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XMC1302T016X0032ABXUMA1

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Infineon Technologies Infineon, TSSOP-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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XMC1302T016X0032ABXUMA1

Infineon Technologies · Infineon · TSSOP-16

XMC1302T016X0032ABXUMA1 from Infineon Technologies, in a TSSOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 P2.7/P2.8 input Shared pin carrying port functions P2.7 and P2.8, both standard input pads with analog input (STD_IN/AN) with ACMP1.INP/ACMP0.INN and VADC channel functions.
2 P2.9 input Port 2 pin 9, standard input pad with analog input (STD_IN/AN), with ACMP0.INP and VADC G0CH2/G1CH4 functions.
3 P2.10 bidirectional Port 2 pin 10, standard bi-directional pad with analog input (STD_INOUT/AN), with ERU, CCU4/CCU8, ACMP0.OUT, USIC and VADC functions.
4 P2.11 bidirectional Port 2 pin 11, standard bi-directional pad with analog input (STD_INOUT/AN), with ERU, CCU4/CCU8, USIC, ACMP.REF and VADC functions.
5 VSSP/VSS power_in Ground supply pin, also the ADC reference ground (VSSP and VSS are bonded to the same pin on TSSOP-16).
6 VDDP/VDD power_in Supply pin, also the ADC reference voltage and ORC reference voltage; when VDD is supplied, VDDP has to be supplied with the same voltage.
7 P0.0 bidirectional Port 0 pin 0, standard bi-directional pad (STD_INOUT) with ERU, CCU4/CCU8 and USIC functions.
8 P0.5 bidirectional Port 0 pin 5, standard bi-directional pad (STD_INOUT) with BCCU, CCU4/CCU8 and ACMP2.OUT functions.
9 P0.6 bidirectional Port 0 pin 6, standard bi-directional pad (STD_INOUT) with BCCU, CCU4/CCU8 and USIC functions.
10 P0.7 bidirectional Port 0 pin 7, standard bi-directional pad (STD_INOUT) with BCCU, CCU4/CCU8 and USIC functions.
11 P0.8 bidirectional Port 0 pin 8, standard bi-directional pad (STD_INOUT) with BCCU, CCU4/CCU8 and USIC functions.
12 P0.9 bidirectional Port 0 pin 9, standard bi-directional pad (STD_INOUT) with BCCU, CCU4/CCU8 and USIC functions.
13 P0.14 bidirectional Port 0 pin 14, standard bi-directional pad (STD_INOUT) with BCCU, CCU8, USIC and POSIF functions.
14 P0.15 bidirectional Port 0 pin 15, standard bi-directional pad (STD_INOUT) with BCCU, CCU8, USIC and POSIF functions.
15 P2.0 bidirectional Port 2 pin 0, standard bi-directional pad with analog input (STD_INOUT/AN), with ERU, CCU4/CCU8, USIC and VADC G0CH5 functions.
16 P2.6 input Port 2 pin 6, standard input pad with analog input (STD_IN/AN), with ACMP1.INN and VADC G0CH0 functions.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package TSSOP-16
Category Embedded Processors & Controllers
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Junction temperature TJ -40 115 °C 29
Storage temperature TST -40 125 °C 29
Voltage on power supply pin with respect to VSSP VDDP -0.3 6 V 29
Input current on any pin during overload condition IIN -10 10 mA 29
Absolute maximum sum of all input currents during overload condition ΣIIN -50 50 mA 29
Input current on any port pin during overload condition IOV -5 5 mA 30
Absolute sum of all input circuit currents during overload condition IOVS 25 mA 30
Ambient temperature, Temp. Range X TA -40 105 °C Temp. Range X 31
Digital supply voltage VDDP 1.8 5.5 V 31
MCLK frequency fMCLK 33.2 MHz CPU clock 31
PCLK frequency fPCLK 66.4 MHz Peripherals clock 31
Short circuit current of digital outputs ISC -5 5 mA 31
Absolute sum of short circuit currents of the device ΣISC_D 25 mA 31
Output low voltage on port pins (standard pads) VOLP 1 V IOL = 11 mA (5 V); IOL = 7 mA (3.3 V) 32
Output low voltage on port pins (standard pads) VOLP 0.4 V IOL = 5 mA (5 V); IOL = 3.5 mA (3.3 V) 32
Output low voltage on high current pads VOLP1 1 V IOL = 50 mA (5 V); IOL = 25 mA (3.3 V) 32
Output low voltage on high current pads VOLP1 0.32 V IOL= 10 mA (5 V) 32
Output low voltage on high current pads VOLP1 0.4 V IOL = 5 mA (3.3 V) 32
Rise time on high current pad tHCPR 9 ns 50 pF @ 5 V 32
Rise time on high current pad tHCPR 12 ns 50 pF @ 3.3 V 32
Rise time on high current pad tHCPR 25 ns 50 pF @ 1.8 V 32
Fall time on high current pad tHCPF 9 ns 50 pF @ 5 V 33
Fall time on high current pad tHCPF 12 ns 50 pF @ 3.3 V 33
Fall time on high current pad tHCPF 25 ns 50 pF @ 1.8 V 33
Rise time on standard pad tR 12 ns 50 pF @ 5 V 33
Rise time on standard pad tR 15 ns 50 pF @ 3.3 V 33
Rise time on standard pad tR 31 ns 50 pF @ 1.8 V 33
Fall time on standard pad tF 12 ns 50 pF @ 5 V 33
Fall time on standard pad tF 15 ns 50 pF @ 3.3 V 33
Fall time on standard pad tF 31 ns 50 pF @ 1.8 V 33
Pin capacitance (digital inputs/outputs) CIO 10 pF 33
Pull-up resistor on port pins RPUP 20 50 kohm VIN = VSSP 33
Pull-down resistor on port pins RPDP 20 50 kohm VIN = VDDP 33
Input leakage current IOZP -1 1 µA 0 < VIN < VDDP, TA ≤ 105°C 33
Voltage on any pin during VDDP power off VPO 0.3 V 33
Maximum current per pin (excluding P1, VDDP and VSS) IMP -10 11 mA 33
Maximum current per high current pins IMP1A -10 50 mA 33
Maximum current into VDDP (TSSOP16, VQFN24) IMVDD1 130 mA 33
Maximum current out of VSS (TSSOP16, VQFN24) IMVSS1 130 mA 34
Supply voltage range (internal reference) VDD_int 2 3 V SHSCFG.AREF = 11B, CALCTR.CALGNSTC = 0CH 34
Supply voltage range (external reference) VDD_ext 3 5.5 V SHSCFG.AREF = 00B 34
Active mode current, peripherals enabled IDDPAE 9.2 12 mA fMCLK/fPCLK 32/64 MHz, VDDP = 5 V 40
VDDP prewarning voltage VDDPPW 2.1 2.25 2.4 V ANAVDEL.VDEL_SELECT = 00B 45
VDDP brownout reset voltage VDDPBO 1.55 1.62 1.75 V calibrated, before user code starts running 45
Thermal resistance junction-ambient PG-TSSOP-16-8 RΘJA 104.6 K/W 4-layer JEDEC board (JESD 51-5); exposed pad soldered 56
DCO1 accuracy ΔfLT -3.9 4 % TA = -40°C to 105°C 46
ESD HBM VHBM 4000 V EIA/JESD22-A114-B 62

CAD (KiCad official)

  • Symbol: XMC1302T016X0032ABXUMA1
  • Footprint: Package_SO:TSSOP-16_4.4x5mm_P0.65mm
  • 3D model: TSSOP-16 (KiCad packages3D, STEP)
  • 3D model files: xmc1302t016x0032abxuma1-etched.step / xmc1302t016x0032abxuma1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xmc1302t016x0032abxuma1.step / xmc1302t016x0032abxuma1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (64 pp, sha256 f51a10e1bdb33fb0, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF