# XPM7305A

**Shenzhen Fuman** · Battery Management ICs · TSSOP-16

XPM7305A from Shenzhen Fuman, in a TSSOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | ISN | input | Negative input of the current-sense amplifier; rated -0.2 V to 8.5 V absolute maximum and 0 V to 5.5 V recommended. |
| 2 | VDD | power_out | Internal supply pin; the NTC over-temperature threshold is referenced to it (0.3 VDD) and UVLO rising/falling thresholds are 3.7 V/3.2 V typ. |
| 3 | GND | power_in | Chip ground, the reference for all absolute-maximum voltage ratings. |
| 4 | NTC | input | External NTC thermistor input; the output is shut off as over-temperature when the divider voltage with R3 falls below 0.3 VDD (rated 0 V to 5.5 V recommended). |
| 5 | FOD | input | FOD sensitivity configuration pin; a smaller pull-down resistor gives higher sensitivity, with 15 kOhm as the default external value. |
| 6 | IAO | output | Current-sense amplifier output (rated 0 V to 5.5 V recommended). |
| 7 | DEMIN1 | input | AC analog signal amplifier input 1 for ASK demodulation (rated 0 V to 5.5 V recommended). |
| 8 | DEMIN2 | input | AC analog signal amplifier input 2 for ASK demodulation (rated 0 V to 5.5 V recommended). |
| 9 | LED2 | output | LED2 indicator output (rated 0 V to 5.5 V recommended). |
| 10 | LED1 | output | LED1 indicator output (rated 0 V to 5.5 V recommended). |
| 11 | PVDD2 | power_in | Power supply pin for half-bridge 2, 4.5 V to 5.5 V operating, 8.5 V absolute maximum. |
| 12 | SW2 | output | Half-bridge 2 output of the integrated H-bridge, 8.5 V absolute maximum. |
| 13 | PGND2 | power_in | Power ground for half-bridge 2. |
| 14 | PGND1 | power_in | Power ground for half-bridge 1. |
| 15 | SW1 | output | Half-bridge 1 output of the integrated H-bridge, 8.5 V absolute maximum. |
| 16 | PVDD1 | power_in | Power supply pin for half-bridge 1, 4.5 V to 5.5 V operating, 8.5 V absolute maximum. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Shenzhen Fuman |
| Package | TSSOP-16 |
| Category | Power Management ICs |
| Pins | 16 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating voltage range | VIN_RANGE | 4.5 |  | 5.5 | V |  | 4 |
| UVLO rising threshold (VDD) | UVLO | 3.6 | 3.7 | 3.9 | V | 上升门限 (rising) | 4 |
| UVLO falling threshold (VDD) | UVLO | 3.1 | 3.2 | 3.4 | V | 下降门限 (falling) | 4 |
| Absolute max voltage PVDD, ISP, ISN, SW to GND |  | -0.2 |  | 8.5 | V | 对 GND | 3 |
| Absolute max voltage LED, NTC, IAO, DEMIN, DEMOUT to GND |  | -0.2 |  | 8.5 | V | 对 GND | 3 |
| Junction temperature (absolute max) |  | -40 |  | 150 | °C |  | 3 |
| Storage temperature |  | -65 |  | 150 | °C |  | 3 |
| Input voltage PVDD, ISP, ISN |  | 0 |  | 5.5 | V |  | 3 |
| Port voltage LED, NTC, IAO, DEMIN |  | 0 |  | 5.5 | V |  | 3 |
| Operating junction temperature |  | -40 |  | 125 | °C |  | 3 |
| ESD HBM | VESDHBM |  |  | 2000 | V | 人体放电模式 (HBM) | 3 |
| ESD MM | VESDMM |  |  | 200 | V | 机械放电模式 (MM) | 3 |
| Standby power consumption | Istandby |  | 3 |  | mA | 输入 5V | 4 |
| UVLO hysteresis |  |  | 0.5 |  | V | 迟滞 | 4 |
| Power adaptation V_H | V_H |  | 4.5 |  | V | 功率自适应 | 4 |
| Power adaptation V_L | V_L |  | 4.3 |  | V | 功率自适应 | 4 |
| OVP rising threshold |  |  | 6.5 |  | V | 上升门限 | 4 |
| OVP falling threshold |  |  | 6 |  | V | 下降门限 | 4 |
| OVP response time |  |  | 20 |  | us | 发生过压到完全关闭 MOS | 4 |
| OCP current protection threshold | OCP |  | 2 |  | A | config | 4 |
| MOS peak current protection | OCPIPEAK |  | 5 |  | A | fuse option | 4 |
| OTP rising threshold |  |  | 135 |  | °C | 上升门限 | 4 |
| OTP falling threshold |  |  | 105 |  | °C | 下降门限 | 4 |
| Thermal resistance junction to ambient | RθJA |  | 100 |  | °C/W |  | 4 |
| Thermal resistance junction to case top | RθJCtop |  | 36 |  | °C/W |  | 4 |
| Thermal resistance junction to board | RθJB |  | 45 |  | °C/W |  | 4 |

## CAD (KiCad official)

- Symbol: `XPM7305A`
- Footprint: `Package_SO:TSSOP-16_4.4x5mm_P0.65mm`
- 3D model: TSSOP-16 (KiCad packages3D, STEP)
- 3D model files: `xpm7305a-etched.step` / `xpm7305a-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `xpm7305a.step` / `xpm7305a.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Shenzhen Fuman datasheet](docs/xpm7305a-datasheet.pdf) (7 pp, sha256 `6ada830b1759cfdf`, retrieved 2026-10-31, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/xpm7305a-datasheet.pdf)