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XPD930B

Public Made by Adom

by adom

Shenzhen Fuman Battery Management, TSSOP-20. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.

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docs xpd930b: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 4d ago
viewers xpd930b: viewers · Ray 28d ago
package.json Publish 0.1.0 · Ray 28d ago
page.json Brief states the pinout check that actually ran (was an unconditional "Datasheet-verified pinout") · Ray 11d ago
README.md xpd930b: laser-etched CAD + chip hero (factory 2.0.0 backfill) · Ray 17d ago
xpd930b-etched.fit.json xpd930b: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 4d ago
xpd930b-etched.glb xpd930b: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 4d ago
xpd930b-etched.step xpd930b: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 4d ago
xpd930b.glb Publish 0.1.0 · Ray 28d ago
xpd930b.kicad_mod Publish 0.1.0 · Ray 28d ago
xpd930b.kicad_sym Publish 0.1.0 · Ray 28d ago
xpd930b.lbr Publish 0.1.0 · Ray 28d ago
xpd930b.step Publish 0.1.0 · Ray 28d ago

XPD930B

Shenzhen Fuman · Battery Management · TSSOP-20

XPD930B from Shenzhen Fuman, in a TSSOP-20. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VPWR power_in Chip supply / VBUS input source from the front-stage AC-DC or DC-DC output. Recommended 10 µF decoupling to GND; operating range 3.6-21 V (UVLO rising 3.3 V, falling 2.9 V).
2 VPWR power_in Chip supply input, internally tied to pin 1. Both pins carry the front-stage supply current into the die.
3 OPTO output Opto-coupler drive output that closes the primary-side feedback loop of the AC-DC front stage, letting the chip adjust the VBUS rail dynamically for PD/PPS.
4 VFB input System voltage regulation feedback pin, tied to the system voltage feedback divider (recommended R_FB1 = 100 kΩ, R_FB2 = 33 kΩ).
5 IREF passive CC loop compensation node; connect a compensation network (typ. R = 10 kΩ, C = 10 nF) to GND. Leave floating if the constant-current function is not used.
6 GND power_in Device ground reference for analog, digital and power sections.
7 CSN input Current-sense negative input across the external 10 mΩ shunt R_S1. Tie to GND if the constant-current function is not used; must not be left floating.
8 CSP input Current-sense positive input across the external 10 mΩ shunt R_S1. Tie to GND if the constant-current function is not used; must not be left floating.
9 LINK bidirectional XPD-LINK™ shared bus terminal for inter-chip communication in multi-port chargers; pull the shared bus to GND via a 10 kΩ resistor. May be left floating if not used.
10 DIS output Gate-drive output for the external discharge NMOS (bleeder). R_ON of internal N1 is 40 Ω typ (100 Ω max).
11 AISN input Cascade current-sense negative input, used only when cascading with a non-XPD-series part. Connect to GND when not used.
12 AISP input Cascade current-sense positive input, used only when cascading with a non-XPD-series part. Connect to GND when not used.
13 NC unconnected No internal connection; leave floating.
14 NC unconnected No internal connection; leave floating.
15 CC1 bidirectional USB Type-C configuration channel 1: performs DFP Rp advertisement (3 A / 1.5 A) and BMC PD communication. 24 V abs-max, OVP protected.
16 DP bidirectional USB Type-C D+ data line, used for BC1.2, Apple 2.4 A, QC and HVDCP handshakes. 24 V abs-max, OVP protected.
17 DM bidirectional USB Type-C D− data line, used for BC1.2, Apple 2.4 A, QC/FCP/SCP/AFC handshakes. 24 V abs-max, OVP protected.
18 CC2 bidirectional USB Type-C configuration channel 2: performs DFP Rp advertisement (3 A / 1.5 A) and BMC PD communication. 24 V abs-max, OVP protected.
19 VBUS power_out USB Type-C VBUS output from the integrated 10 mΩ high-side switch; supports up to 20 V/3.25 A (65 W). Requires a 2.2-10 µF cap to GND; pins 19 and 20 must be tied together.
20 VBUS power_out USB Type-C VBUS output, internally tied to pin 19; carries the output current of the internal switch MOSFET.

Key specifications

Parameter Value
Manufacturer Shenzhen Fuman
Package TSSOP-20
Category PMIC
Pins 20

Ordering variants

Same part, different packaging or reel option.

  • XPD930A
  • XPD930B
  • XPD930D30A
  • XPD930D30
  • XPD930DP30
  • XPD930D45
  • XPD930DP45
  • XPD930D60
  • XPD930DP60
  • XPD930D65
  • XPD930DP65
  • XPD930D6545
  • XPD930QXXXXX

CAD (KiCad official)

  • Symbol: XPD930B
  • Footprint: Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm
  • 3D model: TSSOP-20 (KiCad packages3D, STEP)
  • 3D model files: xpd930b-etched.step / xpd930b-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xpd930b.step / xpd930b.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shenzhen Fuman datasheet (19 pp, sha256 48a8084240110c9d, retrieved 2026-08-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF