main
History Download
Ray Publish 0.1.0 140ff1c 17d ago

YSK038N010T1A

luxin-semi · IGBT Transistors / Modules · TO-263

YSK038N010T1A from luxin-semi, in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; controls the channel, with absolute maximum gate-source voltage of ±20 V and threshold VGS(th) of 2.0 V min to 4.0 V max at ID = 250 µA.
2 D passive Drain, the middle lead (shortened stub), which is internally connected to the D (TAB) metal tab; rated VDS 100 V and ID 120 A at TC = 25°C.
3 S passive Source; carries the body diode return with ID up to 120 A at TC = 25°C and RDS(on) max 4.0 mΩ for TO-263 at VGS = 10 V, ID = 50 A.

Key specifications

Parameter Value
Manufacturer luxin-semi
Package TO-263
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage VDS 100 V Tj=25°C 2
Continuous drain current, limited by Tjmax ID 120 A TC = 25°C 2
Continuous drain current, limited by Tjmax ID 110 A TC = 100°C 2
Pulsed drain current IDM 480 A TC = 25°C, tp limited by Tjmax 2
Avalanche energy, single pulse EAS 306 mJ L=0.5mH, Rg=25Ω 2
Gate source voltage VGS -20 20 V 2
Power dissipation Ptot 236 W TC = 25°C 2
Operating junction and storage temperature Tj, Tstg -55 150 °C 2
Thermal resistance, junction - case Rθ(j-c) 0.54 °C/W 2
Thermal resistance, junction - ambient Rθ(j-a) 70 °C/W minimal footprint 2
Drain to Source Breakdown Voltage BVDSS 100 108 V VGS = 0V, ID = 250μA 2
G-S Threshold Voltage VGS(th) 2 3 4 V VGS = VCS, ID = 250μA 2
Zero gate voltage drain current IDSS 0.05 1 μA VDS = 100V, VGS = 0V, Tj=25°C 2
Zero gate voltage drain current IDSS 10 100 μA VDS = 100V, VGS = 0V, Tj=125°C 2
G-S Leakage Current IGSS 10 100 nA VGS = ±20V, VDS = 0V 2
Drain-source on-state resistance (TO-263) RDS(on) 3.2 4 mΩ VGS = 10V, ID = 50A 2
Transconductance gfs 50 S VDS=5V, ID=50A 2
Body Diode Forward Voltage VSD 0.85 1.2 V ISD = 50A, VGS=0V 3
Input capacitance Ciss 4700 pF VDS = 50V, VGS = 0V, f = 1MHz 3
Output capacitance Coss 1080 pF VDS = 50V, VGS = 0V, f = 1MHz 3
Reverse transfer capacitance Crss 31 pF VDS = 50V, VGS = 0V, f = 1MHz 3
Gate resistance RG 1.8 Ω VDS = 0V, VGS = 0V, f=1MHz 3
Gate Total Charge Qg 67 nC VGS=10V, VDS=50V, ID=20A, f=1MHz 3
Gate-Source charge Qgs 27 nC VGS=10V, VDS=50V, ID=20A, f=1MHz 3
Gate-Drain charge Qgd 11 nC VGS=10V, VDS=50V, ID=20A, f=1MHz 3
Turn-on Delay Time td(on) 29 ns VGS=10V, VDS=50V, RG=3.0Ω 3
Rise Time tr 84 ns VGS=10V, VDS=50V, RG=3.0Ω 3
Turn-off Delay Time td(off) 46 ns VGS=10V, VDS=50V, RG=3.0Ω 3
Fall Time tf 93 ns VGS=10V, VDS=50V, RG=3.0Ω 3
Body Diode Reverse Recovery Time trr 67 ns IF = 50A, dI/dt=100A/μs 3
Body Diode Reverse Recovery Charge Qrr 125 nC IF = 50A, dI/dt=100A/μs 3

CAD (KiCad official)

  • Symbol: YSK038N010T1A
  • Footprint: Package_TO_SOT_SMD:TO-263-2
  • 3D model: TO-263 (KiCad packages3D, STEP)
  • 3D model files: ysk038n010t1a-etched.step / ysk038n010t1a-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ysk038n010t1a.step / ysk038n010t1a.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: luxin-semi datasheet (8 pp, sha256 9c90d535f938d871, retrieved 2026-10-24, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF