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Ray xl7056e1: specified limits as data (metadata.characteristics, 13 rows from the datasheet) ac959de

XL7056E1

XLSEMI · DC-DC Converters · TO-263-7

XL7056E1 from XLSEMI, in a TO-263-7. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin. Reference for all internal circuitry.
2 FB input Feedback pin. Senses the output voltage through an external resistor divider network for regulation. Internal reference voltage is 1.25 V.
3 CSN input Current sense negative input. Connects to the low side of the external current-sense resistor for over-current/limit detection.
4 SW output Switch node output pin from the internal high-side power MOSFET. Connects to the external inductor and freewheeling Schottky diode. Also tied to the metal tab of the TO263-7L package.
5 CSP input Current sense positive input. Connects to the high side of the external current-sense resistor for output current limiting.
6 VC passive Internal voltage regulator bypass pin. Requires a 1 uF bypass capacitor between VC and VIN.
7 VIN power_in Power supply input pin. Accepts 8 V to 80 V DC input. A bypass capacitor between VIN and GND is required for noise suppression.

Key specifications

Parameter Value
Manufacturer XLSEMI
Package TO-263-7
Category PMIC
Pins 7

Ordering variants

Same part, different packaging or reel option.

  • XL7056E1

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
反馈电压 VFB 1.225 1.25 1.275 V Vin =20V 至 80V, Vout=15V Iload=0.5A 5
输入电压 Vin 80 V 5
静态电源电流 Iq 2.1 5 mA VFB=2V 5
振荡频率 Fosc 75 100 135 KHz 5
输入引脚电压 VIN -0.3 100 V 4
反馈引脚电压 VFB -0.3 5 V 4
输出开关引脚电压 VSW -0.3 V 4
最大结温 TJ -40 150 ºC 4
操作结温 TJ -40 125 ºC 4
贮存温度范围 TSTG -65 150 ºC 4
引脚温度(焊接10秒) TLEAD 260 ºC 焊接10秒 4
ESD (人体模型) ESD 3000 V 4
热阻 (TO263-7L) RJA 30 ºC/W 结到环境,无外部散热片 4

CAD (KiCad official)

  • Symbol: XL7056E1
  • Footprint: Package_TO_SOT_SMD:TO-263-7_TabPin8
  • 3D model: TO-263-7 (KiCad packages3D, STEP)
  • 3D model files: xl7056e1-etched.step / xl7056e1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xl7056e1.step / xl7056e1.glb are the bare package body.

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
xl7056e1.step 238 KB You want the bare part, or you mark your own boards.
xl7056e1-etched.step 1.7 MB You want the part with XL7056E1 already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 487 faces against 179 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XLSEMI datasheet (11 pp, sha256 fa827ef1aee9b233, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF