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XW12A SOP24
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Sam wing Touch Sensors, SOP-24. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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XW12A SOP24
Sam wing · Touch Sensors · SOP-24
XW12A SOP24 from Sam wing, in a SOP-24. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Power ground (电源地) for the device. |
| 2 | C1 | passive | Internal balance capacitor interface; the datasheet gives a 1nF to 10nF range and recommends 4.7nF, placed as close to the IC as possible. |
| 3 | CSEL | passive | Sensitivity-setting capacitor interface; the value range is 0 to 100pF, with smaller values giving higher sensitivity and leaving it floating (0pF) also allowed. |
| 4 | PAD0 | passive | Touch key pad 0; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad. |
| 5 | PAD1 | passive | Touch key pad 1; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad. |
| 6 | PAD2 | passive | Touch key pad 2; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad. |
| 7 | PAD3 | passive | Touch key pad 3; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad. |
| 8 | PAD4 | passive | Touch key pad 4; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad. |
| 9 | PAD5 | passive | Touch key pad 5; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad. |
| 10 | PAD6 | passive | Touch key pad 6; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad. |
| 11 | PAD7 | passive | Touch key pad 7; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad. |
| 12 | PAD8 | passive | Touch key pad 8; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad. |
| 13 | PAD9 | passive | Touch key pad 9; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad. |
| 14 | PAD10 | passive | Touch key pad 10; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad. |
| 15 | PAD11 | passive | Touch key pad 11; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad. |
| 16 | NC | unconnected | Internal test pin; leave floating (悬空). |
| 17 | NC | unconnected | Internal test pin; leave floating (悬空). |
| 18 | INT | output | Key-valid output as an NMOS open-drain: it goes low when any key is pressed and is high-impedance when no key is pressed. |
| 19 | ASEL | input | I2C address select; high, low or floating sets the device address to 44H, 42H or 40H respectively. |
| 20 | AO | output | Analog voltage output that outputs VDD when no key is pressed and a fraction of VDD (2/16 to 13/16 VDD, by key) when a key is pressed. |
| 21 | SCL | input | I2C clock input; both SDA and SCL require a pull-up resistor to the supply. |
| 22 | SDA | bidirectional | I2C serial data input/output; the device is read-only and is pulled low for ACK and used for the sleep-exit low pulse. |
| 23 | BUZZ | output | Buzzer driver output producing a fixed 2.7 kHz square wave that can directly drive a buzzer (rated source 30 mA and sink 30 to 40 mA at VDD=5V). |
| 24 | VDD | power_in | Positive supply; operating voltage range is 2.5 V to 5.5 V and absolute maximum is -0.3 V to 6.0 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Sam wing |
| Package | SOP-24 |
| Category | Sensors |
| Pins | 24 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| 工作电压 (operating voltage) | VDD | 2.5 | 5.5 | V | 5 | ||
| 灵敏度电容 (sensitivity capacitor) | CSEL | 0 | 100 | pF | 5 | ||
| 芯片感应电容范围 (sensing capacitance range) | C_in | 0.2 | 200 | pF | 5 | ||
| 模拟电压输出内阻 (analog voltage output impedance) | Z_AO | 20 | 25 | 30 | kΩ | 5 | |
| VDD voltage (absolute maximum) | VDD | -0.3 | 6 | V | 4 | ||
| 输入输出电压 (input/output voltage) | -0.3 | 6 | V | 4 | |||
| 工作温度范围 (operating temperature range) | -40 | 85 | ℃ | 4 | |||
| 存储温度范围 (storage temperature range) | -55 | 150 | ℃ | 4 | |||
| ESD, HUM | ESD,HUM | 8000 | V | 4 | |||
| C1 内部平衡电容取值范围 (internal balance capacitor C1) | C1 | 1 | 4.7 | 10 | nF | Recommended 4.7nF per datasheet note | 4 |
CAD (KiCad official)
- Symbol:
XW12A SOP24 - Footprint:
Package_SO:SOP-24_7.5x15.4mm_P1.27mm - 3D model: SOP-24, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 2.65 mm nominal SOIC height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
xw12a-sop24-etched.step/xw12a-sop24-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);xw12a-sop24.step/xw12a-sop24.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Sam wing datasheet (11 pp, sha256
dd590366b2dc4fe6, retrieved 2026-10-20, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# XW12A SOP24
