component
XP162A12A6PR-G
Public Made by Adomby adom
Torex Semicon MOSFETs, SOT-89. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownXP162A12A6PR-G
Torex Semicon · MOSFETs · SOT-89
XP162A12A6PR-G from Torex Semicon, in a SOT-89. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-source voltage limited to ±12 V, with built-in gate protect diode and -2.5 V drive voltage. |
| 2 | D | passive | Drain; drain-source voltage -20 V max, DC drain current -2.5 A and pulsed drain current -10 A. |
| 3 | S | passive | Source; reverse drain (body diode) current -2.5 A max. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Torex Semicon |
| Package | SOT-89 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain Cut-Off Current | Idss | -10 | μA | Vds= -20V, Vgs= 0V | 2 | ||
| Gate-Source Leak Current | Igss | -10 | 10 | μA | Vgs= ±12V, Vds= 0V | 2 | |
| Gate-Source Cut-Off Voltage | Vgs(off) | -0.5 | -1.2 | V | Id=-1mA, Vds= -10V | 2 | |
| Drain-Source On-State Resistance | Rds(on) | 0.13 | 0.17 | Ω | Id=-1.5A, Vgs= -4.5V | 2 | |
| Drain-Source On-State Resistance | Rds(on) | 0.22 | 0.3 | Ω | Id=-1.5A, Vgs= -2.5V | 2 | |
| Body Drain Diode Forward Voltage | Vf | -0.85 | -1.1 | V | If= -2.5A, Vgs= 0V | 2 | |
| Drain-Source Voltage | Vdss | -20 | V | Ta = 25℃ | 1 | ||
| Gate-Source Voltage | Vgss | -12 | 12 | V | Ta = 25℃ | 1 | |
| Drain Current (DC) | Id | -2.5 | A | Ta = 25℃ | 1 | ||
| Drain Current (Pulse) | Idp | -10 | A | Ta = 25℃ | 1 | ||
| Reverse Drain Current | Idr | -2.5 | A | Ta = 25℃ | 1 | ||
| Channel Power Dissipation | Pd | 2 | W | Ta = 25℃; when implemented on a ceramic PCB (900mm2 x 0.8mm) | 1 | ||
| Channel Temperature | Tch | 150 | ℃ | Ta = 25℃ | 1 | ||
| Storage Temperature Range | Tstg | -55 | 150 | ℃ | Ta = 25℃ | 1 | |
| Forward Transfer Admittance | /Yfs/ | 4 | S | Id=-1.5A, Vds= -10V | 2 | ||
| Input Capacitance | Ciss | 310 | pF | Vds=-10V, Vgs=0V, f= 1MHz | 2 | ||
| Output Capacitance | Coss | 200 | pF | Vds=-10V, Vgs=0V, f= 1MHz | 2 | ||
| Feedback Capacitance | Crss | 90 | pF | Vds=-10V, Vgs=0V, f= 1MHz | 2 | ||
| Turn-On Delay Time | td (on) | 5 | ns | Vgs= -5V, Id= -1.5A, Vdd= -10V | 2 | ||
| Rise Time | tr | 15 | ns | Vgs= -5V, Id= -1.5A, Vdd= -10V | 2 | ||
| Turn-Off Delay Time | td (off) | 55 | ns | Vgs= -5V, Id= -1.5A, Vdd= -10V | 2 | ||
| Fall Time | tf | 55 | ns | Vgs= -5V, Id= -1.5A, Vdd= -10V | 2 | ||
| Thermal Resistance (Channel-Ambience) | Rth (ch-a) | 62.5 | ℃/W | Implement on a ceramic PCB | 2 |
CAD (KiCad official)
- Symbol:
XP162A12A6PR-G - Footprint:
Package_TO_SOT_SMD:SOT-89-3 - 3D model: SOT-89 (KiCad packages3D, STEP)
- 3D model files:
xp162a12a6pr-g-etched.step/xp162a12a6pr-g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);xp162a12a6pr-g.step/xp162a12a6pr-g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Torex Semicon datasheet (6 pp, sha256
1babf2200d307bd6, retrieved 2026-10-31, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).