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XL6001E1

XLSEMI · LED Drivers · SOIC-8

XL6001E1 from XLSEMI, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 EN input Enable pin: drive EN low to turn the device off and high to turn it on, and it defaults high when floating.
2 VIN power_in Supply voltage input operating from 3.6V to 24V DC, which should be bypassed to GND with a suitably large capacitor to eliminate input noise.
3 FB input Feedback pin with a feedback threshold voltage of 0.22V.
4 NC unconnected No connection.
5 SW output Power switch output pin, the switch node that supplies power to the output.
6 SW output Power switch output pin, the switch node that supplies power to the output (second SW pin, bonded in parallel with pin 5).
7 GND power_in Ground pin.
8 GND power_in Ground pin (second GND pin, bonded in parallel with pin 7).

Key specifications

Parameter Value
Manufacturer XLSEMI
Package SOIC-8
Category LED Drivers
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Feedback Voltage VFB 209 220 231 mV Vin = 5V to 12V, Vout=24V, Iload=100mA 5
Input operation voltage Vin 3.6 24 V 5
Shutdown Supply Current ISTBY 70 100 uA VEN=0V 5
Quiescent Supply Current Iq 2.5 5 mA VEN =2V, VFB =Vin 5
Oscillator Frequency Fosc 320 400 480 Khz 5
Output Power NMOS Rdson 110 120 mohm Vin=12V, ISW=2A 5
EN Pin Threshold High (Regulator ON) VEN 1.4 V 5
EN Pin Threshold Low (Regulator OFF) VEN 0.8 V 5
EN Pin Input Leakage Current (ON) IH 3 10 uA VEN =2V (ON) 5
EN Pin Input Leakage Current (OFF) IL 3 10 uA VEN =0V (OFF) 5
Input Voltage Vin -0.3 26 V 4
Feedback Pin Voltage VFB -0.3 V 4
EN Pin Voltage VEN -0.3 V 4
Output Switch Pin Voltage VOutput -0.3 32 V 4
Thermal Resistance (SOP8), Junction to Ambient RJA 100 ºC/W No Heatsink, Free Air 4
Operating Junction Temperature TJ -40 125 ºC 4
Storage Temperature TSTG -65 150 ºC 4
Lead Temperature (Soldering) TLEAD 260 ºC Soldering, 10 sec 4
ESD (HBM) 2000 V HBM; printed as >2000 4

CAD (KiCad official)

  • Symbol: XL6001E1
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: xl6001e1-etched.step / xl6001e1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xl6001e1.step / xl6001e1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XLSEMI datasheet (9 pp, sha256 7ec9a6bcadd111b4, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF