component
XR33053ID-F
Public Made by Adomby adom
MaxLinear Pre-ordered Chips, SOIC-14. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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|---|---|
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| viewers | 10d ago |
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| README.md | 10d ago |
| verification.json | 10d ago |
| xr33053id-f-etched.glb | 10d ago |
| xr33053id-f-etched.step | 10d ago |
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| xr33053id-f-hero.overlay.json | 10d ago |
| xr33053id-f.glb | 10d ago |
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XR33053ID-F
MaxLinear · Pre-ordered Chips · SOIC-14
XR33053ID-F from MaxLinear, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | N/C | unconnected | Not connected on the XR33053 14-pin package. |
| 2 | RO | output | Receiver output: high when RE is low and A-B is at least 200mV, low when A-B is at most -200mV, and high if the inputs are open, shorted or undriven for more than 2µs. |
| 3 | RE | input | Receiver output enable (hot swap): RO is enabled when RE is low and high-impedance when RE is high, and RE should be high with DE low to enter shutdown. |
| 4 | DE | input | Driver output enable (hot swap): outputs are enabled when DE is high and high-impedance when DE is low, and DE should be low with RE high to enter shutdown. |
| 5 | DI | input | Driver input: with DE high, a low on DI forces Y low and Z high, and a high on DI forces Y high and Z low. |
| 6 | GND | power_in | Power ground (one of two ground pins, 6 and 7). |
| 7 | GND | power_in | Power ground (one of two ground pins, 6 and 7). |
| 8 | N/C | unconnected | Not connected on the XR33053 14-pin package. |
| 9 | Y | output | Non-inverting driver output. |
| 10 | Z | output | Inverting driver output. |
| 11 | B | input | Inverting receiver input. |
| 12 | A | input | Non-inverting receiver input. |
| 13 | N/C | unconnected | Not connected on the XR33053 14-pin package. |
| 14 | VCC | power_in | 3.0V to 5.5V power supply input; bypass to ground with a 0.1µF capacitor. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MaxLinear |
| Package | SOIC-14 |
| Category | Interface ICs |
| Pins | 14 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage range | VCC | 3 | 5.5 | V | 2 | ||
| VCC | VCC | -0.3 | 7 | V | 2 | ||
| Input voltage (DE and DI) | -0.3 | 7 | V | 2 | |||
| Input voltage (RE) | -0.3 | V | Maximum printed as VCC + 0.3V | 2 | |||
| Receiver output voltage (RO) | -0.3 | V | Maximum printed as VCC + 0.3V | 2 | |||
| Driver output voltage (Y, Z, A/Y and B/Z) | -60 | 60 | V | 2 | |||
| Receiver input voltage (A, B, A/Y and B/Z) | -60 | 60 | V | 2 | |||
| Transient voltage pulse | -100 | 100 | V | Through 100Ω | 2 | ||
| Driver output current | -250 | 250 | mA | 2 | |||
| Maximum junction temperature | 150 | °C | 2 | ||||
| Storage temperature | -65 | 150 | °C | 2 | |||
| Lead temperature (soldering 10 seconds) | 300 | °C | Soldering 10 seconds | 2 | |||
| ESD HBM (A, B, Y and Z pins) | -15 | 15 | kV | Human Body Model | 2 | ||
| ESD HBM (all other pins) | -4 | 4 | kV | Human Body Model | 2 | ||
| Operating temperature range | -40 | 85 | °C | XR33053ID-F (ID grade) per ordering information | 19 | ||
| Differential driver output (RS-422) | VOD | 2 | V | 4.5V ≤ VCC ≤ 5.5V, RL = 100Ω (RS-422), Figure 3; maximum printed as VCC | 3 | ||
| Differential driver output (RS-485) | VOD | 1.5 | V | 4.5V ≤ VCC ≤ 5.5V, RL = 54Ω (RS-485), Figure 3; maximum printed as VCC | 3 | ||
| Differential driver output over common mode | VOD | 1.5 | V | 4.5V ≤ VCC ≤ 5.5V, -25V ≤ VCM ≤ 25V, Figure 4; maximum printed as VCC | 3 | ||
| Differential driver output (RS-422) | VOD | 0.85 | V | 3.0V ≤ VCC ≤ 4.5V, RL = 100Ω (RS-422), Figure 3; maximum printed as VCC | 3 | ||
| Differential driver output (RS-485) | VOD | 0.65 | V | 3.0V ≤ VCC ≤ 4.5V, RL = 54Ω (RS-485), Figure 3; maximum printed as VCC | 3 | ||
| Change in magnitude of differential output voltage | ΔVOD | -0.2 | 0.2 | V | RL = 100Ω (RS-422) or RL = 54Ω (RS-485), Figure 3 | 3 | |
| Driver common-mode output voltage (steady state) | VCM | 1 | 3 | V | Steady state | 3 | |
| Change in magnitude of common-mode output voltage | ΔVCM | -0.2 | 0.2 | V | 3 | ||
| Logic input current (DI, DE and RE) | IIN | -1 | 1 | µA | 0V ≤ VIN ≤ VCC, after first transition | 3 | |
| Logic input current hot swap (DE and RE) | IINHS | -200 | 100 | 200 | µA | Until first transition | 3 |
| Driver short-circuit output current | IOSD | -250 | 250 | mA | -60V ≤ VOUT ≤ 60V, DI = 0V or VCC, Figure 5 | 3 | |
| Receiver differential input signal threshold voltage (VA - VB) | VSTH | -85 | 200 | mV | -25V ≤ VOUT ≤ 25V | 4 | |
| Negative going receiver differential input fail-safe threshold voltage (VA - VB) | VFSTH- | -200 | -125 | -40 | mV | -25V ≤ VOUT ≤ 25V | 4 |
| Positive going receiver differential input fail-safe threshold voltage (VA - VB) | VFSTH+ | -100 | -10 | mV | -25V ≤ VOUT ≤ 25V | 4 | |
| High-Z receiver output current | IOZR | -1 | 1 | µA | 0V ≤ VOUT ≤ VCC | 4 | |
| Supply current in shutdown mode | ISHDN | 0.001 | 1 | µA | RE = VCC, DE = 0V | 4 | |
| Driver propagation delay (low to high) | tDPLH | 150 | 500 | ns | CL = 50pF, RL = 54Ω, Figure 7 | 6 | |
| Driver propagation delay (high to low) | tDPHL | 150 | 500 | ns | CL = 50pF, RL = 54Ω, Figure 7 | 6 | |
| Differential driver output skew | /tDPLH-tDPHL/ | 5 | 50 | ns | 6 | ||
| Driver differential output rise or fall time | tDR, tDF | 100 | 200 | 300 | ns | 6 | |
| Driver enable to output high | tDZH | 1000 | 2500 | ns | CL = 50pF, RL = 500Ω, Figure 8 | 6 | |
| Driver enable to output low | tDZL | 1000 | 2500 | ns | CL = 50pF, RL = 500Ω, Figure 8 | 6 | |
| Driver enable from shutdown to output high | tDZH(SHDN) | 2500 | 4500 | ns | CL = 50pF, RL = 500Ω, Figure 8 | 6 | |
| Driver enable from shutdown to output low | tDZL(SHDN) | 2500 | 4500 | ns | CL = 50pF, RL = 500Ω, Figure 8 | 6 | |
| Time to shutdown (driver table) | tSHDN | 50 | 200 | 600 | ns | Notes 1 and 2 | 6 |
| Time to shutdown (receiver table) | tSHDN | 50 | 200 | 600 | ns | Notes 1 and 2 | 6 |
| Logic high input thresholds (DI, DE and RE) | VIH | 2 | V | VCC = 3.3V | 3 | ||
| Logic high input thresholds (DI, DE and RE) | VIH | 2.4 | V | VCC = 5.0V | 3 | ||
| Logic low input thresholds (DI, DE and RE) | VIL | 0.8 | V | 3 | |||
| Input hysteresis (DI, DE and RE) | VHYS | 100 | mV | 3 | |||
| Input current (A and B) | IA, B | 100 | µA | VCC = 0V or 5.5V, VOUT = 12V, DE = 0V, for XR33052/53/55 | 3 | ||
| Input current (A and B) | IA, B | -80 | µA | VCC = 0V or 5.5V, VOUT = -7V, DE = 0V, for XR33052/53/55 | 3 | ||
| Output leakage (Y and Z) full-duplex | IOL | 100 | µA | VOUT = 12V, DE = 0V, VCC = 0V or 5.5V | 3 | ||
| Output leakage (Y and Z) full-duplex | IOL | -80 | µA | VOUT = -7V, DE = 0V, VCC = 0V or 5.5V | 3 | ||
| Thermal shutdown temperature | TTS | 175 | °C | Junction temperature(1) | 4 | ||
| Receiver output low voltage (RO) | VOL | 0.4 | V | IOUT = 4mA | 4 | ||
| RX input resistance | RIN | 120 | kΩ | -25V ≤ VCM ≤ 25V, XR33052/53/55 | 4 | ||
| Supply current | ICC | 4 | mA | No load, RE = 0V or VCC, DE = VCC, DI = 0V or VCC | 4 | ||
| Maximum data rate (driver table) | 1 | Mbps | 1/tUI, duty cycle 40% to 60% | 6 | |||
| Driver disable from output high | tDHZ | 250 | ns | 6 | |||
| Receiver propagation delay (low to high) | tRPLH | 200 | ns | CL = 15pF, VID = ±2V, VID rise and fall times < 15ns, Figure 9 | 6 | ||
| Receiver propagation delay (high to low) | tRPHL | 200 | ns | CL = 15pF, VID = ±2V, VID rise and fall times < 15ns, Figure 9 | 6 | ||
| Receiver propagation delay skew | /tRPLH-tRPHL/ | 30 | ns | 6 | |||
| Maximum data rate (receiver table) | 1 | Mbps | 1/tUI, duty cycle 40% to 60% | 6 |
CAD (KiCad official)
- Symbol:
XR33053ID-F - Footprint:
Package_SO:SOIC-14_3.9x8.7mm_P1.27mm - 3D model: SOIC-14 (KiCad packages3D, STEP)
- 3D model files:
xr33053id-f-etched.step/xr33053id-f-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);xr33053id-f.step/xr33053id-f.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: MaxLinear datasheet (20 pp, sha256
d4d2065166fbb06f, retrieved 2026-10-30, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).