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XR33038ID-F

MaxLinear · RS-485/RS-422 ICs · SOIC-8

XR33038ID-F from MaxLinear, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: RO is high when A-B is at or above -50mV and low when A-B is at or below -200mV, and is enabled only while RE is low.
2 RE input Receiver output enable (hot swap): RO is enabled when RE is low and high-impedance when RE is high, and RE high with DE low enters low-power shutdown.
3 DE input Driver output enable (hot swap): outputs are enabled when DE is high and high-impedance when DE is low, and DE low with RE high enters low-power shutdown.
4 DI input Driver input: with DE high, a low on DI drives the non-inverting output low and the inverting output high, and a high on DI drives the non-inverting output high and the inverting output low.
5 GND power_in Ground reference for the device.
6 A bidirectional Non-inverting receiver input and non-inverting driver output on the analog bus, which withstands direct shorts up to ±18V and is rated ±15kV HBM ESD.
7 B bidirectional Inverting receiver input and inverting driver output on the analog bus, which withstands direct shorts up to ±18V and is rated ±15kV HBM ESD.
8 VCC power_in Power supply input operating from +2.8V to +5.5V; bypass to ground with a 0.1µF capacitor.

Key specifications

Parameter Value
Manufacturer MaxLinear
Package SOIC-8
Category Communication Interface Chip/UART/485/232
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage (absolute maximum) VCC -0.3 7 V 2
Input voltage at control and driver input (RE, DE, and DI) -0.3 7 V 2
Receiver output voltage (RO) -0.3 V 2
Driver output voltage (A and B) -18 18 V 2
Receiver input voltage (A and B) -18 18 V 2
Transient voltage pulse -70 70 V through 100, Figure 5 2
Driver output current -250 250 mA 2
Storage temperature range -65 150 °C 2
Lead temperature 300 °C soldering, 10s 2
Maximum junction temperature 150 °C 2
Supply voltage range VCC 2.8 5.5 V 3
Operating ambient temperature TA -40 85 °C Unless otherwise noted: VCC = +2.8V to +5.5V 3
Differential driver output (RS-422), +3.0V to +5.5V VOD 2 V +3.0V ≤ VCC ≤ +5.5V; RL = 100 (RS-422), Figure 2 3
Differential driver output (RS-485), +3.0V to +5.5V VOD 1.5 V +3.0V ≤ VCC ≤ +5.5V; RL = 54 (RS-485), Figure 2 3
Differential driver output over common mode, +3.0V to +5.5V VOD 1.5 V +3.0V ≤ VCC ≤ +5.5V; -7V ≤ VCM ≤ +12V, Figure 3 3
Differential driver output (RS-422), +2.8V to +3.0V VOD 1.8 V +2.8V ≤ VCC ≤ +3.0V; RL = 100 (RS-422), Figure 2 3
Differential driver output (RS-485), +2.8V to +3.0V VOD 1.4 V +2.8V ≤ VCC ≤ +3.0V; RL = 54 (RS-485), Figure 2 3
Differential driver output over common mode, +2.8V to +3.0V VOD 1.1 V +2.8V ≤ VCC ≤ +3.0V; -7V ≤ VCM ≤ +12V, Figure 3 3
Change in magnitude of differential output voltage VOD -0.2 0.2 V RL = 100 (RS-422), or RL = 54 (RS-485), Figure 2, Note 1 3
Driver common-mode output voltage (steady state) VCM 3 V 3
Change in magnitude of common-mode output voltage VCM -0.2 0.2 V 3
Logic high threshold (DI, DE, RE), VCC 4.5V to 5.5V VIH 2.8 V +4.5V ≤ VCC ≤ 5.5V 3
Logic high threshold (DI, DE, RE), VCC 4.0V to 4.5V VIH 2.3 V +4.0V ≤ VCC ≤ 4.5V 3
