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Contents

README

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XL9713

XLSEMI · DC-DC Converters · TO-263-5L

XL9713 from XLSEMI, in a TO-263-5L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin.
2 FB input Feedback pin that senses the output voltage through an external resistor divider, with a 1.25V reference voltage (VOUT=1.25*(1+R2/R1)).
3 SW output Power switch output pin and the switching node of the output power stage.
4 VC passive Internal voltage regulator bypass capacitor pin; a 1uF capacitor must be connected between VIN and VC.
5 VIN power_in Power supply input pin supporting 5V to 72V DC; an electrolytic capacitor must be connected in parallel between VIN and GND to suppress noise.
6 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer XLSEMI
Package TO-263-5L
Category Power Management (PMIC)
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
反馈电压 Feedback voltage VFB 1.225 1.25 1.275 V VIN=12V, VOUT=5.0V, IOUT=0.5A, TA=25°C 4
工作电压 Operating voltage VIN 5 72 V TA=25°C, VIN=12V, VEN=0V 4
静态电流 Quiescent current IQ 3.5 5 mA VFB=2V 4
振荡频率 Oscillator frequency FOSC 102 120 138 KHz 4
效率 Efficiency η 89.7 % VIN=12V, VOUT=5.0V, IOUT=1.0A 4
效率 Efficiency η 94.7 % VIN=24V, VOUT=15V, IOUT=1.0A 4
开关电流限值 Switch current limit IL 2 A VFB=0V 4
高侧导通电阻 High-side on-resistance RDS(ON)H 270 mΩ 4
低侧导通电阻 Low-side on-resistance RDS(ON)L 255 mΩ 4
热关断温度 Thermal shutdown temperature TSD 140 ℃ 4
热关断迟滞 Thermal shutdown hysteresis TD 60 ℃ 4
最大占空比 Maximum duty cycle DMAX 90 % VFB=0V 4
输入电压 Input voltage VIN -0.3 80 V 3
使能引脚电压 Enable pin voltage VEN -0.3 7 V 3
反馈引脚电压 Feedback pin voltage VFB -0.3 7 V 3
输出开关引脚电压 Switch pin voltage VSW -0.3 V -0.3 to VIN 3
内部电压调节器旁路电容引脚 VC pin voltage VC -0.3 V -0.3 to VIN 3
操作结温 Operating junction temperature TJ -40 125 oC 3
贮存温度范围 Storage temperature TSTG -65 150 oC 3
引脚温度 Lead temperature TLEAD 260 oC 焊接10秒 3
ESD (HBM) 8000 V >8000 3
热阻 结到环境 Thermal resistance junction-to-ambient RJA 30 oC/W TO263-5L, 无外部散热片 3
推荐工作电压 Recommended operating voltage VIN 5 72 V 1

CAD (KiCad official)

  • Symbol: XL9713
  • Footprint: Package_TO_SOT_SMD:TO-263-5_TabPin6
  • 3D model: TO-263-5L (KiCad packages3D, STEP)
  • 3D model files: xl9713-etched.step / xl9713-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xl9713.step / xl9713.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XLSEMI datasheet (13 pp, sha256 1a6319ae094fa469, retrieved 2026-10-23, tier: manufacturer)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF