Loads on click. Unloads only if this page sits in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads on click. Unloads only if this page sits in the background.

PCB Footprint

Open full view ↗
Loads on click. Unloads only if this page sits in the background.
Loads on click. Unloads only if this page sits in the background.
Download PDF
Contents

README

markdown

XL6013E1

XLSEMI · LED Drivers · SOIC-8

XL6013E1 from XLSEMI, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 EN input Enable pin. Drive low (<0.8 V) to shut the device down; drive high (>1.4 V) to turn it on. Floating defaults high. TTL-compatible.
2 VIN power_in Supply voltage input. Operates from 5 V to 40 V DC (absolute max 45 V). Bypass to GND with a suitably large capacitor (e.g. 100 uF/35 V) to eliminate input noise.
3 FB input Feedback pin. Regulates to a 0.22 V (typ) threshold voltage across the sense resistor to set LED current (I_LED = 0.22 V / R_CS).
4 NC unconnected Not connected. Leave floating or tie to GND.
5 SW output Power switch output. Drain of internal NMOS (Rdson ~110 mΩ), rated 60 V / 2 A with built-in OVP. Connect to the boost inductor / Schottky diode node. Pins 5 and 6 are tied together internally.
6 SW output Power switch output. Drain of internal NMOS (Rdson ~110 mΩ), rated 60 V / 2 A with built-in OVP. Connect to the boost inductor / Schottky diode node. Pins 5 and 6 are tied together internally.
7 GND power_in Ground return. Pins 7 and 8 are tied together internally and both must be connected to system ground for proper thermal and switching-current return.
8 GND power_in Ground return. Pins 7 and 8 are tied together internally and both must be connected to system ground for proper thermal and switching-current return.

Key specifications

Parameter Value
Manufacturer XLSEMI
Package SOIC-8
Category LED-drv
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • XL6013E1

CAD (KiCad official)

  • Symbol: XL6013E1
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: xl6013e1-etched.step / xl6013e1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xl6013e1.step / xl6013e1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XLSEMI datasheet (12 pp, sha256 a32de76219b0882d, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF