component
XR33194ESBTR
Public Made by Adomby adom
MaxLinear Pre-ordered Chips, TSOT-23-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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|---|---|
| docs | 10d ago |
| viewers | 10d ago |
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| verification.json | 10d ago |
| xr33194esbtr-etched.glb | 10d ago |
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XR33194ESBTR
MaxLinear · Pre-ordered Chips · TSOT-23-6
XR33194ESBTR from MaxLinear, in a TSOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | DI | input | Driver input: a low forces Y low and Z high, a high forces Y high and Z low; input range -0.3V to 7.0V. |
| 2 | VCC | power_in | Power supply, 3.3V ±5% (3.135V to 3.465V), bypass with 0.1µF capacitor to ground. |
| 3 | DE | input | Driver output enable: high enables outputs Y and Z, low tri-states them and puts the device into low-power shutdown (2µA max); hot swap function is implemented on this pin. |
| 4 | Z | output | ±15kV HBM ESD protected RS-485/RS-422 inverting driver output, rated ±18V on the bus. |
| 5 | GND | power_in | Supply ground. |
| 6 | Y | output | ±15kV HBM ESD protected RS-485/RS-422 non-inverting driver output, rated ±18V on the bus. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MaxLinear |
| Package | TSOT-23-6 |
| Category | Interface ICs |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage range | VCC | 3.135 | 3.465 | V | 2 | ||
| Supply current | ICC | 0.18 | 0.375 | mA | No load (DE = VCC, DI = 0V) | 2 | |
| Supply current in shutdown mode | ISNDN | 0.5 | 2 | µA | No load (DE = 0V) | 2 | |
| Logic high input threshold | VIH | 2 | V | DI and DE | 2 | ||
| Logic low input threshold | VIL | 0.8 | V | DI and DE | 2 | ||
| Input current | IIN | -2 | 2 | µA | DI and DE | 2 | |
| Differential driver voltage | VOD | 3 | V | No load | 2 | ||
| Differential driver voltage | VOD | 2 | V | RL = 100Ω (RS-422), Figure 4 | 2 | ||
| Differential driver voltage | VOD | 1.5 | V | RL = 54Ω (RS-485), Figure 4 | 2 | ||
| Change in magnitude of differential driver output voltage | ΔVOD | -0.2 | 0.2 | V | RL = 54Ω (RS-485) or 100Ω (RS-422), DE = VCC, Figure 4 | 2 | |
| Driver common-mode output voltage (steady state) | VCM | -1 | 3 | V | RL = 54Ω (RS-485) or 100Ω (RS-422), DE = VCC, DI = VCC or GND, Figure 4 | 2 | |
| Change in magnitude of driver common-mode output voltage | ΔVCM | 0.2 | V | RL = 54Ω (RS-485) or 100Ω (RS-422) | 2 | ||
| Output leakage | VOL | -20 | 20 | µA | Y and Z, VOUT = 12V, DE = 0V, VCC = 3.3V or GND | 2 | |
| Driver short-circuit output current | IOSD | -250 | 250 | mA | -7V ≤ VOUT ≤ 12V, Figure 6 | 2 | |
| Driver propagation delay (low to high) | tDPLH | 24 | 70 | ns | CL = 50pF, RL = 54Ω, Figure 8 | 3 | |
| Driver propagation delay (high to low) | tDPHL | 24 | 70 | ns | CL = 50pF, RL = 54Ω, Figure 8 | 3 | |
| Driver propagation delay skew | tSKEW | 40 | ns | /tDPLH-tDPHL/, CL = 50pF, RL = 54Ω, Figure 8 | 3 | ||
| Differential output rise or fall time | tR, tF | 10 | 70 | ns | CL = 50pF, RL = 54Ω, Figure 8 | 3 | |
| Device to device propagation delay matching | 46 | ns | Same power supply, maximum temperature difference between devices = 30°C | 3 | |||
| Maximum data rate | 2.5 | Mbps | CL = 50pF, RL = 54Ω, duty cycle 40 to 60% | 3 | |||
| Driver enable to output high | tDZH | 400 | ns | CL = 100pF, RL = 500Ω, Figure 9 | 3 | ||
| Driver enable to output low | tDZL | 400 | ns | CL = 100pF, RL = 500Ω, Figure 9 | 3 | ||
| Driver disable from output high | tDHZ | 100 | ns | CL = 100pF, RL = 500Ω, Figure 9 | 3 | ||
| Driver disable from output low | tDLZ | 100 | ns | CL = 100pF, RL = 500Ω, Figure 9 | 3 | ||
| Supply voltage (absolute maximum) | VCC | -0.3 | 7 | V | 2 | ||
| Maximum junction temperature | TJ | 150 | °C | 2 | |||
| Input voltages, DI and DE | -0.3 | 7 | V | 2 | |||
| Bus output voltages Y and Z | -18 | 18 | V | 2 | |||
| Transient voltage pulse through 100Ω | -100 | 100 | V | Figure 7 | 2 | ||
| ESD HBM (Y and Z pins) | -15 | 15 | kV | Human Body Model | 2 | ||
| ESD HBM (all other pins) | -4 | 4 | kV | Human Body Model | 2 | ||
| Storage temperature range | -65 | 150 | °C | 2 | |||
| Lead temperature (soldering, 10s) | 300 | °C | 2 | ||||
| Operating temperature range | -40 | 125 | °C | 2 | |||
| VCC supply range | VCC | 3.135 | 3.465 | V | 2 | ||
| Thermal shutdown temperature | TTS | 165 | °C | 3 | |||
| Thermal shutdown hysteresis | TTSH | 40 | °C | 3 |
CAD (KiCad official)
- Symbol:
XR33194ESBTR - Footprint:
Package_TO_SOT_SMD:TSOT-23-6 - 3D model: TSOT-23-6 (KiCad packages3D, STEP)
- 3D model files:
xr33194esbtr-etched.step/xr33194esbtr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);xr33194esbtr.step/xr33194esbtr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: MaxLinear datasheet (12 pp, sha256
46e87bed1696fac7, retrieved 2026-10-30, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).