# XPM5015A35

**Shenzhen Fuman** · Battery Management · ESOP-8

XPM5015A35 from Shenzhen Fuman, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VOUT | input | Output voltage feedback pin that senses the regulated 5 V output (datasheet gives no numeric limit for this pin). |
| 2 | DPDM1 | bidirectional | USB identification signal line DPDM1; the absolute maximum voltage on DPDM1/DPDM2 is -0.3 V to 6 V. |
| 3 | DPDM2 | bidirectional | USB identification signal line DPDM2; the absolute maximum voltage on DPDM1/DPDM2 is -0.3 V to 6 V. |
| 4 | VIN | power_in | Input voltage pin that must be placed close to the IC with an input filter capacitor (100 µF recommended); absolute maximum 36 V, recommended operating range 8 V to 30 V. |
| 5 | SW | output | DC-DC switching node connected to the inductor; absolute maximum VSW is -0.3 V to VIN. |
| 6 | SW | output | DC-DC switching node connected to the inductor (second SW pin, same node as pin 5); absolute maximum VSW is -0.3 V to VIN. |
| 7 | BST | passive | Bootstrap pin; a 0.1 µF bootstrap capacitor placed close to BST and SW supplies the high-side MOSFET gate drive, with VBST limited to VSW-0.3 V to VSW+6 V. |
| 8 | LINK | bidirectional | Load status indicator on the XPD-LINK bus: high impedance at light load and sources 60 µA at heavy load; the bus uses a 10 kΩ pull-down resistor to ground in application. |
| 9 | PGND | power_in | Power ground and heat-sink (thermal) ground for the device. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Shenzhen Fuman |
| Package | ESOP-8 |
| Category | Power Management (PMIC) |
| Pins | 9 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Output no-load voltage | VOUT | 5 | 5.07 | 5.15 | V | VOUT=5V | 5 |
| Operating frequency | FOSC | 115 | 130 | 155 | kHz |  | 5 |
| Constant-current mode maximum output current | ICC | 3.4 | 3.5 | 3.6 | A | VOUT=5V | 5 |
| Input overvoltage protection | VINOVP | 30 | 31 | 32 | V |  | 5 |
| VIN undervoltage current | IUVLO |  | 400 |  | uA | VIN=6V | 5 |
| Static operating current (no switching) | INOSW |  | 600 |  | uA | VIN=12V | 5 |
| VIN undervoltage lockout upper threshold | VUVLO_UP |  | 8 |  | V |  | 5 |
| VIN undervoltage lockout lower threshold | VUVLO_DOWN |  | 7.5 |  | V |  | 5 |
| VIN undervoltage lockout hysteresis | VUVLO_HYS |  | 0.5 |  | V |  | 5 |
| Input overvoltage protection hysteresis | VINOVP_HYS |  | 3 |  | V |  | 5 |
| High-side MOSFET on-resistance | RDSON_H |  | 55 |  | mΩ |  | 5 |
| Low-side MOSFET on-resistance | RDSON_L |  | 40 |  | mΩ |  | 5 |
| Maximum duty cycle | DMAX |  | 95 |  | % |  | 5 |
| Minimum on-time | TON |  | 200 |  | ns |  | 5 |
| Soft-start time | TSS |  | 2 |  | mS |  | 5 |
| Output short-circuit protection threshold | VSHORT |  | 2.7 |  | V |  | 5 |
| HICCUP time | THICCUP |  | 128 |  | mS |  | 5 |
| Output line compensation voltage | VCOMP |  | 50 |  | mV/A |  | 5 |
| Over-temperature shutdown temperature | TSD |  | 150 |  | ℃ |  | 5 |
| Over-temperature shutdown hysteresis | TSD_HYS |  | 15 |  | ℃ |  | 5 |
| VIN absolute maximum voltage | VIN | -0.3 |  | 36 | V |  | 4 |
| SW absolute maximum voltage | VSW | -0.3 |  |  | V |  | 4 |
| DPDM1/DPDM2 absolute maximum voltage | DPDM1/DPDM2 | -0.3 |  | 6 | V |  | 4 |
| Junction temperature absolute maximum | TJ | -40 |  | 150 | ℃ |  | 4 |
| Storage temperature absolute maximum | TSTG | -65 |  | 150 | ℃ |  | 4 |
| ESD rating, human body model | VESDHBM | -4000 |  | 4000 | V | Human body model (HBM) | 4 |
| Input voltage recommended operating range | VIN | 8 |  | 30 | V |  | 4 |
| Input capacitor | CIN |  | 100 |  | µF |  | 4 |
| Output capacitor | COUT |  | 220 |  | µF |  | 4 |
| Ambient temperature operating range | TA | -40 |  | 125 | ℃ |  | 4 |
| Junction-to-ambient thermal resistance | RθJA |  | 100 |  | ℃/W |  | 4 |
| Junction-to-case (top) thermal resistance | RθJCtop |  | 36 |  | ℃/W |  | 4 |
| Junction-to-board thermal resistance | RθJB |  | 45 |  | ℃/W |  | 4 |

## CAD (KiCad official)

- Symbol: `XPM5015A35`
- Footprint: `Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm`
- 3D model: ESOP-8 (KiCad packages3D, STEP)
- 3D model files: `xpm5015a35-etched.step` / `xpm5015a35-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `xpm5015a35.step` / `xpm5015a35.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Shenzhen Fuman datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588946083657891840) (8 pp, sha256 `83842020ac9f68b5`, retrieved 2026-10-19, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/xpm5015a35-datasheet.pdf)