MODE | input | Serial/parallel mode select: GND enables SPI mode, VDD enables parallel GPIO mode; connect directly to GND or VDD, not to a logic signal. |
| 64 | VDD | power_in | 1.8V analog supply, bypass to ground with 0.1µF ceramic capacitor (pins 1, 2, 64 may share one capacitor). |
| 65 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Zynalog |
| Package | QFN-64(9x9) |
| Category | ADC/DAC/Data Conversion |
| Pins | 65 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Analog supply voltage | VDD | 1.7 | 1.8 | 1.9 | V | | 4 |
| Digital supply voltage | DVDD | 1.7 | 1.8 | 1.9 | V | | 4 |
| Analog supply current | I_VDD | | 162 | 165 | mA | | 4 |
| Digital supply current | I_DVDD | | 12 | | mA | | 4 |
| Power at max sample rate | Power | | 315 | | mW | | 4 |
| Low power mode | P_lowpower | | 136 | | mW | | 4 |
| Sleep mode | P_sleep | | 0.65 | | mW | | 4 |
| Integral nonlinearity | INL | -2 | 1 | 2 | LSB | | 4 |
| Differential nonlinearity | DNL | -0.6 | 0.35 | 0.6 | LSB | | 4 |
| Offset error | Offset Error | -13 | 5 | 13 | mV | | 4 |
| Gain error | Gain Error | -4 | 1 | 2.2 | %FS | | 4 |
| Signal-to-noise ratio | SNR | | 71 | | dB | | 4 |
| Spurious-free dynamic range | SFDR | | 92 | | dB | | 4 |
| Clock input to data acquisition delay | tAP | | 0.2 | | ns | VDD=1.8V, DVDD=1.8V, fS=65MHz | 9 |
| Clock high time | tH | 7.6 | 8 | | ns | VDD=1.8V, DVDD=1.8V, fS=65MHz | 9 |
| Clock low time | tL | 7.6 | 8 | | ns | VDD=1.8V, DVDD=1.8V, fS=65MHz | 9 |
| Clock input to clock output delay | tC | 1.3 | 1.6 | 2 | ns | VDD=1.8V, DVDD=1.8V, fS=65MHz | 9 |
| Clock input to data output delay | tD | 1.7 | 2 | 2.3 | ns | VDD=1.8V, DVDD=1.8V, fS=65MHz | 9 |
| Clock output to data output skew | tSKEW | 0.3 | 0.4 | 0.55 | ns | tC - tD; VDD=1.8V, DVDD=1.8V, fS=65MHz | 9 |
| CS low to CLK setup time | tS | 5 | | | ns | SPI_MISO pull-up 2KΩ | 14 |
| Data setup time | tDS | 5 | | | ns | SPI_MISO pull-up 2KΩ | 14 |
| Data hold time | tDH | 5 | | | ns | SPI_MISO pull-up 2KΩ | 14 |
| CLK to data output delay | tDO | | | 125 | ns | SPI_MISO pull-up 2KΩ | 14 |
| Clock period (write) | tSCK | 40 | | | ns | SPI_MISO pull-up 2KΩ | 14 |
| Clock period (readback) | tSCK | 250 | | | ns | SPI_MISO pull-up 2KΩ | 14 |
| CLK to CS high hold time | tH | 5 | | | ns | SPI_MISO pull-up 2KΩ | 14 |
| Supply voltage | VDD,DVDD | -0.3 | | 2 | V | | 6 |
| Analog input voltage | Analog Vin | -0.3 | | | V | -0.3 to VDD+0.2 | 6 |
| CLK, SENSE input voltage | CLK,SENSE | -0.3 | | | V | -0.3 to VDD+0.2 | 6 |
| SPI/GPIO digital voltage | SPI | | | 3.9 | V | VDD to 3.9 | 6 |
| CMOS data output voltage | Data Output | -0.3 | | | V | -0.3 to DVDD+0.2 | 6 |
| Working temperature | WORKING TEMP | -40 | | 85 | °C | | 6 |
| Storage temperature | STORAGE TEMP | -65 | | 150 | °C | | 6 |
## CAD (KiCad official)
- Symbol: `ZGAD65D14C`
- Footprint: `Package_DFN_QFN:QFN-64-1EP_9x9mm_P0.5mm_EP6x6mm`
- 3D model: QFN-64(9x9) (KiCad packages3D, STEP)
- 3D model files: `zgad65d14c-etched.step` / `zgad65d14c-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `zgad65d14c.step` / `zgad65d14c.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Zynalog datasheet](docs/zgad65d14c-datasheet.pdf) (18 pp, sha256 `6ea7fa4f9e9c9972`, retrieved 2026-10-31, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/zgad65d14c-datasheet.pdf)