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Contents

README

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XRIM322512S1R0MBCA

XR · Power Inductors · 1210

XRIM322512S1R0MBCA from XR, in a 1210. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised inductor or ferrite bead; either orientation.
2 2 passive Terminal 2 of an unpolarised inductor or ferrite bead; either orientation.

Key specifications

Parameter Value
Manufacturer XR
Package 1210
Category Inductors, Coils, Chokes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Inductance (nominal L0) L0 1 µH 1MHz, 1.0Vrms, 25℃ ambient 3
Inductance tolerance (code M) -20 20 % Part-number tolerance code M = ±20% 2
DC resistance Rdc Rdc 26 30 mΩ 3
Heating rated current Irms Irms 5.3 4.8 A DC current giving approx. ΔT of 40℃ (Note 3) 3
Saturation current Isat Isat 6.6 5.8 A DC current giving L0 drop of approx. 30% (Note 4) 3
Operating temperature range -55 125 ℃ Note 5 3
Part temperature (ambient + temp rise) 125 ℃ Worst-case operating conditions (Note 6) 3
Insulation resistance 100 MΩ 100 VDC between coil and middle of top surface of body, 60 s 4
Inductance change after resistance to soldering heat -10 10 % Solder 260±5℃, immersion 10±1 s 4
Inductance change after high temperature test -10 10 % 125±2℃, 1000 h 4
Inductance change after low temperature test -10 10 % -55±2℃, 1000 h 4
Inductance change after thermal shock -10 10 % -55±3℃ / 125±3℃, 32 cycles 4
Inductance change after static humidity -10 10 % 95±3%RH at 60±2℃, 1000 h 4
Inductance change after life test -10 10 % 85±2℃, 1000 h, with Irms applied 4
Temperature characteristic of inductance -10 10 % Reference +20℃; measured at -40℃ and +125℃ 4
Reflow peak temperature (Pb-free profile) Tp 260 ℃ Recommended reflow profile, Sn96.5/Ag3/Cu0.5; within +0/-5℃ for 10 s 5
Preheat temperature 150 200 ℃ Preheat Tsmin to Tsmax, 60-120 s 5
Average ramp-up rate (Tsmax to Tp) 3 ℃/s Recommended reflow profile 5
Ramp-down rate 6 ℃/s Recommended reflow profile 5
Time 25℃ to peak temperature 8 min Recommended reflow profile 5
Allowed reflow times 2 times Reflow soldering 5
Storage temperature (recommended) 15 35 ℃ Recommended warehouse storage 6
Storage humidity (recommended) 25 75 %RH Recommended warehouse storage 6
Length L L -0.2 3.2 0.2 mm Outline dimension 3
Width W W -0.2 2.5 0.2 mm Outline dimension 3
Height T T 1.2 mm Outline dimension, maximum 3

CAD (KiCad official)

  • Symbol: XRIM322512S1R0MBCA
  • Footprint: Inductor_SMD:L_1210_3225Metric
  • 3D model: 1210 (KiCad packages3D, STEP)
  • 3D model files: xrim322512s1r0mbca-etched.step / xrim322512s1r0mbca-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xrim322512s1r0mbca.step / xrim322512s1r0mbca.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XR datasheet (6 pp, sha256 218200fb1a414491, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF