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XT385-2.5
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XINLUDA Voltage Reference, TO-92-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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XT385-2.5
XINLUDA · Voltage Reference · TO-92-3
XT385-2.5 from XINLUDA, in a TO-92-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | - | passive | Anode (negative) terminal of the 2.5V micropower band-gap reference diode, drawn in the TO-92 bottom view connected to the diode triangle side. |
| 2 | + | passive | Cathode (positive) terminal of the 2.5V reference diode, which operates over 20 uA to 20 mA reverse current. |
| 3 | NC | unconnected | Pin 3 is shown in the TO-92 bottom view with no connection to the diode symbol. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | XINLUDA |
| Package | TO-92-3 |
| Category | Power Management (PMIC) |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Breakdown Voltage (tested limit) | 2.462 | 2.5 | 2.538 | V | TA = 25°C, 20 μA ≤ IR ≤ 20 mA | 4 | |
| Reverse Breakdown Voltage (design limit) | 2.425 | 2.5 | 2.575 | V | TA = 25°C, 20 μA ≤ IR ≤ 20 mA | 4 | |
| Minimum Operating Current (tested limit) | 13 | 20 | μA | 4 | |||
| Reverse Breakdown Voltage Change with Current (tested limit) | 1 | 1.5 | mV | 20 μA ≤ IR ≤ 1 mA | 4 | ||
| Reverse Breakdown Voltage Change with Current (tested limit) | 10 | 20 | mV | 1 mA ≤ IR ≤ 20 mA | 4 | ||
| Average Temperature Coefficient (others, no suffix) | 150 | ppm/°C | IR = 100 μA | 4 | |||
| Reverse Current (absolute maximum) | 30 | mA | 2 | ||||
| Forward Current (absolute maximum) | 10 | mA | 2 | ||||
| Operating Temperature Range | -40 | 85 | °C | XL385-2.5 rating; same range printed for XT385-2.5 ordering entry | 2 | ||
| Maximum Junction Temperature for elevated temperature operation (XL385) | TJMAX | 100 | °C | XL385 elevated temperature operation | 2 | ||
| Storage Temperature | -55 | 150 | °C | 2 | |||
| ESD Susceptibility | 2 | kV | Human body model, 100 pF through 1.5 kΩ | 2 | |||
| Soldering Temperature, TO-92 package | 260 | °C | 10 sec | 2 | |||
| Operating Current (range lower end) | 20 | μA | Operating current range stated in description | 1 | |||
| Operating Current (range upper end) | 20 | mA | Operating current range stated in description | 1 | |||
| Junction to Ambient Thermal Resistance, TO-92 (0.4″ leads) | θja | 180 | °C/W | TO-92, 0.4″ leads | 2 | ||
| Junction to Ambient Thermal Resistance, TO-92 (0.125″ leads) | θja | 170 | °C/W | TO-92, 0.125″ leads | 2 |
CAD (KiCad official)
- Symbol:
XT385-2.5 - Footprint:
Package_TO_SOT_THT:TO-92_Inline - 3D model: TO-92-3 (KiCad packages3D, STEP)
- 3D model files:
xt385-2-5-etched.step/xt385-2-5-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);xt385-2-5.step/xt385-2-5.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: XINLUDA datasheet (12 pp, sha256
de57b1e1a4a5153a, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# XT385-2.5
**XINLUDA** · Voltage Reference · TO-92-3
XT385-2.5 from XINLUDA, in a TO-92-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | - | passive | Anode (negative) terminal of the 2.5V micropower band-gap reference diode, drawn in the TO-92 bottom view connected to the diode triangle side. |
| 2 | + | passive | Cathode (positive) terminal of the 2.5V reference diode, which operates over 20 uA to 20 mA reverse current. |
| 3 | NC | unconnected | Pin 3 is shown in the TO-92 bottom view with no connection to the diode symbol. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | XINLUDA |
| Package | TO-92-3 |
| Category | Power Management (PMIC) |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Breakdown Voltage (tested limit) | | 2.462 | 2.5 | 2.538 | V | TA = 25°C, 20 μA ≤ IR ≤ 20 mA | 4 |
| Reverse Breakdown Voltage (design limit) | | 2.425 | 2.5 | 2.575 | V | TA = 25°C, 20 μA ≤ IR ≤ 20 mA | 4 |
| Minimum Operating Current (tested limit) | | | 13 | 20 | μA | | 4 |
| Reverse Breakdown Voltage Change with Current (tested limit) | | | 1 | 1.5 | mV | 20 μA ≤ IR ≤ 1 mA | 4 |
| Reverse Breakdown Voltage Change with Current (tested limit) | | | 10 | 20 | mV | 1 mA ≤ IR ≤ 20 mA | 4 |
| Average Temperature Coefficient (others, no suffix) | | | | 150 | ppm/°C | IR = 100 μA | 4 |
| Reverse Current (absolute maximum) | | | | 30 | mA | | 2 |
| Forward Current (absolute maximum) | | | | 10 | mA | | 2 |
| Operating Temperature Range | | -40 | | 85 | °C | XL385-2.5 rating; same range printed for XT385-2.5 ordering entry | 2 |
| Maximum Junction Temperature for elevated temperature operation (XL385) | TJMAX | | | 100 | °C | XL385 elevated temperature operation | 2 |
| Storage Temperature | | -55 | | 150 | °C | | 2 |
| ESD Susceptibility | | | | 2 | kV | Human body model, 100 pF through 1.5 kΩ | 2 |
| Soldering Temperature, TO-92 package | | | | 260 | °C | 10 sec | 2 |
| Operating Current (range lower end) | | 20 | | | μA | Operating current range stated in description | 1 |
| Operating Current (range upper end) | | | | 20 | mA | Operating current range stated in description | 1 |
| Junction to Ambient Thermal Resistance, TO-92 (0.4″ leads) | θja | | 180 | | °C/W | TO-92, 0.4″ leads | 2 |
| Junction to Ambient Thermal Resistance, TO-92 (0.125″ leads) | θja | | 170 | | °C/W | TO-92, 0.125″ leads | 2 |
## CAD (KiCad official)
- Symbol: `XT385-2.5`
- Footprint: `Package_TO_SOT_THT:TO-92_Inline`
- 3D model: TO-92-3 (KiCad packages3D, STEP)
- 3D model files: `xt385-2-5-etched.step` / `xt385-2-5-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `xt385-2-5.step` / `xt385-2-5.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [XINLUDA datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8757797151315775488) (12 pp, sha256 `de57b1e1a4a5153a`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/xt385-2-5-datasheet.pdf)