component
XRP7664IDTR-F
Public Made by Adomby adom
MaxLinear DC-DC Converters, SOIC-8-150mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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XRP7664IDTR-F
MaxLinear · DC-DC Converters · SOIC-8-150mil
XRP7664IDTR-F from MaxLinear, in a SOIC-8-150mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BS | passive | Bootstrap pin; connect a 0.01µF or greater bootstrap capacitor between BS and SW to drive the internal high-side power MOSFET. |
| 2 | IN | power_in | Power input pin, operating from 4.50V to 18V (absolute maximum VIN is 20V), with a capacitor between IN and GND to keep the input voltage constant. |
| 3 | SW | power_out | Power switch output pin connected to the inductor and the bootstrap capacitor, with a switch node voltage rating of 21V absolute maximum. |
| 4 | GND | power_in | Ground signal pin. |
| 5 | FB | input | Feedback pin set by an external resistor divider; overvoltage protection triggers above 1.1V and the oscillator frequency is lowered when the feedback voltage drops below 0.3V. |
| 6 | COMP | passive | Output of the transconductance error amplifier and input to the current comparator, compensated by an RC network connected from this pin to GND. |
| 7 | EN | input | Control input; forcing it above 2.7V enables the IC and below 0.75V shuts it down, and it may be pulled up to VIN through a 100kΩ resistor for automatic startup. |
| 8 | SS | passive | Soft-start control input; a capacitor from SS to GND sets the soft-start period (0.1µF gives 15ms), and leaving SS unconnected disables soft-start. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MaxLinear |
| Package | SOIC-8-150mil |
| Category | Power Management (PMIC) |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Feedback Voltage | VFB | 0.907 | 0.925 | 0.943 | V | 2 | |
| Feedback Bias Current | -0.1 | 0.1 | µA | VFB=1V | 2 | ||
| EN Enable Threshold | 2.2 | 2.5 | 2.7 | V | 2 | ||
| Oscillator Frequency | FOSC1 | 280 | 340 | 400 | kHz | 2 | |
| UVLO Threshold | 3.65 | 4 | 4.25 | V | VIN Rising | 2 | |
| High-Side Switch Current Limit | 2.7 | 3.5 | A | 2 | |||
| Maximum Duty Cycle | DMAX | 90 | % | VFB=0.85V | 2 | ||
| Minimum Duty Cycle | DMIN | 0 | % | VFB=1V | 2 | ||
| Shutdown Supply Current | 0.1 | 10 | µA | VEN≤0.75V | 2 | ||
| Quiescent Current | 1.2 | 1.4 | mA | VEN=3V, VFB=1V | 2 | ||
| High-Side switch Leakage Current | 0.1 | 10 | µA | VIN=18V, VEN=0V, VSW=0V | 2 | ||
| Feedback Overvoltage Threshold | 1.1 | V | 2 | ||||
| Error Amplifier Voltage Gain | AEA | 400 | V/V | Note 1 | 2 | ||
| Error Amplifier Transconductance | GEA | 800 | µA/V | 2 | |||
| COMP to Current Sense Transconductance | GCS | 3.5 | A/V | 2 | |||
| High-Side switch On Resistance | RDSONH | 100 | mΩ | ISW=0.2A&0.7A; Note 2 | 2 | ||
| Low-Side switch On Resistance | RDSONL | 100 | mΩ | ISW=-0.2A&-0.7A; Note 2 | 2 | ||
| Low-Side Switch Current Limit | 1.4 | A | From Drain to Source | 2 | |||
| Short Circuit Oscillator Frequency | FOSC2 | 90 | kHz | 2 | |||
| EN Enable Threshold Voltage Hysteresis | 210 | mV | Note 1 | 2 | |||
| UVLO Hysteresis | 0.2 | V | 3 | ||||
| Soft-start Current | 6 | µA | 3 | ||||
| Soft-start Time | 15 | ms | CSS=0.1µF; Note 1 | 3 | |||
| Thermal Shutdown | 160 | °C | Note 1 | 3 | |||
| Thermal Shutdown Hysteresis | 30 | °C | Note 1 | 3 | |||
| Supply Voltage VIN | VIN | -0.3 | 20 | V | 2 | ||
| Switch Node Voltage | VSW | 21 | V | 2 | |||
| Boost Voltage | VBS | -0.3 | V | Maximum printed as VSW+6V | 2 | ||
| Enable Voltage | VEN | -0.3 | V | Maximum printed as VIN | 2 | ||
| All Other Pins | -0.3 | 6 | V | 2 | |||
| Junction Temperature | TJ | 150 | °C | 2 | |||
| Storage Temperature | TSTG | -65 | 150 | °C | 2 | ||
| Lead Temperature (Soldering) | 260 | °C | Soldering, 10 sec | 2 | |||
| ESD Rating HBM | 2 | kV | Human Body Model | 2 | |||
| Ambient Operating Temperature | TA | -40 | 85 | °C | 2 | ||
| Maximum Output Current | 2 | A | Printed as 2A min | 2 |
CAD (KiCad official)
- Symbol:
XRP7664IDTR-F - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8-150mil (KiCad packages3D, STEP)
- 3D model files:
xrp7664idtr-f-etched.step/xrp7664idtr-f-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);xrp7664idtr-f.step/xrp7664idtr-f.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: MaxLinear datasheet (12 pp, sha256
84b21ec480deb3c3, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).