**Sam wing** · Touch Sensors · SOP-24
XW12A SOP24 from Sam wing, in a SOP-24. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Power ground (电源地) for the device. |
| 2 | C1 | passive | Internal balance capacitor interface; the datasheet gives a 1nF to 10nF range and recommends 4.7nF, placed as close to the IC as possible. |
| 3 | CSEL | passive | Sensitivity-setting capacitor interface; the value range is 0 to 100pF, with smaller values giving higher sensitivity and leaving it floating (0pF) also allowed. |
| 4 | PAD0 | passive | Touch key pad 0; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad. |
| 5 | PAD1 | passive | Touch key pad 1; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad. |
| 6 | PAD2 | passive | Touch key pad 2; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad. |
| 7 | PAD3 | passive | Touch key pad 3; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad. |
| 8 | PAD4 | passive | Touch key pad 4; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad. |
| 9 | PAD5 | passive | Touch key pad 5; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad. |
| 10 | PAD6 | passive | Touch key pad 6; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad. |
| 11 | PAD7 | passive | Touch key pad 7; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad. |
| 12 | PAD8 | passive | Touch key pad 8; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad. |
| 13 | PAD9 | passive | Touch key pad 9; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad. |
| 14 | PAD10 | passive | Touch key pad 10; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad. |
| 15 | PAD11 | passive | Touch key pad 11; leave floating if unused, and pad area should be 3mm×3mm to 30mm×30mm with the same area for every pad. |
| 16 | NC | unconnected | Internal test pin; leave floating (悬空). |
| 17 | NC | unconnected | Internal test pin; leave floating (悬空). |
| 18 | INT | output | Key-valid output as an NMOS open-drain: it goes low when any key is pressed and is high-impedance when no key is pressed. |
| 19 | ASEL | input | I2C address select; high, low or floating sets the device address to 44H, 42H or 40H respectively. |
| 20 | AO | output | Analog voltage output that outputs VDD when no key is pressed and a fraction of VDD (2/16 to 13/16 VDD, by key) when a key is pressed. |
| 21 | SCL | input | I2C clock input; both SDA and SCL require a pull-up resistor to the supply. |
| 22 | SDA | bidirectional | I2C serial data input/output; the device is read-only and is pulled low for ACK and used for the sleep-exit low pulse. |
| 23 | BUZZ | output | Buzzer driver output producing a fixed 2.7 kHz square wave that can directly drive a buzzer (rated source 30 mA and sink 30 to 40 mA at VDD=5V). |
| 24 | VDD | power_in | Positive supply; operating voltage range is 2.5 V to 5.5 V and absolute maximum is -0.3 V to 6.0 V. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Sam wing |
| Package | SOP-24 |
| Category | Sensors |
| Pins | 24 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| 工作电压 (operating voltage) | VDD | 2.5 | | 5.5 | V | | 5 |
| 灵敏度电容 (sensitivity capacitor) | CSEL | 0 | | 100 | pF | | 5 |
| 芯片感应电容范围 (sensing capacitance range) | C_in | 0.2 | | 200 | pF | | 5 |
| 模拟电压输出内阻 (analog voltage output impedance) | Z_AO | 20 | 25 | 30 | kΩ | | 5 |
| VDD voltage (absolute maximum) | VDD | -0.3 | | 6 | V | | 4 |
| 输入输出电压 (input/output voltage) | | -0.3 | | 6 | V | | 4 |
| 工作温度范围 (operating temperature range) | | -40 | | 85 | ℃ | | 4 |
| 存储温度范围 (storage temperature range) | | -55 | | 150 | ℃ | | 4 |
| ESD, HUM | ESD,HUM | 8000 | | | V | | 4 |
| C1 内部平衡电容取值范围 (internal balance capacitor C1) | C1 | 1 | 4.7 | 10 | nF | Recommended 4.7nF per datasheet note | 4 |
## CAD (KiCad official)
- Symbol: `XW12A SOP24`
- Footprint: `Package_SO:SOP-24_7.5x15.4mm_P1.27mm`
- 3D model: SOP-24, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 2.65 mm nominal SOIC height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files: `xw12a-sop24-etched.step` / `xw12a-sop24-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `xw12a-sop24.step` / `xw12a-sop24.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Sam wing datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8589835776524648448) (11 pp, sha256 `dd590366b2dc4fe6`, retrieved 2026-10-20, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/xw12a-sop24-datasheet.pdf)