component
XPD319BP
Public Made by Adomby adom
Shenzhen Fuman USB ICs, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownXPD319BP
Shenzhen Fuman · USB ICs · SOP-8
XPD319BP from Shenzhen Fuman, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VBUS | power_in | VBUS output detection pin, rated -0.3 V to 13 V to GND (absolute maximum) and 0 to 12 V recommended. |
| 2 | GND | power_in | Power ground, the reference for all voltage limits in the datasheet. |
| 3 | VDD | power_in | Chip supply pin, recommended 3 to 6 V, with a 0.47 to 1 uF CVDD input capacitor and a 0.33 to 1 kΩ RVDD current-limiting resistor. |
| 4 | VFB | bidirectional | Voltage regulation port connected to the front-end power supply feedback point, used with an RFB1 divider of 100 kΩ; recommended range 0 to 5 V. |
| 5 | CC2 | bidirectional | Type-C configuration channel CC2, recommended 0 to 5 V, absolute maximum -0.3 V to 13 V, with 330 to 1000 pF CC capacitor (680 pF suggested). |
| 6 | CC1 | bidirectional | Type-C configuration channel CC1, recommended 0 to 5 V, absolute maximum -0.3 V to 13 V, with 330 to 1000 pF CC capacitor (680 pF suggested). |
| 7 | DP | bidirectional | Type-C data port DP, recommended 0 to 5 V, absolute maximum -0.3 V to 13 V to GND. |
| 8 | DM | bidirectional | Type-C data port DM, recommended 0 to 5 V, absolute maximum -0.3 V to 13 V to GND. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Shenzhen Fuman |
| Package | SOP-8 |
| Category | Interface ICs |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| 耐压（对 GND）FBO,VDD | FBO,VDD | -0.3 | 6.5 | V | 对 GND | 6 | |
| 耐压（对 GND）CC1, CC2, DP, DM | CC1, CC2, DP, DM | -0.3 | 13 | V | 对 GND | 6 | |
| 耐压（对 GND）VBUS | VBUS | -0.3 | 13 | V | 对 GND | 6 | |
| 结温 | -40 | 150 | ℃ | 6 | |||
| 存储温度 | -65 | 150 | ℃ | 6 | |||
| ESD HBM | VESD | -2000 | 2000 | V | HBM | 6 | |
| 引脚 FBO,CC1,CC2,DP,DM | 0 | 5 | V | 6 | |||
| 引脚 VBUS | 0 | 12 | V | 6 | |||
| 引脚 VDD | 3 | 6 | V | 6 | |||
| CVDD 输入电容 | CVDD | 0.47 | 1 | uF | 6 | ||
| RVDD 限流电阻 | RVDD | 0.33 | 0.47 | 1 | kΩ | 6 | |
| CC1，CC2(CRX) 电容 | CRX | 330 | 680 | 1000 | pF | 6 | |
| TA 工作环境温度 | TA | -40 | 85 | ℃ | 6 | ||
| 内部供电引脚电压 | VVDD | 3 | 5.5 | V | 7 | ||
| VTX LOW 电压 | VTXLO | -75 | 75 | mV | Transmit LOW | 7 | |
| Rise/fall time of BMC | tBMC | 300 | 600 | ns | Rload=5.1k,Cload=1nF | 7 | |
| Receive HIGH | VRXHI | 800 | 840 | 885 | mV | 7 | |
| Receive LOW | VRXLO | 485 | 525 | 570 | mV | 7 | |
| CC1/CC2 Broadcasting current 3A DFP | IRP_SRC | 304 | 330 | 356 | uA | 3A DFP mode, 0 ≤ V ≤ 2.5V | 7 |
| CC1/CC2 Broadcasting current 1.5A DFP | IRP_SRC | 166 | 180 | 194 | uA | 1.5A DFP mode, 0 ≤ V ≤ 1.5V | 7 |
| 数据线检测电压 | VDAT(REF) | 0.25 | 0.325 | 0.4 | V | 7 | |
| D+高电平扰动滤波时间 | TGLITCH(DP)HIGH | 1 | 1.25 | 1.5 | s | 7 | |
| 输出电压扰动滤波时间 | TGLITCH(V)CHANGE | 20 | 40 | 60 | ms | 7 | |
| 连续模式的扰动滤波时间 | TGLITCH(CONT)CHANGE | 100 | 150 | 200 | us | 7 | |
| D+漏泄电阻 | RDAT(LKG) | 300 | 500 | 800 | KΩ | 7 | |
| D-下拉电阻 | RDM(DWN) | 14.25 | 19.53 | 24.5 | KΩ | 7 | |
| 受电设备连接检测电压阈值 | VTH(PD) | 0.25 | 0.325 | 0.4 | V | 7 | |
| 受电设备连接检测滤波时间 | TDPD | 120 | 160 | 200 | ms | 7 | |
| D+/D-数据线电压 | VDAT(2.7V) | 2.57 | 2.7 | 2.84 | V | Apple 2.4A 充电模式 | 8 |
| 典型静态工作电流 | IVDD | 300 | uA | VPWR=5V | 7 | ||
| VDD 嵌位电压 | VDD(SHUNT) | 4.75 | V | IVDD=300uA | 7 | ||
| VDD 开启电压 | VDD(ON) | 3.5 | V | VVDD 升高 | 7 | ||
| VDD 关断电压 | VDD(OFF) | 3 | V | VVDD 下降 | 7 | ||
| UVLO 迟滞 | ΔVUVLO | 0.5 | V | VDD(ON)-VDD(OFF) | 7 | ||
| Output resistance | RTX | 50 | Ω | During transmission | 7 | ||
| Transmit HIGH | VTXHI | 1.15 | V | 7 | |||
| Bit unit interval | tUI | 3.3 | us | 7 | |||
| D-低电平扰动滤波时间 | TGLITCH(DM)LOW | 1 | ms | 7 | |||
| RFB1 系统电压分压电阻 | RFB1 | 100 | kΩ | 6 | |||
| 开关 N1 导通电阻 | RON(N1) | 100 | Ω | 7 | |||
| 电压升高时电流 | ΔIT(UP) | 2 | uA | RIREF=100KΩ | 7 | ||
| 电压降低时电流源阶跃步长 | ΔIT(DO) | 2 | uA | RIREF=100KΩ | 8 | ||
| D+/D-数据线输出阻抗 | RDAT(2.7V) | 12 | KΩ | 8 | |||
| D- FCP TX Valid High | VTX-VOH | 2.7 | V | 8 | |||
| D- FCP TX Valid Low | VTX-VOL | 0.3 | V | 8 | |||
| D- FCP RX Valid High | VRX-VIH | 1.2 | V | 8 | |||
| D- FCP RX Valid Low | VRX-VIL | 0.9 | V | 8 | |||
| FCP Pulse Rise Time | Trise | 2.5 | us | 10% - 90% | 8 | ||
| FCP Pulse Fall Time | Tfall | 2.5 | us | 90% - 10% | 8 | ||
| 结温和周围温度之间的热阻 | RθJA | 40 | ℃/W | 6 |
CAD (KiCad official)
- Symbol:
XPD319BP - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
xpd319bp-etched.step/xpd319bp-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);xpd319bp.step/xpd319bp.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Shenzhen Fuman datasheet (9 pp, sha256
98ee6ed470e846eb, retrieved 2026-10-27, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusoff(skipped (clean text read)), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).