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XT25F16FSOIGU-S
Public Made by Adomby adom
XTX NOR FLASH, SOP-8-150mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownXT25F16FSOIGU-S
XTX · NOR FLASH · SOP-8-150mil
XT25F16FSOIGU-S from XTX, in a SOP-8-150mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CS# | input | Chip Select Input for the serial interface, as listed in the pin description table. |
| 2 | SO (IO1) | bidirectional | Data Output (Data Input Output 1); used as IO1 for Standard, Dual and Quad SPI instructions. |
| 3 | WP# (IO2) | bidirectional | Write Protect Input (Data Input Output 2); WP# and HOLD# functions are only available for Standard/Dual SPI, while IO2 is used for Quad SPI. |
| 4 | VSS | power_in | Ground reference for the device. |
| 5 | SI (IO0) | bidirectional | Data Input (Data Input Output 0); used as IO0 for Standard, Dual and Quad SPI instructions. |
| 6 | SCLK | input | Serial Clock Input for the serial interface. |
| 7 | HOLD# (IO3) | bidirectional | Hold Input (Data Input Output 3); WP# and HOLD# functions are only available for Standard/Dual SPI, while IO3 is used for Quad SPI. |
| 8 | VCC | power_in | Power supply input; the single supply voltage range is stated as 2.3~3.6V on page 2. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | XTX |
| Package | SOP-8-150mil |
| Category | Memory |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Write Inhibit Voltage | VWI | 1.5 | 2.1 | V | 46 | ||
| VCC(min) To CS# Low | tVSL | 100 | μs | 46 | |||
| Ambient Operating Temperature (I grade) | -40 | 85 | ℃ | Industrial grade; -40 to 105℃ row applies to H suffix | 47 | ||
| Storage Temperature | -65 | 150 | ℃ | 47 | |||
| Output Short Circuit Current | 200 | mA | 47 | ||||
| Applied Input/Output Voltage | -0.5 | 4 | V | 47 | |||
| VCC | VCC | -0.5 | 4 | V | 47 | ||
| Supply Voltage | VCC | 2.3 | 3.6 | V | TA=-40℃~85℃ | 48 | |
| Input Capacitance | CIN | 6 | pF | VIN=0V | 47 | ||
| Output Capacitance | COUT | 8 | pF | VOUT=0V | 47 | ||
| Input Leakage Current | ILI | -2 | 2 | μA | Max (85℃) column | 48 | |
| Output Leakage Current | ILO | -2 | 2 | μA | Max (85℃) column | 48 | |
| Standby Current | ICC1 | 13 | 35 | μA | CS#=VCC; VIN=VCC or VSS; Max (85℃) column | 48 | |
| Deep Power-Down Current | ICC2 | 0.3 | 10 | μA | CS#=VCC; VIN=VCC or VSS; Max (85℃) column | 48 | |
| Operating Current (Read) | ICC3 | 12 | 20 | mA | CLK=0.1VCC/0.9VCC at 133MHz, Q=Open(*1,*2,*4 I/O) | 48 | |
| Operating Current (Read) | ICC3 | 8 | 13 | mA | CLK=0.1VCC/0.9VCC at 80MHz, Q=Open(*1,*2,*4 I/O) | 48 | |
| Operating Current (Read) | ICC3 | 5 | 8 | mA | CLK=0.1VCC/0.9VCC at 50MHz, Q=Open(*1,*2,*4 I/O) | 48 | |
| Operating Current (PP) | ICC4 | 12 | 20 | mA | CS#=VCC; Max (85℃) column | 48 | |
| Operating Current (WRSR) | ICC5 | 8 | 12 | mA | CS#=VCC; Max (85℃) column | 48 | |
| Operating Current (SE) | ICC6 | 15 | 20 | mA | CS#=VCC; Max (85℃) column | 48 | |
| Operating Current (BE) | ICC7 | 15 | 20 | mA | CS#=VCC; Max (85℃) column | 48 | |
| Operating Current (CE) | ICC8 | 15 | 20 | mA | CS#=VCC; Max (85℃) column | 48 | |
| Input Low Voltage | VIL | -0.5 | 0.3 | V | Max printed as 0.3VCC | 48 | |
| Input High Voltage | VIH | 0.7 | V | Min printed as 0.7VCC | 48 | ||