Logic high threshold (DI, DE, RE), VCC 2.8V to 4.0V VIH 2 V +2.8V ≤ VCC ≤ +4.0V 3
Logic low threshold (DI, DE, RE) VIL 0.8 V 3
Logic input current (DI, DE, RE) IIN -1 1 µA 0V ≤ VIN ≤ VCC, After first transition, Note 2 3
Logic input current (DE and RE) until first transition IIN -200 100 200 µA Until first transition, Note 2 3
Input current (A and B) IA, B 125 µA VOUT = +12V, DE = 0V, VCC = 0V or +5.5V 3
Input current (A and B) IA, B -100 µA VOUT = -7V, DE = 0V, VCC = 0V or +5.5V 3
Output leakage (Y and Z) IOL 125 µA Full Duplex (Note 2); VOUT = +12V, DE = 0V, VCC = 0V or +5.5V 3
Output leakage (Y and Z) IOL -100 µA Full Duplex (Note 2); VOUT = -7V, DE = 0V, VCC = 0V or +5.5V 3
Driver short-circuit output current IOSD -250 250 mA -7V ≤ VOUT ≤ +12V, Figure 4 3
Receiver differential input threshold voltage (VA - VB) VTH -200 -125 -50 mV -7V ≤ VCM ≤ +12V 4
Receiver output low voltage (RO) VOL 0.4 V IOUT = 1mA 4
High-Z receiver output current IOZR -1 1 µA 0V ≤ VOUT ≤ VCC 4
Receiver input resistance RIN 96 k -7V ≤ VCM ≤ +12V 4
Receiver output short-circuit current IOSC -120 120 mA 0V ≤ VRO ≤ VCC 4
Supply current ICC 400 600 µA No Load, RE = 0V, DE = VCC, DI = 0V 4
Supply current ICC 300 600 µA No Load, RE = VCC, DE = VCC, DI = 0V 4
Supply current ICC 300 500 µA No Load, RE = 0V, DE = 0V, Receiver A and B inputs open 4
Supply current in shutdown mode ISHDN 0.04 1 µA RE = VCC, DE = 0V 4
ESD protection for A, B, Y, and Z -15 15 kV Human Body Model 4
ESD protection for A, B, Y, and Z -8 8 kV IEC 61000-4-2 Contact 4
ESD protection for all other pins -4 4 kV Human Body Model 4
Time to shutdown (driver section) tSHDN 50 200 600 ns Notes 3 7
Time to shutdown (receiver section) tSHDN 50 200 600 ns Notes 3 7
Thermal resistance junction-to-ambient, 8-pin SO JA 128.4 °C/W 2
Input hysteresis (DI, DE, RE) VHYS 100 mV 3
Driver thermal shutdown temperature TTS 175 °C Junction temperature 4
Driver thermal shutdown hysteresis TTSH 15 °C 4
Receiver input hysteresis VOH 25 mV VCM = 0V 4
Driver propagation delay (low to high), XR33038 tDPLH 30 ns CL = 50pF, RL = 54, Figure 6 7
Driver propagation delay (high to low), XR33038 tDPHL 30 ns CL = 50pF, RL = 54, Figure 6 7
Differential driver output skew, XR33038 /tDPLH-tDPHL/ 5 ns 7
Driver differential output rise or fall time, XR33038 tDR, tDF 25 ns 7
Receiver propagation delay (low to high), XR33038 tRPLH 50 ns CL = 15pF, VID = ±2V, VID rise and fall times < 15ns, Figure 8 7
Receiver propagation delay (high to low), XR33038 tRPHL 50 ns CL = 15pF, VID = ±2V, VID rise and fall times < 15ns, Figure 8 7
Receiver propagation delay skew, XR33038 /tRPLH-tRPHL/ 5 ns 7
Driver enable from shutdown to output high, XR33038 tDZH(SHDN) 250 ns CL = 50pF, RL = 500, Figure 7 7

CAD (KiCad official)

  • Symbol: XR33038ID-F
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: xr33038id-f-etched.step / xr33038id-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xr33038id-f.step / xr33038id-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MaxLinear datasheet (19 pp, sha256 fa548c51581f4b2a, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF