component
XL385-2.5
Public Made by Adomby adom
XINLUDA Voltage Reference, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownXL385-2.5
XINLUDA · Voltage Reference · SOP-8
XL385-2.5 from XINLUDA, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No connect pin on the SOP-8 package. |
| 2 | NC | unconnected | No connect pin on the SOP-8 package. |
| 3 | NC | unconnected | No connect pin on the SOP-8 package. |
| 4 | - | passive | Negative (anode) terminal of the 2.5V micropower reference diode, which operates over 20 μA to 20 mA reverse current. |
| 5 | NC | unconnected | No connect pin on the SOP-8 package. |
| 6 | NC | unconnected | No connect pin on the SOP-8 package. |
| 7 | NC | unconnected | No connect pin on the SOP-8 package. |
| 8 | + | passive | Positive (cathode) terminal of the 2.5V micropower reference diode, which operates over 20 μA to 20 mA reverse current. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | XINLUDA |
| Package | SOP-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Breakdown Voltage (tested limit) | 2.48 | 2.5 | 2.52 | V | IR = 100 μA | 3 | |
| Reverse Breakdown Voltage (design limit) | 2.47 | 2.53 | V | IR = 100 μA | 3 | ||
| Minimum Operating Current (tested limit) | 12 | 18 | μA | 3 | |||
| Minimum Operating Current (design limit) | 20 | μA | 3 | ||||
| Reverse Breakdown Voltage Change with Current | 1 | 1.5 | mV | IMIN ≤ IR ≤ 1 mA | 3 | ||
| Reverse Breakdown Voltage Change with Current | 10 | 20 | mV | 1 mA ≤ IR ≤ 20 mA | 3 | ||
| Reverse Dynamic Impedance (tested limit) | 0.2 | 0.6 | Ω | IR = 100 μA, f = 20 Hz | 3 | ||
| Reverse Dynamic Impedance (design limit) | 1.5 | Ω | IR = 100 μA, f = 20 Hz | 3 | |||
| Average Temperature Coefficient (All others, no X/Y suffix) | 150 | ppm/°C | IMIN ≤ IR ≤ 20 mA | 3 | |||
| Reverse Current | 30 | mA | 2 | ||||
| Forward Current | 10 | mA | 2 | ||||
| Operating Temperature Range (XL385-2.5) | -40 | 85 | °C | 2 | |||
| Storage Temperature | -55 | 150 | °C | 2 | |||
| ESD Susceptibility | 2 | kV | Human body model, 100 pF through 1.5 kΩ | 2 | |||
| Maximum Junction Temperature for elevated temperature operation (XL385) | 100 | °C | Elevated temperature operation (footnote 2) | 2 | |||
| Soldering Temperature, SOP vapor phase | 215 | °C | 60 sec | 2 | |||
| Soldering Temperature, SOP infrared | 220 | °C | 15 sec | 2 | |||
| Thermal Resistance, Junction to Ambient (SOP-8) | θja | 165 | °C/W | Over operating free-air temperature range | 2 |
CAD (KiCad official)
- Symbol:
XL385-2.5 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
xl385-2-5-etched.step/xl385-2-5-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);xl385-2-5.step/xl385-2-5.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: XINLUDA datasheet (12 pp, sha256
de57b1e1a4a5153a, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).