| Output Low Voltage | VOL | 0.2 | V | IOL=100uA; Max (85℃) column | 48 | ||
| Output High Voltage | VOH | -0.2 | V | IOH=-100uA; Min printed as VCC-0.2 | 48 | ||
| Serial Clock Frequency (BBH/EBH, 2.7-3.6V, DC=1) | fC | 133 | MHz | Dual I/O Fast Read (BBH) and Quad I/O Fast Read (EBH) | 49 | ||
| Serial Clock Frequency (BBH/EBH, 2.3-2.7V, DC=1) | fC1 | 104 | MHz | Dual I/O Fast Read (BBH) and Quad I/O Fast Read (EBH) | 49 | ||
| Serial Clock Frequency (BBH/EBH, 2.7-3.6V, DC=0) | fC2 | 104 | MHz | Dual I/O Fast Read (BBH) and Quad I/O Fast Read (EBH) | 49 | ||
| Serial Clock Frequency (BBH/EBH, 2.3-2.7V, DC=0) | fC3 | 86 | MHz | Dual I/O Fast Read (BBH) and Quad I/O Fast Read (EBH) | 49 | ||
| Serial Clock Frequency (all other commands, 2.7-3.6V) | fC4 | 133 | MHz | All commands except Read (03H), BBH and EBH | 49 | ||
| Serial Clock Frequency (all other commands, 2.3-2.7V) | fC5 | 104 | MHz | All commands except Read (03H), BBH and EBH | 49 | ||
| Serial Clock Frequency (Read 03H) | fR | 80 | MHz | Read (03H) | 49 | ||
| Serial Clock High Time | tCLH | 45 | % PC | Printed as 45% PC; PC=1/fC(MAX) | 49 | ||
| Serial Clock Low Time | tCLL | 45 | % PC | Printed as 45% PC; PC=1/fC(MAX) | 49 | ||
| CS# Active Setup Time | tSLCH | 5 | ns | 49 | |||
| CS# Active Hold Time | tCHSH | 5 | ns | 49 | |||
| CS# Not Active Setup Time | tSHCH | 5 | ns | 49 | |||
| CS# Not Active Hold Time | tCHSL | 5 | ns | 49 | |||
| CS# High Time (read/write) | tSHSL | 20 | ns | 49 | |||
| Output Disable Time | tSHQZ | 6 | ns | 49 | |||
| Output Hold Time | tCLQX | 1 | ns | 49 | |||
| Clock Low To Output Valid | tCLQV | 6 | ns | 49 | |||
| Data In Setup Time | tDVCH | 2 | ns | 49 | |||
| Data In Hold Time | tCHDX | 3 | ns | 49 | |||
| Write Protect Setup Time Before CS# Low | tWHSL | 20 | ns | 49 | |||
| Write Protect Hold Time After CS# High | tSHWL | 100 | ns | 49 | |||
| CS# High To Deep Power-Down Mode | tDP | 3 | µs | 49 | |||
| CS# High To Standby Mode Without Electronic Signature Read | tRES1 | 20 | µs | 49 | |||
| CS# High To Standby Mode With Electronic Signature Read | tRES2 | 20 | µs | 49 | |||
| CS# High To Next Command After Reset (from read) | tRST_R | 30 | µs | 49 | |||
| CS# High To Next Command After Reset (from erase) | tRST_E | 12 | ms | 49 | |||
| CS# High To Next Command After Erase Suspend | tSUS1 | 30 | μs | 49 | |||
| CS# High To Next Command After Program Suspend | tSUS2 | 20 | μs | 49 | |||
| Write Status Register Cycle Time | tW | 1 | 20 | ms | 49 | ||
| Page Programming Time | tPP | 0.4 | 3.5 | ms | 49 | ||
| Sector Erase Time | tSE | 45 | 2000 | ms | 49 | ||
| Block Erase Time (32K Bytes) | tBE1 | 0.12 | 3 | s | 49 | ||
| Block Erase Time (64K Bytes) | tBE2 | 0.15 | 3.2 | s | 49 | ||
| Chip Erase Time | tCE | 5 | 20 | s | 49 |
CAD (KiCad official)
- Symbol:
XT25F16FSOIGU-S - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8-150mil (KiCad packages3D, STEP)
- 3D model files:
xt25f16fsoigu-s-etched.step/xt25f16fsoigu-s-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);xt25f16fsoigu-s.step/xt25f16fsoigu-s.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: XTX datasheet (57 pp, sha256
b42dba7a0d2cab3b, retrieved 2026-10-20, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).