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XPD977B

Public Made by Adom

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Shenzhen Fuman Battery Management, QFN-32-EP(5x5). Pinout extracted from the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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XPD977B

Shenzhen Fuman · Battery Management · QFN-32-EP(5x5)

XPD977B from Shenzhen Fuman, in a QFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VFB input Voltage-regulation feedback input. Connects to the system output-voltage divider tap (typ. R_FB1=100kΩ / R_FB2=33kΩ) for dynamic PD/QC output-voltage regulation.
2 IREF passive CC (constant-current) loop compensation pin. Recommended RC network R_CMP2=10kΩ, C_CMP2=10nF. Leave floating if the CC function is unused.
3 CSN input Main current-sense negative input. Must be tied to GND when unused; do not leave floating. Works with the internal 10 mΩ sense resistor / external R_S1 (10 mΩ).
4 CSP input Main current-sense positive input. Must be tied to GND when unused; do not leave floating.
5 ISP2 input Type-A2 port current-sense positive input (with external R_S2 = 5 mΩ). Used for per-port current limiting on A2 output.
6 ISP3 input Type-A3 port current-sense positive input (with external R_S3 = 5 mΩ). Used for per-port current limiting on A3 output.
7 DP3 bidirectional Type-A3 port USB D+ data line. Handles QC/FCP/AFC/Apple 2.4A/BC1.2 handshake on port A3.
8 LINK bidirectional XPD-LINK™ inter-chip interconnection bus. Enables multi-XPD-chip cooperative operation across ports; pull to GND via R_LINK = 10 kΩ.
9 DM3 bidirectional Type-A3 port USB D− data line.
10 DIS output External discharge NMOS gate drive. Drives an external N-MOSFET that discharges VBUS/VPWR bulk capacitors during voltage step-down transitions.
11 AISN input XPD-LINK interconnect current-sense negative input (used when interworking with non-XPD-series parts). Tie to GND if unused.
12 AISP input XPD-LINK interconnect current-sense positive input (used when interworking with non-XPD-series parts). Tie to GND if unused.
13 USBA3 power_out Type-A3 port VBUS output rail (post external PMOS switch).
14 GD3 output Type-A3 port external PMOS gate driver. Requires C_GATE2 = 47 nF GS capacitor.
15 DP2 bidirectional Type-A2 port USB D+ data line.
16 DM2 bidirectional Type-A2 port USB D− data line.
17 USBA2 power_out Type-A2 port VBUS output rail (post external PMOS switch).
18 GD2 output Type-A2 port external PMOS gate driver. Requires C_GATE1 = 47 nF GS capacitor.
19 CC1 bidirectional Type-C port CC1 configuration channel. Handles USB PD3.0 BMC PHY and orientation detection.
20 DP1 bidirectional Type-C port USB D-line (datasheet text labels this pin's function as 'Type-C 口数据端口 DM' despite the DP1 name).
21 DM1 bidirectional Type-A port USB D-line (datasheet text labels this pin's function as 'Type-A 口数据端口 DP' despite the DM1 name).
22 CC2 bidirectional Type-C port CC2 configuration channel.
23 VBUS power_out Type-C port VBUS output rail (integrated 10 mΩ switch). Pins 23/24/25 are tied internally.
24 VBUS power_out Type-C port VBUS output rail (integrated 10 mΩ switch). Pins 23/24/25 are tied internally.
25 VBUS power_out Type-C port VBUS output rail (integrated 10 mΩ switch). Pins 23/24/25 are tied internally. Recommend C_VBUS 1-10 µF.
26 NC unconnected No connect. Leave floating.
27 NC unconnected No connect. Leave floating.
28 VPWR power_in Main input supply (3.3 V to 21 V; absolute max 26 V). Pins 28/29/30 are tied internally. Recommend C_VPWR 1-10 µF.
29 VPWR power_in Main input supply (3.3 V to 21 V). Pins 28/29/30 are tied internally.
30 VPWR power_in Main input supply (3.3 V to 21 V). Pins 28/29/30 are tied internally.
31 NC unconnected No connect. Leave floating.
32 OPTO output Optocoupler driver output for AC-DC primary-side feedback control loop.
33 GND power_in Exposed thermal pad - chip ground (EPAD). Must be soldered to the PCB ground plane for both electrical return and heat dissipation (R_θJA ≈ 34 °C/W).

Key specifications

Parameter Value
Manufacturer Shenzhen Fuman
Package QFN-32-EP(5x5)
Category PMIC
Pins 33

Ordering variants

Same part, different packaging or reel option.

  • XPD977B18
  • XPD977BP18
  • XPD977A
  • XPD977B
  • XPD977BV
  • XPD977D30A
  • XPD977D30
  • XPD977DP30
  • XPD977D45
  • XPD977DP45
  • XPD977D60
  • XPD977DP60
  • XPD977D65
  • XPD977DP65
  • XPD977D6545
  • XPD977DP6545
  • XPD977D6518

CAD (KiCad official)

  • Symbol: XPD977B
  • Footprint: Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm
  • 3D model: QFN-32-EP(5x5) (KiCad packages3D, STEP)
  • 3D model files: xpd977b-etched.step / xpd977b-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xpd977b.step / xpd977b.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shenzhen Fuman datasheet (19 pp, sha256 5a87c34d62e6ac88, retrieved 2026-08-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF