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XR33055HD-F

MaxLinear · Pre-ordered Chips · SOIC-8

XR33055HD-F from MaxLinear, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: RO is high when A-B is at least 200mV and low when A-B is at most -200mV, and it is high if the inputs are open, shorted or undriven for more than 2µs, with RO enabled only when RE is low.
2 RE input Receiver output enable (hot swap): RO is enabled when RE is low and goes high-impedance when RE is high, and RE should be high with DE low to enter shutdown mode.
3 DE input Driver output enable (hot swap): the driver outputs are enabled when DE is high and high-impedance when DE is low, and DE should be low with RE high to enter shutdown mode.
4 DI input Driver input: with DE high, a low on DI forces the non-inverting output (A/Y) low and the inverting output (B/Z) high, and a high on DI forces A/Y high and B/Z low.
5 GND power_in Power ground.
6 A/Y bidirectional Non-inverting receiver input and non-inverting driver output.
7 B/Z bidirectional Inverting receiver input and inverting driver output.
8 VCC power_in 3.0V to 5.5V power supply input; bypass to ground with a 0.1µF capacitor.

Key specifications

Parameter Value
Manufacturer MaxLinear
Package SOIC-8
Category Interface ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage range VCC 3 5.5 V 3
Differential driver output (RS-422) VOD 2 V 4.5V ≤ VCC ≤ 5.5V, RL = 100Ω (RS-422), Figure 3 3
Differential driver output (RS-485) VOD 1.5 V 4.5V ≤ VCC ≤ 5.5V, RL = 54Ω (RS-485), Figure 3 3
Differential driver output over common mode VOD 1.5 V 4.5V ≤ VCC ≤ 5.5V, -25V ≤ VCM ≤ 25V, Figure 4 3
Differential driver output (RS-422) VOD 0.85 V 3.0V ≤ VCC ≤ 4.5V, RL = 100Ω (RS-422), Figure 3 3
Differential driver output (RS-485) VOD 0.65 V 3.0V ≤ VCC ≤ 4.5V, RL = 54Ω (RS-485), Figure 3 3
Change in magnitude of differential output voltage ∆VOD -0.2 0.2 V RL = 100Ω (RS-422) or RL = 54Ω (RS-485), Figure 3 3
Driver common-mode output voltage (steady state) VCM 1 3 V 3
Change in magnitude of common-mode output voltage ∆VCM -0.2 0.2 V 3
Logic high input threshold (DI, DE and RE) VIH 2 V VCC = 3.3V 3
Logic high input threshold (DI, DE and RE) VIH 2.4 V VCC = 5.0V 3
Logic low input threshold (DI, DE and RE) VIL 0.8 V 3
Logic input current (DI, DE and RE) IIN -1 1 µA 0V ≤ VIN ≤ VCC, After first transition 3
Logic input current hot swap (DE and RE) IINHS -200 100 200 µA Until first transition 3
Input current (A and B) IA, B 100 µA VCC = 0V or 5.5V, VOUT = 12V, DE = 0V, for XR33052/53/55 3
Input current (A and B) IA, B -80 µA VCC = 0V or 5.5V, VOUT = -7V, DE = 0V, for XR33052/53/55 3
Driver short-circuit output current IOSD -250 250 mA -60V ≤ VOUT ≤ 60V, DI = 0V or VCC, Figure 5 3
Receiver output low voltage (RO) VOL 0.4 V IOUT = 4mA 4
High-Z receiver output current IOZR -1 1 µA 0V ≤ VOUT ≤ VCC 4
Receiver differential input signal threshold voltage (VA - VB) VSTH -85 200 mV -25V ≤ VOUT ≤ 25V 4
Negative going receiver differential input fail-safe threshold voltage (VA - VB) VFSTH- -200 -125 -40 mV -25V ≤ VOUT ≤ 25V 4
Positive going receiver differential input fail-safe threshold voltage (VA - VB) VFSTH+ -100 -10 mV -25V ≤ VOUT ≤ 25V 4
RX input resistance (XR33052/53/55) RIN 120 kΩ -25V ≤ VCM ≤ 25V, XR33052/53/55 4
Supply current ICC 4 mA No load, RE = 0V or VCC, DE = VCC, DI = 0V or VCC 4
Supply current in shutdown mode ISHDN 0.001 1 µA RE = VCC, DE = 0V 4
Driver propagation delay (low to high) tDPLH 150 500 ns CL = 50pF, RL = 54Ω, Figure 7 6
Driver propagation delay (high to low) tDPHL 150 500 ns CL = 50pF, RL = 54Ω, Figure 7 6
Driver differential output rise or fall time tDR, tDF 100 200 300 ns 6
Maximum data rate (driver, 1/tUI) 1 Mbps 1/tUI, duty cycle 40% to 60% 6
Driver enable to output high tDZH 1000 2500 ns CL = 50pF, RL = 500Ω, Figure 8 6
Driver enable to output low tDZL 1000 2500 ns CL = 50pF, RL = 500Ω, Figure 8 6
Driver disable from output high tDHZ 250 ns 6
Driver disable from output low tDLZ 250 ns 6
Driver enable from shutdown to output high tDZH(SHDN) 2500 4500 ns CL = 50pF, RL = 500Ω, Figure 8 6
Driver enable from shutdown to output low tDZL(SHDN) 2500 4500 ns CL = 50pF, RL = 500Ω, Figure 8 6
Time to shutdown tSHDN 50 200 600 ns Notes 1 and 2 6
Receiver propagation delay (low to high) tRPLH 200 ns CL = 15pF, VID = ±2V, VID rise and fall times < 15ns, Figure 9 6
Receiver propagation delay (high to low) tRPHL 200 ns CL = 15pF, VID = ±2V, VID rise and fall times < 15ns, Figure 9 6
Receiver enable to output high tRZH 50 ns CL = 15pF, RL = 1kΩ, Figure 10 6
Receiver enable to output low tRZL 50 ns CL = 15pF, RL = 1kΩ, Figure 10 6
Receiver disable from output high tRHZ 50 ns 6
Receiver disable from output low tRLZ 50 ns 6
Receiver enable from shutdown to output high tRZH(SHDN) 3500 ns CL = 15pF, RL = 1kΩ, Figure 10 6
Receiver enable from shutdown to output low tRZL(SHDN) 3500 ns CL = 15pF, RL = 1kΩ, Figure 10 6
Supply voltage (absolute maximum) VCC -0.3 7 V 2
Input voltage (DE and DI) -0.3 7 V 2
Input voltage (RE) -0.3 V 2
Receiver output voltage (RO) -0.3 V 2
Driver output voltage (Y, Z, A/Y and B/Z) -60 60 V 2
Receiver input voltage (A, B, A/Y and B/Z) -60 60 V 2
Transient voltage pulse -100 100 V through 100Ω 2
Driver output current -250 250 mA 2
Maximum junction temperature 150 °C 2
Storage temperature -65 150 °C 2
ESD HBM (A, B, Y and Z pins) -15 15 kV Human Body Model, A, B, Y and Z pins 2
ESD HBM (all other pins) -4 4 kV Human Body Model, all other pins 2
Operating temperature range -40 105 °C 2
Change in magnitude of differential output voltage fail-safe receiver threshold hysteresis ∆VSTH 170 mV Receiver differential input signal hysteresis 4
Thermal shutdown temperature TTS 175 °C Junction temperature 4

CAD (KiCad official)

  • Symbol: XR33055HD-F
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: xr33055hd-f-etched.step / xr33055hd-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xr33055hd-f.step / xr33055hd-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MaxLinear datasheet (20 pp, sha256 d4d2065166fbb06f, retrieved 2026-10-30, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF